公开(公告)号：US07355862B2

公开(公告)日：2008-04-08

申请号：US11109656

申请日：2005-04-20

Applicant: Takehiro Shirai ,  Masayuki Iwase

Inventor： Takehiro Shirai ,  Masayuki Iwase

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.

Abstract translation: 印刷布线板包括多个导体板，其包括至少一个导体板，该导体板用作与外部电路电连接的引线，导体板彼此空间分离; 在导体板上或横跨导体板上形成绝缘层，或者两者在导体板上并跨过导体板; 以及形成在所述绝缘层上的多个布线图案。 至少一个导体板通过通孔与至少一个布线图形电连接。

公开(公告)号：US20040145860A1

公开(公告)日：2004-07-29

申请号：US10757986

申请日：2004-01-16

Applicant: DENSO CORPORATION

Inventor： Yusuke Shindo

IPC: H02B001/26

CPC classification number: B60R16/0239 ,  H02K11/01 ,  H02K11/33 ,  H05K1/0218 ,  H05K1/0263 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10272 ,  H05K2201/2018

Abstract: A box unit is a housing having a space for containing a circuit board therein. Bus bars are insert-molded in a resin body of the box. A metal shield plate is insert-molded around the entire periphery of the box and outside the bus bars. As a result, the box has a shield and is reduced in size compared with a metal box.

Abstract translation: 盒单元是具有用于在其中容纳电路板的空间的壳体。 母线被嵌入成型在盒子的树脂体中。 金属屏蔽板围绕箱体的整个周边和母线外部嵌入成型。 结果，与金属盒相比，该盒具有屏蔽并且尺寸减小。

公开(公告)号：US06043435A

公开(公告)日：2000-03-28

申请号：US983509

申请日：1998-01-28

Applicant: Takayuki Yamaguchi ,  Katsura Sugiura

Inventor： Takayuki Yamaguchi ,  Katsura Sugiura

IPC: H01R9/16 ,  H01R9/24 ,  H01R43/16 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H01B17/00 ,  H01B7/08

CPC classification number: H05K3/202 ,  H01R43/16 ,  H01R9/16 ,  H01R9/2458 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2203/167 ,  H05K3/0064 ,  H05K3/281 ,  H05K3/326

Abstract: The invention relates to a conductive portion device (300) having a plurality of independent conductive portions and attached to an attaching base member (360). The device includes a film (310) and a plurality of conductive materials (321, 322 and 323) to be attached to the film (310), which constitute the respective independent conductive portions, and the device further has holes (302a to 302d) corresponding to protrusions (362a to 362d) formed on the attaching base member (360).

Abstract translation: PCT No.PCT / JP97 / 01832 Sec。 371日期1998年1月28日 102（e）日期1998年1月28日PCT提交1997年5月29日PCT公布。 公开号WO97 / 46058 PCT 日期1997年12月4日本发明涉及具有多个独立导电部分并连接到安装基座部件（360）的导电部分装置（300）。 该装置包括一个薄膜（310）和多个导电材料（321,322和323），它们被连接到薄膜（310）上，它们构成各个独立的导电部分，该装置还具有孔（302a至302d） 对应于形成在安装基部构件（360）上的突起（362a至362d）。

公开(公告)号：US5774341A

公开(公告)日：1998-06-30

申请号：US575652

申请日：1995-12-20

Applicant: Glenn F. Urbish ,  Robert W. Pennisi ,  William Boone Mullen, III ,  Dale W. Dorinski

Inventor： Glenn F. Urbish ,  Robert W. Pennisi ,  William Boone Mullen, III ,  Dale W. Dorinski

IPC: H01R4/26 ,  H01R4/58 ,  H01R12/50 ,  H01R13/33 ,  H05K3/32 ,  H01R9/09 ,  H05K7/02

CPC classification number: H05K3/326 ,  H01R4/58 ,  H05K1/038 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01R13/33 ,  H01R4/26 ,  H05K2201/09754 ,  H05K2201/0979

Abstract: A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Abstract translation: 使用嵌入衬底（12）中的导电钩紧固件（15）制造无焊电气互连。 紧固件的上部（20）暴露在基板的顶侧，中心部分（22）嵌入在基板本身内，紧固件的下部或钩部（17）从底部 底物。 限定在基板顶面上的导电路径（30）与钩紧固件的暴露的上部接触。 上侧的导电流道通过导电钩紧固件具有穿过衬底到衬底底侧的连续信号路径。 钩紧固件（15）与第二基板（70）上的导电环紧固件（60）接合，以便在两个基板之间产生无焊接电互连和机械互锁。

公开(公告)号：US5266745A

公开(公告)日：1993-11-30

申请号：US760692

申请日：1991-09-16

Applicant: Dieter Seipler

Inventor： Dieter Seipler

IPC: H01L27/01 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/246 ,  H05K3/4092 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09754 ,  H05K2201/1028

Abstract: A thick film hybrid arrangement has a plurality of ceramic foils provided with conductor paths and superimposed over one another, a support for supporting the ceramic foils, and a plurality of thin metal lugs located between the ceramic foils for contacting the conducting paths. The metal lugs extend outwardly beyond at least the ceramics foils so as to form outer contacts.

