公开(公告)号：US20180310440A1

公开(公告)日：2018-10-25

申请号：US15769548

申请日：2016-10-20

Applicant: THOMSON Licensing

Inventor： Mickey Jay HUNT ,  Randy Wayne CRAIG ,  Theodore Paul CORBIN ,  William John TESTIN ,  William Philip DERNIER

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/006 ,  H05K1/0216 ,  H05K9/0033 ,  H05K2201/0707 ,  H05K2201/09854 ,  H05K2201/10371 ,  H05K2201/2072

Abstract: The present disclosure relates to a printed circuit board assembly including a printed circuit board, a first shielding structure located on a first surface of the printed circuit board and having a first extension element extending from the first shielding structure and through a first hole in the printed circuit board, a second shielding structure located on a second surface of the printed circuit board. According to at least one embodiment on the present disclosure, a first contacting element of the first extension element makes a mechanical and electrical contact between the first shielding structure and the second shielding structure in a contact region entirely located outside the first hole from which the first extension element is extending through.

公开(公告)号：US09961761B2

公开(公告)日：2018-05-01

申请号：US15091667

申请日：2016-04-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Katsuya Yachi

IPC: H01J31/49 ,  H05K1/02 ,  H05K1/14 ,  A61B6/00

CPC classification number: H05K1/0216 ,  A61B6/4266 ,  A61B6/5258 ,  H05K1/141 ,  H05K2201/0707 ,  H05K2201/10151 ,  H05K2201/10606

Abstract: A radiation imaging apparatus, comprising a sensor panel in which a plurality of sensors configured to detect radiation are arrayed, a first circuit board that is arranged on the sensor panel and includes a circuit configured to read out a signal from each sensor, and a second circuit board that is arranged on the first circuit board and includes a circuit configured to read out a signal from each sensor, and whose radiant noise generation amount at a driving time of the circuit is larger than a radiant noise generation amount at a driving time of the circuit of the first circuit board, wherein the first circuit board is arranged between the sensor panel and the second circuit board.

公开(公告)号：US20180110164A1

公开(公告)日：2018-04-19

申请号：US15783330

申请日：2017-10-13

Applicant: IBIDEN CO., LTD

Inventor： Toshiki FURUTANI ,  Takema Adachi ,  Hidetoshi Noguchi ,  Shota Tachibana

IPC: H05K9/00 ,  H05K13/00

CPC classification number: H05K9/0086 ,  H05K9/003 ,  H05K9/0084 ,  H05K9/0088 ,  H05K13/0084 ,  H05K2201/0338 ,  H05K2201/0707

Abstract: A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

公开(公告)号：US20180092210A1

公开(公告)日：2018-03-29

申请号：US15274302

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Albert Wang ,  Paul A. Martinez

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/28 ,  H05K3/36 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K1/145 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/284 ,  H05K3/303 ,  H05K3/341 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4614 ,  H05K2201/042 ,  H05K2201/0707 ,  H05K2201/09118 ,  H05K2201/10522 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

公开(公告)号：US20180070464A1

公开(公告)日：2018-03-08

申请号：US15812905

申请日：2017-11-14

Applicant: Apple Inc.

Inventor： Matthew Dean ROHRBACH

IPC: H05K5/02 ,  H05K9/00 ,  F16M11/04 ,  F16M11/22 ,  B60R11/02 ,  H05K1/02 ,  H01F7/02 ,  G06F1/16 ,  F16M13/02 ,  F16M13/00 ,  F16M11/24 ,  H04M1/04 ,  B60R11/00

CPC classification number: H05K5/0204 ,  B60R11/0252 ,  B60R2011/0028 ,  F16M11/041 ,  F16M11/22 ,  F16M11/242 ,  F16M13/00 ,  F16M13/022 ,  G06F1/1633 ,  H01F7/0252 ,  H04B1/3877 ,  H04M1/04 ,  H05K1/0216 ,  H05K1/0298 ,  H05K9/002 ,  H05K2201/0707

Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.

公开(公告)号：US09814166B2

公开(公告)日：2017-11-07

申请号：US13955149

申请日：2013-07-31

Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI) CO., LTD.

Inventor： Jen-Chun Chen ,  Tsung-Jung Cheng ,  Chia-Cheng Liu

IPC: H01L21/56 ,  H05K9/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L27/146 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K9/0024 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/02 ,  H01L27/14618 ,  H01L2924/0002 ,  H05K1/0224 ,  H05K3/288 ,  H05K2201/0707 ,  H05K2201/1056 ,  H05K2203/0191 ,  H05K2203/107 ,  H05K2203/1105 ,  H01L2924/00

Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

公开(公告)号：US20170202100A1

公开(公告)日：2017-07-13

申请号：US15284690

申请日：2016-10-04

Applicant: PEGATRON CORPORATION

Inventor： YAO-ZHENG LIN ,  YU-CHUN CHANG

IPC: H05K7/14 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K7/1439 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/141 ,  H05K9/0015 ,  H05K9/006 ,  H05K2201/0707 ,  H05K2201/10386

Abstract: A circuit board assembly includes a main board, a daughter board, a metal bracket, and a conductive gasket. The daughter board includes a circuit board and an electronic module with a plurality of pins connected to the circuit board. The metal bracket clamps at one side of the circuit board and the electronic module to shield the plurality of pins. The metal bracket has a connection part connecting the main board. The conductive gasket is disposed between the metal bracket and the plurality of pins.

公开(公告)号：US20170118833A1

公开(公告)日：2017-04-27

申请号：US15398803

申请日：2017-01-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Dek Gin YANG ,  Dong Gi AN ,  Jae Ho SHIN

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/38 ,  H05K1/09

CPC classification number: H05K3/06 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0707 ,  H05K2203/0554 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

公开(公告)号：US20170110229A1

公开(公告)日：2017-04-20

申请号：US14885953

申请日：2015-10-16

Applicant: Keyssa Licensing, Inc.

Inventor： Stephen Robert Venuti ,  Steve Novak

IPC: H01F7/02 ,  H05K1/18

CPC classification number: H01F7/0242 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0707 ,  H05K2201/10098 ,  H05K2203/104 ,  H05K2203/166 ,  Y02P70/611

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

公开(公告)号：US20170093456A1

公开(公告)日：2017-03-30

申请号：US15276179

申请日：2016-09-26

Applicant: Electrochem Solutions, Inc.

Inventor： Gregory G. Decker ,  Brian R. Peterson ,  Eric Jankins

IPC: H04B1/40 ,  H05K1/11 ,  H05K1/02 ,  H02J50/10 ,  H02M7/155

CPC classification number: H04B1/40 ,  H02J7/0029 ,  H02J7/025 ,  H02J50/10 ,  H02J50/12 ,  H02J50/80 ,  H02J2007/0037 ,  H02J2007/004 ,  H02M7/155 ,  H04B5/0031 ,  H04B5/0037 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/0707 ,  H05K2201/09609

Abstract: A system for harnessing and conditioning wirelessly transmitted electrical energy by near field magnetic induction configured with various magnetic field shielding embodiments is disclosed. The shielding embodiments are designed to minimize electromagnetic interference and induced electrical current. The system comprises an electrical energy capture circuit and an RF communication circuit. The electrical energy capture circuit conditions and modifies the wirelessly received electrical energy. The RF communication circuit enables the system to wirelessly communicate with its sub-circuits and other energy capture systems. The system comprises a tunable band stop filter that is electrically connected to the RF communication sub-circuit. In addition, the RF communication sub-circuit is configured with opposing electrically conductive plates that isolate and shield the circuit from an oscillating magnetic field.