Abstract:
A surface−treated glass cloth which, in a printed wiring board employing a matrix resin having a high modulus and a high glass transition temperature, heightens the adhesion of the resin to the glass cloth while maintaining the mechanical strength of the matrix resin and heightens the processability of the printed wiring board, such as suitability for through−hole formation, soldering, etc. The glass cloth is characterized by having been surface−treated with a surface−treating agent composition comprising as major components a silane coupling agent and one or more resins which each has at least one kind of functional groups selected among epoxy, phenol, and allyl groups and gives a cured resin having a glass transition temperature of 130°C or higher, the amount of the surface−treating agent composition adherent to the glass cloth being 0.10 to 1.00 wt.%, excluding 1.00 wt.%, on a solid basis based on the whole surface−treated glass cloth.
Abstract:
A method a forming a resin compatible fabric (210) includes: (A) forming a fabric with a plurality of fiber strands, wherein at least one of the plurality of fiber strands includes a plurality of fibers and at least one of the plurality of fibers includes an at least partial coating (214) having at least one starch material with at least one hydroxyl group; (B) breaking a bond between a hydrogen atom of a hydroxyl group of a first starch molecule of the at least one starch material with an oxygen atom of a second starch molecule of the at least one starch material to form at least one unreacted hydroxyl group on the first starch molecule; and (C) reacting at least one functional group of a second material with the at least one unreacted hydroxyl group of the at least one starch material to form a grafted starch material after interweaving.
Abstract:
An electrically conductive adhesive exhibiting sufficient impact strength to withstand a sudden impact when the surface mount components in an electronic package fall apart comprises (a) an epoxide-modified polyurethane, (b) a cross-linking agent such as an anhydride, (c) an adhesion promotor such as a silane, (d) a conductive filler and, optionally, one or more of (e) an epoxy resin, (f) a catalyst and (g) a diluent.
Abstract:
The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.
Abstract:
Epoxy laminates incorporate up to 20 wt.% talc particles, particularly pure Montana platy talc particles having a maximum particle size of about 40 mu m providing improved drilling performance, reduced dust formation, and improved Z-direction CTE, particularly when the epoxy resin has a Tg of about 150 DEG C or higher. The talc is selected from those which do not significantly reduce the electrical strength of the laminate relative to those which contain no talc particles. Characteristically, the talcs will have less than 5 wt.% impurities and less than 0.01 wt.% (100 wt.ppm) water extractable anions.
Abstract:
Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing.
Abstract:
The present invention relates to a method of manufacturing an electrically conductive or semiconductive structure on a substrate, electronic devices comprising a substrate and an electrically conductive or semiconductive structure, and uses thereof. The method of manufacturing an electrically conductive or semiconductive structure on a substrate comprises the steps of: applying electrically conductive or semiconductive particles on the substrate; applying at least one cross- linking compound having energetically activatable groups on the substrate; irradiating at least a part of the energetically activatable groups with an energy-carrying activation beam to thereby trigger at least a partial cross-linking of the at least one cross-linking compound so as to obtain an irradiated structure comprising at least partially cross- linked electrically conductive or semiconductive particles; supplying thermal energy for rearranging at least a part of the at least partially cross-linked electrically conductive or semiconductive particles to form a connected electrically conductive or semiconductive structure and for removing at least a part of the cross-linked compound from the substrate.
Abstract:
Le procédé de réalisation d'un trou (5) dans une couche (4) comporte la prévision de première et seconde zones d'adhérence (1a) et (1b) sur une surface d'un support (2). La première zone (1a) a des dimensions correspondant aux dimensions du trou (5). Le procédé comporte le dépôt de la couche (4) sur les première et seconde zones (1a) et (1b). Le matériau de la couche (4) présente un coefficient d'adhérence sur la première zone (1a) inférieur au coefficient d'adhérence sur la seconde zone (1b). La partie de la couche disposée au-dessus de la première zone (1a) est éliminée par un jet de fluide (6).