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    Structure empilée et procédé pour la fabriquer
    123.
    发明授权
    Structure empilée et procédé pour la fabriquer 有权
    层结构及其制造方法

    公开(公告)号：EP1651560B1

    公开(公告)日：2008-11-19

    申请号：EP04767683.8

    申请日：2004-07-15

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

    Inventor： MORICEAU, Hubert ,  ASPAR, Bernard ,  MARGAIL, Jacques

    IPC: B81B3/00 ,  H01L21/20 ,  H01L21/762

    CPC classification number: B81B3/001 ,  B81C2201/112 ,  H01L21/76251 ,  H01L21/76256

    Abstract: The invention relates to a method of producing a stacked structure. The inventive method comprises the following steps consisting in: a) using a first plate (1) which is, for example, made from silicon, and a second plate (5) which is also, for example, made from silicon, such that at least one of said first (1) and second (5) plates has, at least in part, a surface (2; 7) that cannot bond to the other plate; b) providing a surface layer (3; 8), which is, for example, made from silicon oxide, on at least one part of the surface (2) of the first plate and/or the surface (7) of the second plate (5); and c) bonding the two plates (1; 5) to one another. The aforementioned bonding incompatibility can, for example, result from the physicochemical nature of the surface or of a coating applied thereto, or from a roughness value (r'2, r'7) which is greater than a pre-determined threshold. The invention also relates to a stacked structure produced using the inventive method.

    STRUCTURE EMPIL E, ET PROC D POUR LA FABRIQ UER
    126.
    发明公开
    STRUCTURE EMPIL E, ET PROC D POUR LA FABRIQ UER 有权
    层结构及其制造方法

    公开(公告)号：EP1651560A1

    公开(公告)日：2006-05-03

    申请号：EP04767683.8

    申请日：2004-07-15

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

    Inventor： MORICEAU, Hubert ,  ASPAR, Bernard ,  MARGAIL, Jacques

    IPC: B81B3/00 ,  H01L21/20 ,  H01L21/762

    CPC classification number: B81B3/001 ,  B81C2201/112 ,  H01L21/76251 ,  H01L21/76256

    Abstract: The invention relates to a method of producing a stacked structure. The inventive method comprises the following steps consisting in: a) using a first plate (1) which is, for example, made from silicon, and a second plate (5) which is also, for example, made from silicon, such that at least one of said first (1) and second (5) plates has, at least in part, a surface (2; 7) that cannot bond to the other plate; b) providing a surface layer (3; 8), which is, for example, made from silicon oxide, on at least one part of the surface (2) of the first plate and/or the surface (7) of the second plate (5); and c) bonding the two plates (1; 5) to one another. The aforementioned bonding incompatibility can, for example, result from the physicochemical nature of the surface or of a coating applied thereto, or from a roughness value (r'2, r'7) which is greater than a pre-determined threshold. The invention also relates to a stacked structure produced using the inventive method.

    CAPACITIVE ACCELERATION SENSOR
    127.
    发明公开
    CAPACITIVE ACCELERATION SENSOR 有权
    电容式加速度传感器

    公开(公告)号：EP1599736A1

    公开(公告)日：2005-11-30

    申请号：EP04710048.2

    申请日：2004-02-11

    Applicant: VTI Technologies Oy

    Inventor： KUISMA, Heikki ,  LAHDENPERÄ, Juha ,  MUTIKAINEN, Risto

    IPC: G01P15/08 ,  G01P15/125 ,  B81B7/00

    CPC classification number: G01P15/125 ,  B81B3/0013 ,  B81B2201/0235 ,  B81C1/0096 ,  B81C2201/112 ,  G01P15/08 ,  G01P15/0802

    Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode ( 4 ) and a stationary electrode ( 5 ), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.

    Abstract translation: 本发明涉及用于测量加速度的测量装置，具体涉及电容式加速度传感器。 根据本发明的电容式加速度传感器包括由可动电极（4）和固定电极（5）组成的一对电极，并且与该对电极有关的具有特殊涂层的隔离突起。 本发明提供了一种改进的，更耐用的传感器结构，其比过去的结构更好地承受过载情况所引起的磨损。

    Method for coating micro-electromechanical systems (MEMS)
    128.
    发明公开
    Method for coating micro-electromechanical systems (MEMS) 审中-公开
    涂覆的微机电系统的方法（MEMS）

    公开(公告)号：EP1172680A3

    公开(公告)日：2004-11-17

    申请号：EP01202383.4

    申请日：2001-06-21

    Applicant: Texas Instruments Incorporated

    Inventor： Miller, Seth ,  Lopes, Vincent C.

    IPC: G02B26/08 ,  B81C1/00

    CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112

    Abstract: A method for coating free-standing micromechanical devices (302) using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas (304) of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.

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