Abstract:
Embodiments of the present invention provide a capacitive switch, an apparatus for transceiving a signal, and a method for manufacturing the capacitive switch. The capacitive switch includes: a first conductive cantilever, a second conductive cantilever, a substrate, and a coplanar waveguide arranged on the substrate, where the coplanar waveguide includes a first conductor configured to transmit an electrical signal and a second conductor and a third conductor that are arranged as ground wires on two sides of the first conductor; an insulation medium layer is arranged on the first conductor, and a conducting layer is arranged on the insulation medium layer; the first conductive cantilever is connected to the second conductor by using a first fixed end, and the second conductive cantilever is connected to the third conductor by using a second fixed end; and when a direct-current signal is transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever contact the conducting layer. In the capacitive switch provided in this embodiment, a stress generated by a metal film bridge of the capacitive switch is released by using a cantilever separate structure, thereby ensuring transmission quality of a signal.
Abstract:
The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.
Abstract:
The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.
Abstract:
The MEMS structure comprises: - a flexible membrane (6), which has a main longitudinal axis (6a) defining a longitudinal direction (X), - at least one pillar (3, 3') under the flexible membrane (6), - electric lowering actuation means (7) that are adapted to bend down the flexible membrane (6) into a down forced state - electric raising actuation means (8) that are adapted to bend up the flexible membrane (6) into an up forced state. The electric lowering actuation means (7) or the electric raising actuation means (8) comprise an actuation area (7c or 8c), that extends under a part of the membrane (6) and that is adapted to exert pulling forces on the membrane (6) on both sides of the said at least one pillar (3) in the longitudinal direction (X).
Abstract:
Microelectromechanical device (MEMS) integrated on a crystalline oxide substrate (1) comprising: at least one suspended structure (6) able to deform by the application of an electric or magnetic field and a thin film structure (10) comprising at least one transition metal oxide (10) deposited on the suspended structure (6). The device is characterized by the fact that the suspended structure (6) comprises a bearing layer (4) of crystalline oxides.
Abstract:
A micro-electromechanical actuator (100) employs metal for the hot arm (101) and silicon for at least the flexible portion of the cold arm (105). The cold arm (105) made of silicon is coupled to a metal wire (107) that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.
Abstract:
A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).
Abstract:
The RF MEMS switch comprising micromechanical switching means that are carried by a substrate (1) and that can be actuated between two positions: a first position (off-state/ figure 1) and a second position (on-state), and actuation means for actuating the position of the switching means. The micromechanical switching means comprise a flexible membrane (6) which is freely supported by support means (3) and which is bendable under the action of the actuation means (7).