公开(公告)号：US20160368820A1

公开(公告)日：2016-12-22

申请号：US14824839

申请日：2015-08-12

Applicant: International Business Machines Corporation

Inventor： Sarah K. CZAPLEWSKI ,  Joseph KUCZYNSKI ,  Jason WERTZ ,  Jing ZHANG

IPC: C03C25/26 ,  C03C25/24 ,  C03C25/40 ,  D03D1/00 ,  D06M15/19 ,  D03D15/00 ,  D01F9/08 ,  C03B37/02 ,  C03C25/10

CPC classification number: B05D3/002 ,  B05D2203/35 ,  C01P2004/61 ,  C03B19/1065 ,  C03C25/1095 ,  C03C25/255 ,  C03C25/28 ,  C03C25/40 ,  C09C1/3072 ,  C09C1/3081 ,  C09C1/309 ,  D03D1/0082 ,  D03D15/0011 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/038 ,  H05K2201/0251 ,  H05K2201/029

Abstract: Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.

公开(公告)号：US20140342097A1

公开(公告)日：2014-11-20

申请号：US14227391

申请日：2014-03-27

Applicant: The United States Navy as represented by the Secretary of the Navy

Inventor： Nishkamraj Deshpande

IPC: H05K3/22

CPC classification number: H05K3/28 ,  H05K3/284 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2201/0769 ,  H05K2201/09872

Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.

Abstract translation: 本发明涉及将纳米纤维，纳米颗粒和/或纳米胶囊材料构成的保形涂层应用于一般的电子部件和特别是印刷电路板（PCB）上。 可将适形涂层材料（如Parlyne）与纳米材料结合以产生所需结果。 本发明的优点包括在诸如机械，电气，磁性的特性方面增强常规的保形涂层性能，特别是防止或阻碍锡晶须的生长或可能在PCB表面上发展的任何其它制造缺陷。

公开(公告)号：US20140080940A1

公开(公告)日：2014-03-20

申请号：US13732519

申请日：2013-01-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: C09D163/00

CPC classification number: C09D163/00 ,  C08G59/4021 ,  C08L63/00 ,  H01B3/185 ,  H01B3/40 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2203/178 ,  C08L1/02 ,  C08L77/00

Abstract: Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.

Abstract translation: 本发明公开了一种绝缘用树脂组合物，使用其制造的绝缘膜，预浸料坯和印刷电路板，所述树脂组合物包括：纤维素纳米颗粒或纤维素纳米纤维; 液晶低聚物或可溶性液晶可热硬化低聚物; 环氧树脂; 和无机填料，使得树脂组合物，绝缘膜和预浸料坯可以具有低热膨胀系数，高玻璃化转变温度和高刚性。

公开(公告)号：US08262933B2

公开(公告)日：2012-09-11

申请号：US12707188

申请日：2010-02-17

Applicant: Satoshi Sekimura ,  Hiroshi Harada

Inventor： Satoshi Sekimura ,  Hiroshi Harada

IPC: C09K19/06 ,  C08J3/20 ,  C08J5/04 ,  C08K3/34 ,  C08K7/10 ,  C08L101/12

CPC classification number: C08J3/203 ,  C08J5/043 ,  C08J2367/02 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0251

Abstract: The present invention provides a thermoplastic resin composition comprising a thermoplastic resin and aggregated particles of fibrous crystals. According to the thermoplastic resin composition, a molded articles which adequately reduce a defect in appearance can be obtained.

Abstract translation: 本发明提供一种热塑性树脂组合物，其包含热塑性树脂和纤维状晶体的凝集颗粒。 根据该热塑性树脂组合物，可以得到充分减少外观缺陷的成型品。

公开(公告)号：US08222750B2

公开(公告)日：2012-07-17

申请号：US12364435

申请日：2009-02-02

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US08124223B2

公开(公告)日：2012-02-28

申请号：US12848408

申请日：2010-08-02

Applicant: Kuppusamy Kanakarajan ,  Arnold Frances

Inventor： Kuppusamy Kanakarajan ,  Arnold Frances

IPC: C08G73/10 ,  B32B27/06

CPC classification number: C09J179/08 ,  C08L77/10 ,  C08L2205/16 ,  C08L2666/20 ,  H05K1/0373 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T428/1023 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T442/2361

Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

Abstract translation: 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“Tg”）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。本发明的聚酰亚胺基粘合剂也 基于聚酰亚胺基粘合剂的总重量，含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。

公开(公告)号：US20100227114A1

公开(公告)日：2010-09-09

申请号：US12086983

申请日：2006-08-10

Applicant: Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

Inventor： Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

IPC: B32B5/12 ,  B32B27/38 ,  C08L63/00 ,  C08L67/00 ,  H01F1/42

CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/40 ,  B32B2255/26 ,  B32B2262/02 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2307/208 ,  B32B2307/302 ,  B82Y10/00 ,  B82Y30/00 ,  C08K7/02 ,  C08K2201/011 ,  C09J11/00 ,  H01L23/373 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249942 ,  Y10T428/31515 ,  H01L2924/00

