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111.发明申请公开(公告)号：US20160243577A1
公开(公告)日：2016-08-25
申请号：US15146006
申请日：2016-05-04
Applicant: STORA ENSO OYJ
Inventor： Petri SIRVIÖ , Juha MAIJALA
CPC classification number: B05C1/003 , B05C19/008 , B05D1/007 , B05D1/28 , B05D3/0263 , B05D3/029 , B05D3/06 , B05D3/12 , C23C26/02 , H05K1/038 , H05K1/0386 , H05K3/102 , H05K3/1241 , H05K3/1266 , H05K3/1283 , H05K2201/0293 , H05K2203/0126 , H05K2203/0517 , H05K2203/0522 , H05K2203/102 , H05K2203/1105 , H05K2203/1476 , H05K2203/1545 , H05K2203/1581
Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.
Abstract translation: 公开了用于在表面上产生导电图案的方法和装置。 将导电固体颗粒转移到基板表面上的预定形式的区域上。 将导电固体颗粒加热到高于导电固体颗粒的特征熔点的温度，从而产生熔体。 熔融物在辊隙中被压靠在基底上，其中一部分辊隙对熔体的表面温度低于所述特征熔点。
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112.发明申请公开(公告)号：US20150107886A1
公开(公告)日：2015-04-23
申请号：US14509249
申请日：2014-10-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Hwan KIM , Jung Hoon Jang
CPC classification number: H05K1/0366 , H05K2201/029 , H05K2201/0293 , Y10T428/24942
Abstract: Disclosed herein are an insulating substrate for a printed circuit board and a printed circuit board, and more particularly, an insulating substrate for a printed circuit board and a printed circuit board capable of improving fill plating property of an inner via hole.The insulating substrate for a printed circuit board includes: an electrical insulating resin; and a plurality of reinforcement materials formed in the electrical insulating resin, wherein the plurality of reinforcement materials are configured so that one or more reinforcement materials are formed to be symmetrical with each other at each of the upper and lower portions based on a central reinforcement material formed at a central portion in the electrical insulating resin, and a thickness of the central reinforcement material is thicker than those of the remaining other reinforcement materials.
Abstract translation: 本发明公开了一种用于印刷电路板和印刷电路板的绝缘基板，更具体地，涉及一种能够改善内部通孔的填充电镀性能的印刷电路板用绝缘基板和印刷电路板。 印刷电路板用绝缘基板包括：电绝缘树脂; 以及形成在所述电绝缘树脂中的多个增强材料，其中，所述多个增强材料构造成使得一个或多个增强材料形成为在所述上部和下部中的每一个上基于中心增强材料彼此对称 形成在电绝缘树脂的中心部分，并且中心增强材料的厚度比剩余的其它增强材料的厚度厚。
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公开(公告)号：US08802997B2
公开(公告)日：2014-08-12
申请号：US13063631
申请日：2008-12-18
Applicant: Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
Inventor： Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
IPC: H05K1/03
CPC classification number: H05K3/4655 , H05K1/0263 , H05K3/4652 , H05K2201/0195 , H05K2201/0293 , Y10T428/24479 , Y10T428/24917 , Y10T442/3431
Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.
Abstract translation: 公开了具有多层重铜的PCB。 具有非织造玻璃网状基材的预浸料单独使用或与具有玻璃织物基材的另一种预浸料一起使用，使得可以有效地填充与厚膜相当的重铜之间的空间而不产生空隙。 PCB包括在芯基板的一个表面或两个表面上图案化的第一铜的覆铜层压板; 层叠在覆铜层压板的一个表面或两个表面上的至少一个第一预浸料，用作第一预浸料的基材的非织造玻璃纤维网; 在所述第一预浸料的一个表面或两个表面上层叠的至少一个第二预浸料，用作所述第二预浸料的基材的玻璃织物; 和第二铜层压在第二预浸料的一个表面或两个表面上。
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公开(公告)号：US20130153832A1
公开(公告)日：2013-06-20
申请号：US13328468
申请日：2011-12-16
Applicant: Mohammad Moniruzzaman
Inventor： Mohammad Moniruzzaman
CPC classification number: H05K1/0366 , H01B1/24 , H01L23/295 , H01L2924/0002 , H05K1/0259 , H05K9/0079 , H05K2201/0154 , H05K2201/0293 , H01L2924/00
Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.
