公开(公告)号：EP0691660B1

公开(公告)日：2006-11-15

申请号：EP95303147.3

申请日：1995-05-10

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Goto, Yasushi ,  Tsukagoshi, Isao ,  Ohta, Tomohisa

IPC: H01B1/22 ,  C09J7/02

CPC classification number: H01R13/2414 ,  C09J7/20 ,  C09J9/02 ,  H01B1/22 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01R4/04 ,  H05K3/102 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H01L2924/00

Abstract: Anisotropically electroconductive resin film material, produced by adhering electroconductive particles to an adhering layer formed on a support and fixing therein, and introducing a film-forming resin incompatible with the adhering material between the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

公开(公告)号：EP1093160B1

公开(公告)日：2005-03-23

申请号：EP00308961.2

申请日：2000-10-12

Applicant: SONY CHEMICALS CORPORATION

Inventor： Suga, Yasuhiro ,  Takeichi, Motohide

IPC: H01L21/60 ,  H01L23/482

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP1426979A1

公开(公告)日：2004-06-09

申请号：EP02765567.9

申请日：2002-09-17

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： WAKIYA, Takeshi, Sekisui Chemical Co., Ltd. ,  YONEDA, Yoshikazu, Sekisui Chemical Co., Ltd. ,  UEBA, Masako, Sekisui Chemical Co., Ltd.

IPC: H01B5/00 ,  H01B5/16 ,  H01B1/00 ,  B01J19/00 ,  C08K9/04 ,  C08L101/00 ,  H01R11/01 ,  C09C3/06 ,  C09J9/02

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure.
A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

Abstract translation: 本发明的一个目的是提供具有优异的连接可靠性，一种用于制造涂覆谋求导电性粒子的各向异性导电材料和导电连接结构的方法的包覆导电性粒子。 的涂覆导电性粒子，其包括具有由导电金属制成并绝缘粒子涂覆颗粒的表面的表面的粒子的表面具有与由导电金属制成的有，worin绝缘粒子化学键合，粒子 通过官能团（A）由导电金属制成的具有粘接性的导电金属表面，从而没有一个单一的涂层形成。

公开(公告)号：EP1093160A3

公开(公告)日：2001-12-05

申请号：EP00308961.2

申请日：2000-10-12

Applicant: SONY CHEMICALS CORPORATION

Inventor： Suga, Yasuhiro ,  Takeichi, Motohide

IPC: H01L21/60 ,  H01L23/482

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes disposed recedingly from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechnical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer even if the passivation layer is made of a resin. The said connecting material (6) comprises an adhesive component (7) of insulating property and electroconductive particles (8), wherein each of the electroconductive particles (8) comprises a resin core particle (8a) coated with a metal layer (8b) and the average particle size d of the electroconductive particles (8) is at least 1.5 times the receding depth h of the electrodes (4) from the outer face of the passivation layer (5) of the semiconductor element (3) and at most 0.5 time the distance s between the neighboring electrodes (4).

Abstract translation: 一种用于各向异性导电连接的连接材料，用于粘合和连接具有多个电极的半导体元件，半导体元件一方面由形成在半导体元件上的钝化层的外表面排列，具有多个电极 另一方面，与半导体元件的电极相对应的关系是哪个连接材料能够同时获得元件与电路板的可靠的机械接合以及相应的面对的电极之间的固定的导电连接，而不会受到影响 钝化层的损伤即使钝化层由树脂制成。 所述连接材料（6）包括绝缘性能的粘合剂组分（7）和导电颗粒（8），其中每个导电颗粒（8）包括涂覆有金属层（8b）的树脂核心颗粒（8a）和 导电粒子（8）的平均粒径d比半导体元件（3）的钝化层（5）的外表面至少为电极（4）的后退深度h的1.5倍，最多为0.5倍 相邻电极（4）之间的距离s。

公开(公告)号：EP1093160A2

公开(公告)日：2001-04-18

申请号：EP00308961.2

申请日：2000-10-12

Applicant: SONY CHEMICALS CORPORATION

Inventor： Suga, Yasuhiro ,  Takeichi, Motohide

IPC: H01L21/60 ,  H01L23/482

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09472 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes disposed recedingly from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechnical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer even if the passivation layer is made of a resin. The said connecting material (6) comprises an adhesive component (7) of insulating property and electroconductive particles (8), wherein each of the electroconductive particles (8) comprises a resin core particle (8a) coated with a metal layer (8b) and the average particle size d of the electroconductive particles (8) is at least 1.5 times the receding depth h of the electrodes (4) from the outer face of the passivation layer (5) of the semiconductor element (3) and at most 0.5 time the distance s between the neighboring electrodes (4).

