INSULATING SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
    112.
    发明申请
    INSULATING SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板和印刷电路板绝缘基板

    公开(公告)号:US20150107886A1

    公开(公告)日:2015-04-23

    申请号:US14509249

    申请日:2014-10-08

    Abstract: Disclosed herein are an insulating substrate for a printed circuit board and a printed circuit board, and more particularly, an insulating substrate for a printed circuit board and a printed circuit board capable of improving fill plating property of an inner via hole.The insulating substrate for a printed circuit board includes: an electrical insulating resin; and a plurality of reinforcement materials formed in the electrical insulating resin, wherein the plurality of reinforcement materials are configured so that one or more reinforcement materials are formed to be symmetrical with each other at each of the upper and lower portions based on a central reinforcement material formed at a central portion in the electrical insulating resin, and a thickness of the central reinforcement material is thicker than those of the remaining other reinforcement materials.

    Abstract translation: 本发明公开了一种用于印刷电路板和印刷电路板的绝缘基板,更具体地,涉及一种能够改善内部通孔的填充电镀性能的印刷电路板用绝缘基板和印刷电路板。 印刷电路板用绝缘基板包括:电绝缘树脂; 以及形成在所述电绝缘树脂中的多个增强材料,其中,所述多个增强材料构造成使得一个或多个增强材料形成为在所述上部和下部中的每一个上基于中心增强材料彼此对称 形成在电绝缘树脂的中心部分,并且中心增强材料的厚度比剩余的其它增强材料的厚度厚。

    Multi layer circuit board and manufacturing method of the same
    113.
    发明授权
    Multi layer circuit board and manufacturing method of the same 有权
    多层电路板及其制造方法相同

    公开(公告)号:US08802997B2

    公开(公告)日:2014-08-12

    申请号:US13063631

    申请日:2008-12-18

    Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.

    Abstract translation: 公开了具有多层重铜的PCB。 具有非织造玻璃网状基材的预浸料单独使用或与具有玻璃织物基材的另一种预浸料一起使用,使得可以有效地填充与厚膜相当的重铜之间的空间而不产生空隙。 PCB包括在芯基板的一个表面或两个表面上图案化的第一铜的覆铜层压板; 层叠在覆铜层压板的一个表面或两个表面上的至少一个第一预浸料,用作第一预浸料的基材的非织造玻璃纤维网; 在所述第一预浸料的一个表面或两个表面上层叠的至少一个第二预浸料,用作所述第二预浸料的基材的玻璃织物; 和第二铜层压在第二预浸料的一个表面或两个表面上。

    ELECTROSTATIC DISSIPATIVE COMPOSITES
    114.
    发明申请
    ELECTROSTATIC DISSIPATIVE COMPOSITES 有权
    静电复合材料

    公开(公告)号:US20130153832A1

    公开(公告)日:2013-06-20

    申请号:US13328468

    申请日:2011-12-16

    Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.

    Abstract translation: 本公开涉及热塑性静电耗散(ESD)复合材料。 所公开的复合材料包括分散在热塑性树脂相内的热塑性树脂相和多个中等模量的碳纤维。 本文还公开了用于制造和/或使用所公开的ESD复合材料以及由这种复合材料形成的制品的方法。

    Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
    116.
    发明申请
    Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board 失效
    制造绝缘片,覆铜层压板和印刷电路板

    公开(公告)号:US20090255714A1

    公开(公告)日:2009-10-15

    申请号:US12232894

    申请日:2008-09-25

    Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

    Abstract translation: 公开了一种绝缘片的制造方法,覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括:形成热塑性增强材料,其包括由热塑性聚合物粘合剂固定的纤维,并且其中形成有孔; 形成热塑性树脂层,使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片,其具有低吸湿率和极好的电性能,包括低介电常数(Dk)和低介电损耗(Df),并且其中纤维可以容易地浸渍 树脂。

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