公开(公告)号：US20020093401A1

公开(公告)日：2002-07-18

申请号：US10068707

申请日：2002-02-06

Inventor： Luna H. Chiu ,  Yongfei Zhu ,  Xubai Zhang ,  Steven C. Stowell ,  Andrey Kozyrev ,  Somnath Sengupta ,  Louise Sengupta

IPC: H01P007/06

CPC classification number: H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

公开(公告)号：WO2013152196A1

公开(公告)日：2013-10-10

申请号：PCT/US2013/035281

申请日：2013-04-04

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  TEXAS INSTRUMENTS JAPAN LI ITED

Inventor： HERBSOMMER, Juan, A. ,  PAYNE, Robert, F. ,  CORSI, Marco ,  HAROUN, Baher, S. ,  ALI, Hassan

IPC: G02B6/06 ,  G02B6/02

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/43 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01P3/16 ,  H01P5/107 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0274 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2201/10098

Abstract: An apparatus is provided. There is a circuit assembly (206-A1) with a package substrate (304-A) and an integrated circuit (IC) (302-A). The package substrate has a microstrip line (208-A1), and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board (202-A) is also secured to the package substrate. A dielectric waveguide (204- A) is secured to the circuit board. The dielectric waveguide has a dielectric core (310-A) that extends into a transition region (314- A) located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract translation: 提供了一种装置。 存在具有封装衬底（304-A）和集成电路（IC）（302-A）的电路组件（206-A1）。 封装衬底具有微带线（208-A1），并且IC被固定到封装衬底并且电耦合到微带线。 电路板（202-A）也固定到封装衬底。 电介质波导（204-A）固定到电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域（314-A）中的介质芯（310-A），并且微带线被配置为与介质波导形成通信链路。

公开(公告)号：WO2013123667A1

公开(公告)日：2013-08-29

申请号：PCT/CN2012/071558

申请日：2012-02-24

Applicant: 中国科学院微电子研究所 ,  吉多蒂•丹尼尔 ,  王启东 ,  林福江 ,  朱光

Inventor： 吉多蒂•丹尼尔 ,  王启东 ,  林福江 ,  朱光

IPC: H01P3/10

CPC classification number: H04B10/2503 ,  H04B10/12 ,  H04B10/90 ,  H05K1/0218 ,  H05K1/0239 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/10098

Abstract: 本发明提供了一种毫米波波导通信系统。该毫米波波导通信系统包括：时钟组件、至少两组毫米波收/发通道，其中：时钟组件，用于为所述至少两组毫米波收/发通道的发送端和接收端分别提供时钟信号；每一组毫米波收/发通道包括：发射器组件、接收端组件和传输波导。其中，该传输波导，位于发射器组件和接收器组件之间，用于提供毫米波传输的通道，该传输波导的顶面、侧面和/或底面上除有源器件及其附件以外的区域镀有金属导电壁，以形成与相邻毫米波收/发通道中传输波导的电磁屏蔽。该层金属导电壁可以在高速通信时可以把通道间的串扰最小化，从而提高了毫米波通信系统的数据带宽和数据吞吐量。

公开(公告)号：WO2011069247A1

公开(公告)日：2011-06-16

申请号：PCT/CA2010/001933

申请日：2010-12-09

Applicant: RESEARCH IN MOTION LIMITED ,  WONG, Joshua, Kwan, Ho ,  MAN, Ying, Tong ,  QI, Yihong ,  JARMUSZEWSKI, Perry ,  CHAN, Antonio

Inventor： WONG, Joshua, Kwan, Ho ,  MAN, Ying, Tong ,  QI, Yihong ,  JARMUSZEWSKI, Perry ,  CHAN, Antonio

IPC: H01P3/14 ,  H01B7/08 ,  G06F15/02 ,  H04W88/02

CPC classification number: H05K1/0219 ,  H01P3/085 ,  H01P3/121 ,  H05K1/0224 ,  H05K1/0393 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10356

Abstract: A flexible cable for carrying RF signals and method of manufacturing same. The cable includes an elongate base substrate including a dielectric layer with an upper metal layer deposited on one side and a lower metal layer deposited on its other side. It further includes two parallel spaced-apart series of vias formed along the length of the base substrate, each via electrically interconnecting the upper metal layer and the lower metal layer, whereby a rectangular cross- sectional waveguide is provided between the upper metal layer, the lower metal layer and the two series of vias.

