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公开(公告)号:TWI408707B
公开(公告)日:2013-09-11
申请号:TW099140733
申请日:2010-11-25
Applicant: 吉林克斯公司 , XILINX, INC.
Inventor: 奇里弗 梵希利 , KIREEV, VASSILI
CPC classification number: H01L23/5227 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
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公开(公告)号:TWI404470B
公开(公告)日:2013-08-01
申请号:TW097143483
申请日:2008-11-11
Applicant: 吉林克斯公司 , XILINX, INC.
Inventor: 安東尼T. 道 , DUONG, ANTHONY T.
IPC: H05K1/18 , H01L23/538
CPC classification number: H05K1/0216 , H01L2224/16 , H01L2924/15311 , H05K1/0262 , H05K1/0298 , H05K2201/09327 , H05K2201/10212 , H05K2201/10734
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公开(公告)号:WO2012050676A1
公开(公告)日:2012-04-19
申请号:PCT/US2011/050048
申请日:2011-08-31
Applicant: XILINX. INC.
Inventor: UPADHYAYA, Parag , KIREEV, Vassili
IPC: H03B5/12
CPC classification number: H03B5/1228 , H03B5/1212 , H03B5/124 , H03B5/1262 , H03B5/1265 , H03B2201/02 , H03B2201/0208 , H03B2201/0266
Abstract: A tunable resonant circuit (102) includes first capacitors (104, 108, 216, 228, 232) and second capacitors (106, 1 10, 218, 230, 234) that provide a matched capacitance between first and second electrodes of the first and second capacitors. A deep-well arrangement includes a first well (320, 326) disposed within a second well (322, 328) in a substrate (324). The first and second capacitors are each disposed on the first well. Two channel electrodes of a first transistor (120, 130) are respectively coupled to the second electrode (1 14, 304) of the first capacitor and the second electrode (1 18, 308) of the second capacitor. Two channel electrodes of a second transistor (122, 132) are respectively coupled to the second electrode of the first capacitor and to ground. Two channel electrodes of the third transistor (124, 134) are respectively coupled to the second electrode of the second capacitor and to ground. The gate electrodes (226, 314) of the first, second, and third transistors are responsive to a tuning signal (126, 136), and an inductor (144, 202) is coupled between the first electrodes (1 12, 1 16, 302, 306) of the first and second capacitors.
Abstract translation: 可调谐谐振电路(102)包括在第一和第二电极之间提供匹配电容的第一电容器(104,108,216,228,232)和第二电容器(106,110,218,230,234) 第二电容器。 深井布置包括设置在衬底(324)中的第二阱(322,328)内的第一阱(320,326)。 第一和第二电容器各自设置在第一阱上。 第一晶体管(120,130)的两沟道电极分别耦合到第一电容器的第二电极(114)和第二电容器的第二电极(118,188)。 第二晶体管(122,132)的两沟道电极分别耦合到第一电容器的第二电极并接地。 第三晶体管(124,134)的两沟道电极分别耦合到第二电容器的第二电极并接地。 第一,第二和第三晶体管的栅极电极(226,314)对调谐信号(126,136)作出响应,并且电感器(144,202)耦合在第一电极(112,126, 302,306)的第一和第二电容器。
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公开(公告)号:WO2019067352A1
公开(公告)日:2019-04-04
申请号:PCT/US2018/052413
申请日:2018-09-24
Applicant: XILINX. INC.
Inventor: LESEA, Austin H. , MOHAN, Sundararajarao , TRIMBERGER, Stephen M.
IPC: G06F15/78
Abstract: An example integrated circuit (IC) package includes: a processing system (104) and a programmable IC (106) disposed on a substrate (1 18), the processing system coupled to the programmable IC through interconnect (1 12) of the substrate; the processing system including components (202...208) coupled to a ring interconnect (210), the components including a processor (202) and an interface controller (214). The programmable IC includes: an interface endpoint (218) coupled to the interface controller through the interconnect; and at least one peripheral (230) coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.
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公开(公告)号:US20250156585A1
公开(公告)日:2025-05-15
申请号:US18505173
申请日:2023-11-09
Applicant: Xilinx, Inc.
