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    METHOD FOR MANUFACTURING RE-ENTRANT MICROSTRUCTURES
    122.
    发明申请
    METHOD FOR MANUFACTURING RE-ENTRANT MICROSTRUCTURES 审中-公开
    制造重新加入微结构的方法

    公开(公告)号：WO2016122959A2

    公开(公告)日：2016-08-04

    申请号：PCT/US2016/014285

    申请日：2016-01-21

    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

    Inventor： XU, Muchen ,  KIM, Chang-Jin

    IPC: B81C1/00 ,  B81C3/00

    CPC classification number: B81C1/00373 ,  B29C33/42 ,  B29C33/44 ,  B29C33/64 ,  B81B2207/056 ,  B81C1/00111 ,  B81C1/00357 ,  B81C1/00555 ,  B81C99/0085 ,  B81C2201/0198 ,  B81C2201/036 ,  B81C2203/0136 ,  B81C2203/036 ,  B81C2203/0757

    Abstract: A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.

    Abstract translation: 制造具有重入或双重拓扑结构的微结构的方法包括形成限定待形成的入侵或双重拓扑结构的负表面特征的模具。 在一个实施例中，软的或可流动的材料形成在第一基底上，并且模具与其接触以形成具有入侵或双重拓扑结构的固体，现在正的表面。 然后将模具从第一基底释放。 微结构被固定到第二不同的衬底上，并且去除第一衬底。 可以去除位于相邻微结构之间的任何残余微结构材料，以在第二基底上形成单独的微结构。 第二基底可以是薄且柔性的，任何被操纵成有用或期望的形状，其一侧具有微结构。

    APPARATUS FOR FABRICATING MICROSTRUCTURED DEVICES
    123.
    发明申请
    APPARATUS FOR FABRICATING MICROSTRUCTURED DEVICES 审中-公开
    用于制造微结构器件的装置

    公开(公告)号：WO2014000024A1

    公开(公告)日：2014-01-03

    申请号：PCT/AU2013/000676

    申请日：2013-06-25

    Applicant: UNIVERSITY OF SOUTH AUSTRALIA

    Inventor： PARKINSON, Luke Andrew

    IPC: B29C33/38 ,  B29C59/02 ,  B29C65/70

    CPC classification number: B01L3/502707 ,  B29C65/02 ,  B29C65/7841 ,  B29C66/53461 ,  B29C66/54 ,  B29C66/71 ,  B29L2031/756 ,  B81B2201/058 ,  B81C1/00119 ,  B81C99/0025 ,  B81C99/0085 ,  B81C2201/036 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2023/38

    Abstract: Disclosed herein is a platen arrangement for use in fabricating embossed or bonded. The platen arrangement comprises first and second pressure plates configured to be pressed together to emboss a substrate or bond two substrates positioned therebetween. Each pressure plate has a working surface comprising a recess configured to removably receive an insert comprising a planar substrate contact surface having a size and shape that is substantially the same as the size and shape of the substrate and an insert retainer for releasably retaining the insert in the recess. When the two pressure plates are brought together the inserts are mutually aligned and the substrate contact surface of each insert contacts the substrate to apply pressure thereto.

    Abstract translation: 本文公开了一种用于制造压花或粘结的压板装置。 压板装置包括第一和第二压板，其被配置为压在一起以压印基板或者将两个位于其间的基板接合。 每个压板具有一个工作表面，该工作表面包括一个凹槽，该凹槽构造成可移除地容纳包括平面基板接触表面的插入件，该平面基板接触表面的尺寸和形状基本上与基板的尺寸和形状相同，以及用于将插入件可释放地保持 凹槽 当两个压板接合在一起时，插入件相互对准，并且每个插件的基板接触表面与基板接触以向其施加压力。

    METHOD FOR MAKING MICROFLUID DEVICES
    125.
    发明申请
    METHOD FOR MAKING MICROFLUID DEVICES 审中-公开
    制造微流体装置的方法

    公开(公告)号：WO2008106160A1

    公开(公告)日：2008-09-04

    申请号：PCT/US2008/002584

    申请日：2008-02-27

    Applicant: CORNING INCORPORATED ,  DANNOUX, Thierry, L. ,  MARQUES, Gaspar, P. ,  MORENA, Robert, M. ,  TANNER, Cameron, W.

    Inventor： DANNOUX, Thierry, L. ,  MARQUES, Gaspar, P. ,  MORENA, Robert, M. ,  TANNER, Cameron, W.

    IPC: C03B23/203 ,  C03B11/08

    CPC classification number: C03B23/203 ,  B81B2201/051 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/036 ,  C03B2215/412

    Abstract: Described herein are methods for making microfluidic devices comprising glass or glass-containing materials, wherein the methods have decreased cost and/or improved dimensional properties over similar formed glass articles produced using current techniques. In particular, a first piece of rigid, non-stick material is provided, having a patterned molding surface; a first amount of a glass-containing composition is provided; the first amount of glass-containing composition is contacted with the patterned molding surface and pressed between the patterned molding surface and a second surface; the piece of rigid non-stick material and the first amount of glass-containing composition are heated together sufficiently to soften the amount glass-containing composition such that the patterned molding surface is replicated in the first amount of glass-containing composition, forming a formed glass- containing article; at least a portion of the formed glass-containing article is sealed to create a microfluidic device having at least one fluidic passage therethrough.