Abstract translation: 厚膜混合布置具有多个陶瓷箔，其设置有导体路径并彼此叠置，用于支撑陶瓷箔的支撑件和位于陶瓷箔之间用于接触导电路径的多个薄金属突起。 金属凸耳向外延伸至少至少陶瓷箔，以形成外触点。

公开(公告)号：US5220726A

公开(公告)日：1993-06-22

申请号：US721080

申请日：1991-06-26

Applicant: David A. Mantell

Inventor： David A. Mantell

IPC: H01B5/14 ,  H01L21/48 ,  H01L23/498 ,  H01R11/01 ,  H01R13/03 ,  H01R29/00 ,  H01R43/00 ,  H05K3/10 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01R13/03 ,  H05K3/105 ,  H05K3/4092 ,  H01L2924/0002 ,  H01R29/00 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2203/107 ,  H05K2203/1136 ,  H05K3/403 ,  Y10S428/901 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49224

Abstract: An electrically connectable module is manufactured from a substrate of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a fiber-doped substrate. One end of an electrical connector is embedded in the fiber-doped substrate to locate the one end adjacent the surface of the substrate while exposing an opposite end of the electrical connector. The surface of the fiber-doped substrate is locally heated preferably with a laser to form a conductive trace by the in-situ heat conversion of the electrically insulating fibrous filler, the localized heating including the one end of the electrical connector to electrically connect the electrical connector to the conductive trace. In another embodiment, a conductive material is electrodeposited on the conductive trace by applying a voltage to the opposite end of the electrical connector. The substrate is molded into a desired shape to form the module, and a plurality of electrical connectors can be embedded into the substrate in any one of several different standardized arrangements.

公开(公告)号：US5220491A

公开(公告)日：1993-06-15

申请号：US681270

申请日：1991-04-08

Applicant: Toshio Sugano ,  Seiichiro Tsukui

Inventor： Toshio Sugano ,  Seiichiro Tsukui

IPC: H05K1/11 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4641 ,  H01L23/5385 ,  H01L25/0657 ,  H01L25/105 ,  H05K3/4092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/141 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/429 ,  H05K3/445

Abstract: A module board has a supporting plate and slender lead pins having their first portions arranged substantially in parallel with one another on a plane substantially coplanar with the supporting plate. The supporting plate and the first portions of the slender lead pins are sandwiched between electrically insulating layer members. The supporting plate and the first portions of the lead pins are isolated from one another with an electrically insulating material between the pair of electrically insulating layer members. Second portions of the lead pins protrude from the pair of electrically insulating layer members. Through holes are provided one for each of the lead pins and through hole conductors are formed on the inner walls of the through holes. Each of the through hole conductors passes through the pair of electrically insulating layer members and the first portion of its associated one of the lead pins and is in electrical connection with a pattern of electrical conductors provided on the pair of electrically insulating layer members, thereby fixing its associated lead pin to the board and electrically connecting its associated lead pin to the pattern of electrical conductors.

Abstract translation: 模块板具有支撑板和细长的引脚，其引脚在其与支撑板基本上共面的平面上彼此基本平行地布置。 支撑板和细长引线销的第一部分夹在电绝缘层部件之间。 支撑板和引脚的第一部分之间用一对电绝缘层构件之间的电绝缘材料彼此隔离。 引线针的第二部分从一对电绝缘层构件突出。 为每个引脚设置一个通孔，并且通孔导体形成在通孔的内壁上。 每个通孔导体穿过一对电绝缘层构件和其相关联的一个引脚的第一部分，并且与设置在一对电绝缘层构件上的电导体图案电连接，由此固定 其相关的引脚引脚连接到电路板上，并将其相关的引脚与电导体的图形电连接。

公开(公告)号：US3916513A

公开(公告)日：1975-11-04

申请号：US46654974

申请日：1974-05-03

Applicant: AMPEX

Inventor： BALLARD NATHAN THOMAS

IPC: H01R12/51 ,  H05K1/05 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K3/4046 ,  H05K1/05 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10924 ,  Y10T29/49121 ,  Y10T29/49126

Abstract: Interplane connectors (vias) between circuit layers are fabricated by providing a metal base plate with the desired connectors thereon, forming the connectors at right angles to the base plate and embedding the connectors in a plastic matrix. The base plate is then removed, leaving the plastic with the connectors embedded therein at the desired locations.