Inventor: Bin Dai Ochotta , Sudheendra Kusume , Alec J. Wong , Pradip K. Jha
IPC: G06F21/72 , G06F30/392 , G06F115/08 , H04L9/08 , H04L9/14
Abstract: A key block can be generated from a session key used by a computer-based design tool for a circuit design by encrypting the session key using computer hardware. The key block can be divided, by the computer hardware, into a plurality of sub-blocks. A plurality of enhanced sub-blocks can be generated by the computer hardware by encrypting each sub-block of the plurality of sub-blocks with a different key of a plurality of keys corresponding to a plurality of Intellectual Property (IP) cores of the circuit design. The plurality of enhanced sub-blocks can be stored in a memory.
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公开(公告)号:US20250130770A1
公开(公告)日:2025-04-24
申请号:US18493233
申请日:2023-10-24
Applicant: Xilinx, Inc.
Inventor: Chinmaya Dash
Abstract: An implementation may include a method for performing a binary multiplication including receiving a first at an input interface of a digital multiplier circuit in the computing system, receiving a second operand at the input interface of the digital multiplier circuit, generating, by the digital multiplier circuit, partial products by performing a AND operation with each of the N bits of the first operand and each of the bits of the second operand, and generating first modified partial products by modifying, by the digital multiplier circuit, most significant bits of the partial products, generating second modified partial products by modifying, by the digital multiplier circuit, one of the first modified partial product, generating, by the digital multiplier circuit, a product by summing the second modified partial products, and outputting the product from an output interface of the digital multiplier circuit.
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公开(公告)号:US20250124204A1
公开(公告)日:2025-04-17
申请号:US18381052
申请日:2023-10-17
Applicant: XILINX, INC.
Inventor: Pawan KULSHRESHTHA , Atul SRINIVASAN
IPC: G06F30/3312 , G06F30/31
Abstract: Performing timing analysis of a circuit design includes building a timing graph of the circuit design, and determining delays of devices and wires of the circuit design based on the timing graph. Further, clock and arrival propagations for the circuit design are performed based on the delays of the devices and wires, latch loops are identified in the circuit design, and latch analysis on latches of the latch loops is performed. The timing analysis further includes performing arrival propagation for circuit elements of the circuit design impacted by the latch analysis performed on the latches of the latch loops, performing latch analysis on latches of the circuit design external to the latch loops, and performing required time and slack calculations on the circuit design.
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公开(公告)号:US20250079276A1
公开(公告)日:2025-03-06
申请号:US18241140
申请日:2023-08-31
Applicant: Advanced Micro Devices, Inc. , XILINX, INC.
Inventor: Manish DUBEY , Frank Peter LAMBRECHT , Brett P. WILKERSON , Deepak Vasant KULKARNI , Hemanth Kumar DHAVALESWARAPU , Priyal SHAH
IPC: H01L23/498 , H01L23/00 , H01L23/043 , H01L25/065 , H05K1/14
Abstract: Disclosed herein is a chip package assembly that includes a package substrate coupled with an integrated circuit die, a stiffener attached to a top surface of the package substrate, and a connector assembly integrated with the stiffener. Both the connector assembly and the stiffener are disposed at a peripheral area of the top surface. The connector assembly includes a bracket and a connector. The connector is configured to connect with one or more optical cables or electrical connectors. The bracket may be formed by a cavity in the stiffener. The bracket may be attached to the top surface of the package substrate. The stiffener may be coupled with the bracket directly or via the connector. Additionally, a frame coupled to the stiffener or a PCB board may be used to secure the bracket in place.
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公开(公告)号:US20250077243A1
公开(公告)日:2025-03-06
申请号:US18242246
申请日:2023-09-05
Applicant: XILINX, INC.
IPC: G06F9/448
Abstract: Some examples described herein provide for instruction glitch protection in an integrated circuit. In an example, a method includes generating a random number by the integrated circuit. The method also includes identifying, based at least in part on the generated random number, a sequence from a set of sequences stored in a memory of the integrated circuit, each sequence of the set of sequences corresponding to an order of execution for a plurality of tasks. The method further includes performing, by the integrated circuit, each task of the plurality of tasks in the order of execution corresponding to the identified sequence.
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公开(公告)号:US20250069579A1
公开(公告)日:2025-02-27
申请号:US18236221
申请日:2023-08-21
Applicant: Advanced Micro Devices, Inc. , XILINX, INC.
Inventor: Gamal REFAI-AHMED , Christopher JAGGERS , Hoa DO , Md Malekkul ISLAM , Paul Theodore ARTMAN , Sukesh SHENOY , Suresh RAMALINGAM , Muhammad Afiq Bin In BAHAROM
IPC: G10K11/178
Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.
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