    Abstract translation: 本文描述了用于制造包含玻璃或含玻璃材料的微流体装置的方法，其中相对于使用当前技术制备的相似的成形玻璃制品，所述方法具有降低的成本和/或改善的尺寸性能。 特别地，提供了具有图案化成型表面的第一块刚性不粘材料， 提供第一量的含玻璃组合物; 第一量的含玻璃组合物与图案化的模制表面接触并在图案化的模制表面和第二表面之间被压制; 将刚性不粘材料和第一量的含玻璃组合物充分加热，以使含玻璃组合物的量变软，使得图案化的成型表面在第一量的含玻璃组合物中复制，形成 玻璃制品; 形成的含玻璃制品的至少一部分被密封以产生具有至少一个流体通道的微流体装置。

    SELECTIVE AND ALIGNMENT-FREE MOLECULAR PATTERNING OF SURFACES
    129.
    发明申请
    SELECTIVE AND ALIGNMENT-FREE MOLECULAR PATTERNING OF SURFACES 审中-公开
    选择性和对准的表面分子图谱

    公开(公告)号：WO2004018622A2

    公开(公告)日：2004-03-04

    申请号：PCT/US0325634

    申请日：2003-08-13

    Applicant: UNIV LELAND STANFORD JUNIOR

    Inventor： MEHENTI NEVILLE Z ,  FISHMAN HARVEY A ,  BENT STACEY F

    IPC: B05D1/18 ,  B05D1/28 ,  B41M3/00 ,  C12N11/06 ,  C12N11/08 ,  G03F7/00 ,  C12N

    CPC classification number: G03F7/0002 ,  B05D1/185 ,  B05D1/283 ,  B41M3/006 ,  B81B2201/0214 ,  B81C1/00206 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C12N11/06 ,  C12N11/08

    Abstract: The present invention is directed towards a method and means for molecularly patterning a surface to promote the patterned attachment of a target adherent. In some preferred embodiments the target adherent is a biological cell, but it can more generally be a biological or chemical species for which attachment at specific sites is desired. The method generally involves using a stamp to microcontact print a first type of molecule on the surface. With the stamp remaining in situ, the process then involves fluidic patterning of a second type of molecule through selected openings defined by selected recesses in the stamp and the surface itself. The second type of molecule should have an adhesion property relative to the target adherent that is complementary to that of the first type of molecule. The stamp is removed only after both the first and second types of molecules have been transferred to the surface.

    Abstract translation: 本发明涉及用于分子图案化表面以促进目标粘附剂的图案化附着的方法和装置。 在一些优选的实施方案中，靶粘附物是生物细胞，但它通常可以是需要在特定部位附着的生物或化学物质。 该方法通常涉及使用印模来微分印刷表面上的第一类型的分子。 当邮票保留在原位时，该方法然后涉及通过由印模和表面本身中的选定凹部限定的选定开口的第二类型分子的流体图案化。 第二类分子应该具有相对于与第一类型分子互补的靶粘附物的粘附性质。 只有在第一种和第二种类型的分子已经转移到表面之后，才能去除印模。

    THIN CAPPING FOR MEMS DEVICES
    130.
    发明申请
    THIN CAPPING FOR MEMS DEVICES 审中-公开
    薄膜封装用于MEMS器件

    公开(公告)号：WO2015030657A1

    公开(公告)日：2015-03-05

    申请号：PCT/SE2014/050973

    申请日：2014-08-26

    Applicant: SILEX MICROSYSTEMS AB

    Inventor： KÄLVESTEN, Edvard ,  EBEFORS, Thorbjörn ,  SVEDIN, Niklas

    IPC: B81B7/00 ,  B81C1/00 ,  H01L21/50 ,  H01L23/48

    CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

    Abstract: The invention relates to a device comprising a base substrate(700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from said component (702). It also comprises spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via said spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) comprises vias (710) comprising metal for providing electrical connection through said capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

    Abstract translation: 本发明涉及一种包括具有附着到其上的微型部件（702）的基底（700）的装置。 适当地，它设置有用于向所述部件（702）传导信号和从所述部件（702）传导信号的路由元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 优选通过共晶接合，通过所述间隔件（706），在基底基板（700）上方设有玻璃材料的封盖结构（708），其中封盖结构（708）包括通孔（710），其包括金属 用于通过所述封盖结构提供电连接。 通孔可以通过冲压/压制方法制成，在加热下需要加压针，使玻璃软化并施加压力至玻璃中预定的深度。 然而，其他方法是可行的，例如钻孔，蚀刻，爆破。

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