Abstract translation: 本公开涉及热塑性静电耗散（ESD）复合材料。 所公开的复合材料包括分散在热塑性树脂相内的热塑性树脂相和多个中等模量的碳纤维。 本文还公开了用于制造和/或使用所公开的ESD复合材料以及由这种复合材料形成的制品的方法。
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公开(公告)号：US07910202B2
公开(公告)日：2011-03-22
申请号：US12398762
申请日：2009-03-05
Applicant: Mark D. Holte
Inventor： Mark D. Holte
IPC: B32B5/16
CPC classification number: H05K1/0373 , B32B5/28 , H05K1/036 , H05K1/0366 , H05K2201/0209 , H05K2201/0212 , H05K2201/0284 , H05K2201/0293 , Y10T428/252 , Y10T428/254 , Y10T428/2998 , Y10T428/31703
Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
Abstract translation: 环氧层压板，例如 CEM-1层压体包括聚合物颗粒，特别是具有约0.05至30μm的平均直径的核 - 壳颗粒，其减少印刷电路板制造期间产生的粉尘。
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Patent Agency Ranking
116.发明申请公开(公告)号：US20090255714A1
公开(公告)日：2009-10-15
申请号：US12232894
申请日：2008-09-25
Applicant: Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
Inventor： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
CPC classification number: H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.
Abstract translation: 公开了一种绝缘片的制造方法，覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括：形成热塑性增强材料，其包括由热塑性聚合物粘合剂固定的纤维，并且其中形成有孔; 形成热塑性树脂层，使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片，其具有低吸湿率和极好的电性能，包括低介电常数（Dk）和低介电损耗（Df），并且其中纤维可以容易地浸渍 树脂。
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117.发明申请PRINTED WIRING BOARD WITH REINFORCED INSULATION LAYER AND MANUFACTURING METHOD THEREOF 有权具有加强绝缘层的印刷线路板及其制造方法公开(公告)号：US20090229868A1
公开(公告)日：2009-09-17
申请号：US12360181
申请日：2009-01-27
Applicant: KIYOTAKA TSUKADA , Takamichi Sugiura
Inventor： KIYOTAKA TSUKADA , Takamichi Sugiura
CPC classification number: H05K3/4661 , H05K1/0366 , H05K3/381 , H05K3/4602 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/0293 , H05K2201/096
Abstract: A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.
Abstract translation: 通过设置具有绝缘基板和形成在绝缘基板上的导电电路的芯基板的方法制造印刷布线板。 在芯基板上形成内绝缘层，处理内绝缘层的表面以在表面上形成粗糙部分。 在具有粗糙部分的内绝缘层的表面上形成包括增强材料的外绝缘层。
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118.发明授权Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component 失效图案化多孔成型体或无纺布的制造方法以及电路部件公开(公告)号：US07586047B2
公开(公告)日：2009-09-08
申请号：US10586341
申请日：2005-01-13
Applicant: Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
Inventor： Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
CPC classification number: B24C3/322 , B24C1/04 , B24C11/00 , C23C18/1605 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K3/107 , H05K3/182 , H05K3/184 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0293 , H05K2201/09036 , H05K2201/09118 , H05K2203/025 , H05K2203/0565 , Y10T428/24479 , Y10T428/24496 , Y10T428/24612 , Y10T428/249953 , Y10T428/249987 , Y10T442/674
Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions.With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
Abstract translation: 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。
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公开(公告)号：US07507471B1
公开(公告)日：2009-03-24
申请号：US08540429
申请日：1995-10-10
Applicant: Mark D. Holte
Inventor： Mark D. Holte
IPC: B32B5/16
CPC classification number: H05K1/0373 , B32B5/28 , H05K1/036 , H05K1/0366 , H05K2201/0209 , H05K2201/0212 , H05K2201/0284 , H05K2201/0293 , Y10T428/252 , Y10T428/254 , Y10T428/2998 , Y10T428/31703
Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
Abstract translation: 环氧层压板，例如 CEM-1层压体包括聚合物颗粒，特别是具有约0.05至30μm的平均直径的核 - 壳颗粒，其减少印刷电路板制造期间产生的粉尘。
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公开(公告)号：US07459044B2
公开(公告)日：2008-12-02
申请号：US11050264
申请日：2005-02-03
Applicant: Subhotosh Khan , Michael Robert Samuels , Mikhail R. Levit
Inventor： Subhotosh Khan , Michael Robert Samuels , Mikhail R. Levit
CPC classification number: H05K1/0366 , B32B5/022 , B32B5/145 , B32B5/26 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/0269 , B32B2262/101 , B32B2264/0221 , B32B2307/306 , B32B2307/308 , B32B2307/54 , B32B2307/718 , B32B2307/7265 , B32B2457/08 , D21H27/30 , H05K1/036 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0251 , H05K2201/0278 , H05K2201/0293 , Y10T428/24942 , Y10T442/2066 , Y10T442/2484 , Y10T442/2861
Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
Abstract translation: 包含热塑性聚合物（TP）和短的高拉伸模量纤维的片材，其中片材中部的TP浓度高于片材表面的TP浓度，可用于制备具有热固性树脂的预浸料。
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