Abstract translation: 通过在其上提供具有所需连接器的金属底板来制造电路层之间的平面间连接器（通路），形成与基板成直角的连接器并将连接器嵌入塑料基体中。 然后取下基板，留下塑料，将连接器嵌入其中所需的位置。

公开(公告)号：TW201725944A

公开(公告)日：2017-07-16

申请号：TW105131277

申请日：2016-09-29

Applicant: 塔克圖科技有限公司 ,  TACTOTEK OY

Inventor： 克倫尼 安提 ,  KERANEN, ANTTI ,  希琴能 米可 ,  HEIKKINEN, MIKKO ,  雷普帕那 帕西 ,  RAAPPANA, PASI ,  薩斯奇 加爾默 ,  SAASKI, JARMO

IPC: H05K1/14 ,  H05K3/28 ,  H01L23/522 ,  H01R12/77

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: 一種多層結構包含一可撓的基材薄膜具有一第一面和相反的第二面，若干的導電軌線，選擇地界定接觸墊及/或導體等，藉印刷電子器件技術印刷在該基材薄膜的第一面上，用以構建一所需的預定電路設計，一塑膠層被模製於該基材薄膜的第一面上，而能包封該塑膠層與該基材薄膜的第一面之間的電路，及一連接器呈一可撓活片的形式，用以由該基材薄膜之相反的第二面提供外部電連接於該掩埋的電路，該連接器係由該基材薄膜之一容納著一或更多該等印刷導電軌線之至少一部份的部份所界定，並被切成部份地釋脫周圍的基材材料而來造成該活片，其之該釋脫端係可由該模製塑膠層彎離，以方便經由相關的間隙來與外部元件譬如一電線或連接器建立所述的電連接。一種相關的製造方法亦被呈現。

Abstract in simplified Chinese: 一种多层结构包含一可挠的基材薄膜具有一第一面和相反的第二面，若干的导电轨线，选择地界定接触垫及/或导体等，藉印刷电子器件技术印刷在该基材薄膜的第一面上，用以构建一所需的预定电路设计，一塑胶层被模制于该基材薄膜的第一面上，而能包封该塑胶层与该基材薄膜的第一面之间的电路，及一连接器呈一可挠活片的形式，用以由该基材薄膜之相反的第二面提供外部电连接于该掩埋的电路，该连接器系由该基材薄膜之一容纳着一或更多该等印刷导电轨线之至少一部份的部份所界定，并被切成部份地释脱周围的基材材料而来造成该活片，其之该释脱端系可由该模制塑胶层弯离，以方便经由相关的间隙来与外部组件譬如一电线或连接器创建所述的电连接。一种相关的制造方法亦被呈现。

公开(公告)号：JP2018502547A

公开(公告)日：2018-01-25

申请号：JP2017537411

申请日：2015-01-15

Applicant: ピアーブルグ パンプ テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング ,  Pierburg Pump Technology GmbH

Inventor： ロナルド, ラトケ ,  アレクサンダー, フィントアイゼン

IPC: H02K5/22 ,  H02K11/33

CPC classification number: H01R13/405 ,  H02K5/08 ,  H02K5/10 ,  H02K5/225 ,  H02K11/33 ,  H05K3/284 ,  H05K2201/09754 ,  H05K2201/10303 ,  H05K2203/1316

Abstract: 本発明は、自動車用電子補助アセンブリであって、電子整流の駆動モータと、この駆動モータによって駆動される動作手段と、少なくとも2つの露出したコネクタピンを有する、外縁のコネクタ構造体と、少なくとも部分的にモールド体にモールドされた、モータを横切る面にある整流電子装置を備える、モータ制御用回路基板と、を有する。このコネクタピンは、それぞれ1つの単一の剛性のあるピン主部から形成されており、このピン主部はモータ制御用回路基板に直接電気的に結合されている。モールド体は、ピン主部を、モータ制御部回路基板と、コネクタ基部から形成されているコネクタ底部との間で包囲している、一体に成形されたコネクタ基部を備え、コネクタ基部は、ハウジング主部のハウジング開口部に差し込まれて、コネクタ底部がこのハウジング開口部を完全に封止し、そしてピン主部がコネクタ底部からこのハウジング開口部を通って、外部へ突出している。【選択図】図1