Abstract translation: 用于承载RF信号的柔性电缆及其制造方法。 该电缆包括细长的基底基底，该基底基底包括在一侧沉积有上金属层的介电层和沉积在另一侧上的下金属层。 它还包括沿着基底衬底的长度形成的两个平行间隔开的​​一系列通孔，每个通孔电连接上金属层和下金属层，由此在上金属层， 下层金属层和两系列通孔。

公开(公告)号：WO2008026743A1

公开(公告)日：2008-03-06

申请号：PCT/JP2007/067075

申请日：2007-08-31

Applicant: 加川 清二

Inventor： 加川 清二

IPC: H01P3/08 ,  H01B5/14 ,  H01P1/20 ,  H01P3/04 ,  H01P3/06 ,  H01P3/12

CPC classification number: H01P3/06 ,  H01P3/023 ,  H01P3/026 ,  H01P3/08 ,  H01P3/122 ,  H05K1/0242 ,  H05K1/09 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/037

Abstract: 　本発明は、高周波伝送率の周波数依存性を有する導電膜、及びかかる導電膜を有する高周波伝送線路並びに高周波フィルタを提供することを目的とする。 本発明は、プラスチックフィルム10 の少なくとも一面に電気抵抗が異なる第一及び第二の金属薄膜11a，11bを有し、第一及び第二の金属薄膜11a，11bの境界が、金属組成比が厚さ方向に変化する傾斜組成層12'を有する傾斜接合導電膜である。

Abstract translation: 可以提供具有高频率频率的频率依赖性的导电膜和具有这种导电膜的高频线和高频滤波器。 具有不同电阻的第一和第二金属薄膜（11a，11b）被布置在塑料薄膜（10）的至少一个表面上，并且第一和第二金属薄膜（11a，11b）之间的边界是 具有梯度组成层（12'）的梯度键合导电膜，其中金属组成比在厚度方向上变化。

公开(公告)号：WO2007149046A1

公开(公告)日：2007-12-27

申请号：PCT/SG2006/000166

申请日：2006-06-22

Applicant: MEDS TECHNOLOGIES PTE LTD ,  MA, Kaixue ,  CHAN, Kien Teck

Inventor： MA, Kaixue ,  CHAN, Kien Teck

IPC: H01P1/20 ,  H01L23/58 ,  H01Q13/10

CPC classification number: H01P3/087 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01P1/2039 ,  H01P3/12 ,  H01P5/107 ,  H01Q9/0414 ,  H05K1/024 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/037 ,  H01L2924/00014

Abstract: A quasi-planar circuit comprising a plurality of boards, each of the plurality of boards comprising a substrate; at least one of the plurality of boards having at least one air cavity formed in the substrate; at least one of the plurality of boards having at least one metal layer including at least one patterned metal portion, the at least one patterned metal portion being over the at least one air cavity; wherein the at least one patterned metal portion and the at least one air cavity are for controlling at least a part of an electromagentic field distribution in the region of the at least one patterned metal portion and the air cavity.

Abstract translation: 一种包括多个板的准平面电路，所述多个板中的每一个包括衬底; 所述多个板中的至少一个具有形成在所述基板中的至少一个空气腔; 所述多个板中的至少一个具有包括至少一个图案化金属部分的至少一个金属层，所述至少一个图案化金属部分在所述至少一个空气腔的上方; 其中所述至少一个图案化金属部分和所述至少一个空气腔用于控制所述至少一个图案化金属部分和所述空气腔区域中的电磁场分布的至少一部分。

公开(公告)号：WO2007078924A2

公开(公告)日：2007-07-12

申请号：PCT/US2006048294

申请日：2006-12-18

Applicant: INTEL CORP ,  BRIST GARY A ,  HORINE BRYCE D ,  HALL STEPHEN H

Inventor： BRIST GARY A ,  HORINE BRYCE D ,  HALL STEPHEN H

IPC: H01P11/00 ,  H05K1/02

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981 ,  Y10T29/49124

Abstract: In some embodiments a printed circuit board is fabricated using printed circuit board material, and a waveguide is formed that is contained within the printed circuit board material. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，使用印刷电路板材料制造印刷电路板，并且形成包含在印刷电路板材料内的波导。 描述和要求保护其他实施例。

公开(公告)号：US20240030575A1

公开(公告)日：2024-01-25

申请号：US18478858

申请日：2023-09-29

Applicant: ALLEN-VANGUARD CORPORATION

Inventor： Sulav ADHIKARI ,  Ernst WALLISCH, JR.

IPC: H01P1/213 ,  H01P1/207 ,  H01P3/12 ,  H04W88/08 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P1/208 ,  H01P11/00

CPC classification number: H01P1/2138 ,  H01P1/207 ,  H01P3/121 ,  H04W88/08 ,  H05K1/115 ,  H05K1/18 ,  H05K3/3494 ,  H01P1/2088 ,  H01P11/007 ,  H05K2201/09985 ,  H05K2201/015 ,  H05K2201/037 ,  H05K2201/09609

Abstract: System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

公开(公告)号：US10038232B2

公开(公告)日：2018-07-31

申请号：US15222119

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/02 ,  H01P3/12 ,  H01P3/08 ,  H01P5/08 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01P3/16 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20160276727A1

公开(公告)日：2016-09-22

申请号：US14662610

申请日：2015-03-19

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract translation: 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线到波导转换耦合到集成波导。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。