Abstract: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

Abstract translation: 公开了一种多层材料，其中至少两种组分经由粘合剂粘结而相互连接。 粘合剂粘合剂是由适合作为粘合剂的基质中含有纳米纤维材料的粘合剂或粘合层形成的。

公开(公告)号：US20090192241A1

公开(公告)日：2009-07-30

申请号：US12364435

申请日：2009-02-02

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: B32B3/24 ,  C08K3/38

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US20090042045A1

公开(公告)日：2009-02-12

申请号：US12085149

申请日：2006-11-16

Applicant: Tomohiko Takimoto ,  Takahiro Miura

Inventor： Tomohiko Takimoto ,  Takahiro Miura

IPC: B32B15/08 ,  C08K3/34 ,  B29C45/00 ,  C08K3/26

CPC classification number: C08L65/00 ,  B29C67/246 ,  B29K2023/083 ,  B29K2023/38 ,  B29K2105/16 ,  C08F287/00 ,  C08K3/26 ,  C08K7/10 ,  C08K2201/016 ,  C08L51/006 ,  C08L53/02 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T428/31692 ,  C08L2666/02 ,  C08L2666/04

Abstract: A norbornene-based resin molded article obtained by bulk polymerizing a norbornene-based monomer in a mold; wherein said norbornene-based resin molded article is characterized by comprising a hybrid filler obtained by high-speed mixing the two or more kinds of fillers in dry method. Preferably, said hybrid filler is obtained by high-speed mixing, at least a fibrous filler having 5 to 100 aspect ratio and a particulate filler having 1 to 2 aspect ratio, in dry method. The present invention provides the norbornene-based resin molded article superior in rigidity and dimensional stability; and the method of production thereof.

Abstract translation: 通过将降冰片烯系单体在模具中本体聚合而得到的降冰片烯系树脂成形体， 其中所述降冰片烯系树脂成型体的特征在于，包含通过干式高速混合所述两种或更多种填料得到的混合填料。 优选地，所述混合填料通过高速混合，至少具有5至100纵横比的纤维填料和具有1至2纵横比的颗粒填料以干法获得。 本发明提供刚性和尺寸稳定性优异的降冰片烯系树脂成型体， 及其生产方法。

公开(公告)号：US07455901B2

公开(公告)日：2008-11-25

申请号：US11333302

申请日：2006-01-18

Applicant: Hiroyuki Yano ,  Junji Sugiyama ,  Masaya Nogi ,  Shin-ichiro Iwamoto ,  Keishin Handa ,  Akira Nagai ,  Takao Miwa ,  Yoshitaka Takezawa ,  Toshiyuki Miyadera ,  Takashi Kurihara ,  Tohru Matsuura ,  Nobutatsu Koshoubu ,  Tohru Maruno

Inventor： Hiroyuki Yano ,  Junji Sugiyama ,  Masaya Nogi ,  Shin-ichiro Iwamoto ,  Keishin Handa ,  Akira Nagai ,  Takao Miwa ,  Yoshitaka Takezawa ,  Toshiyuki Miyadera ,  Takashi Kurihara ,  Tohru Matsuura ,  Nobutatsu Koshoubu ,  Tohru Maruno

IPC: D04H1/00

CPC classification number: G02B6/122 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/04 ,  C08L101/00 ,  G02B6/10 ,  G02B6/4214 ,  G02B2006/12104 ,  G02B2006/12107 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/0251 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T428/24994 ,  Y10T428/2965 ,  Y10T428/31518 ,  Y10T428/31525 ,  C08L2666/26

Abstract: There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 μm. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L≧4.5 μm is 30% or less of the total analyzed length. A transparent multilayered sheet, a circuit board, and an optical waveguide are provided which use a transparent substrate formed from this fiber-reinforced composite material.

Abstract translation: 提供了含有平均纤维直径为4〜200nm的纤维和基体材料的纤维增强复合材料，复合材料在波长400〜700nm具有60％以上的可见光透射率，这是 基于50um的厚度的转换值。 提供了由基质材料和浸渍纤维集合体的纤维增强复合材料，其中当通过统计分析获得对应于纤维聚集体的孔区域的亮区域的段长度由L表示时 由通过二次化纤维聚集体的扫描电子显微镜图像获得的二值图像形成的单向游程长度图像，满足L> =4.5μm的片段的总长度为总分析长度的30％以下。 提供一种使用由该纤维增强复合材料形成的透明基板的透明多层片材，电路板和光波导。