Abstract translation: 一种用于各向异性导电连接的连接材料，用于连接和连接具有多个电极的半导体元件，所述半导体元件从形成在半导体元件上的钝化层的外表面向后设置，一方面与具有多个电极的基板电路板 另一方面，在与半导体元件的电极相对应的关系中，该连接材料能够同时实现元件与电路板的可靠的机械接合以及相应面对的电极之间的固定的导电连接，而不会遭受 即使钝化层由树脂制成也会损坏钝化层。 所述连接材料（6）包括具有绝缘性的粘合剂组分（7）和导电颗粒（8），其中每个导电颗粒（8）包括涂覆有金属层（8b）的树脂核颗粒（8a）和 导电颗粒（8）的平均粒径d至少是电极（4）从半导体元件（3）的钝化层（5）的外表面回退的深度h的1.5倍，并且至多为0.5倍 相邻电极（4）之间的距离s。

公开(公告)号：EP1002844A2

公开(公告)日：2000-05-24

申请号：EP99119499.4

申请日：1999-10-01

Applicant: Beiersdorf Aktiengesellschaft

Inventor： Pfaff, Ronald, Dr.

IPC: C09J7/00 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie, enthaltend

i) ein thermoplastisches Polymer mit einem Anteil von zumindest 30 Gew.-%
ii) ein oder mehrere klebrigmachende Harze mit einem Anteil von 5 bis 50 Gew.-% und/oder
iii) Epoxidharze mit Härtern, gegebenenfalls auch Beschleunigern, mit einem Anteil von 5 bis 40 Gew.-%,
iv) metallisierte Partikel mit einem Anteil von 0,1 bis 40 Gew.-%,
v) nur schwer oder nicht verformbare Spacerpartikel mit einem Anteil von 1 bis 10 Gew-%, die bei der Verklebungstemperatur der Klebstoffolie nicht schmelzen.

Abstract translation: 基于热塑性聚合物，增粘树脂，环氧树脂和金属化颗粒的导电的热活化粘合剂膜还包含在膜的结合温度下不熔化的不可变形间隔物颗粒。 含有（i）至少30wt％热塑性聚合物，（ii）5-50wt％增粘树脂，（iii）5-40wt％具有硬化剂的环氧树脂和任选的 还有促进剂，（iv）0.1-40重量％的金属化颗粒和（v）1-10重量％的间隔颗粒，它们不易变形，或者只是易变形，并且在膜的粘合温度下不熔化。

公开(公告)号：EP0413614A3

公开(公告)日：1991-09-11

申请号：EP90309108.0

申请日：1990-08-20

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Mase, Akira

IPC: H01R4/04 ,  H05K3/36 ,  G02F1/1339 ,  H01R9/09

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036

Abstract: A method of making electrical connections between electrode arrangements (3a, 3b) formed on first and second substrates (1, 2) is described which is particularly advantageous for making connections in liquid crystal displays. The first substrate (1) is placed over the second substrate (2) with the respective electrodes (3a, 3b) in registry and with a UV-light-curable adhesive (4) therebetween. The UV-light-curable adhesive carries first and second kinds of particles (5, 6) dispersed therein. The first and second substrates (1, 2) are pressed against each other and exposed to UV light in order to harden the adhesive (4). The first kind of particles (5) are electrically conductive particles and preferably are resiliently deformable and function to establish current paths between the electrodes of the first and second substrates, and the second kind of particles (6) are smaller than the first and function to prevent the first kind of particles from being destroyed by excessive deformation.

公开(公告)号：EP0385787A3

公开(公告)日：1990-10-31

申请号：EP90302214.3

申请日：1990-03-01

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsubara, Hiroshi

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/06 ,  H05K3/102 ,  H05K3/247 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01014

Abstract: A connection electrodes (12) producing method has a step of forming resin layer (13) which can be softened after hardened, on a circuit substrate (11) on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles (14) are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

公开(公告)号：US20150230335A1

公开(公告)日：2015-08-13

申请号：US14618681

申请日：2015-02-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Jin Gu KIM ,  Myung Jae YOO ,  Ichiro OGURA ,  Hye Suk SHIN

IPC: H05K1/05 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0233 ,  Y10T428/2495 ,  Y10T428/31678

Abstract: Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by adding a stress relaxation filler to an insulating layer of a copper clad laminate, along with an inorganic filler. To improve an adhesion of a substrate, the stress relaxation filler is distributed into the resin, along with the inorganic filler, and is entirely distributed into the varnish, and is more effectively added to the vicinity of a bonded interface between the insulating layer and the copper clad layer, thereby improving the overall adhesion.

Abstract translation: 本发明的实施方案提供一种覆铜层压板，更具体地说，涉及覆铜层压板及其制造方法，其能够通过向覆铜层压板的绝缘层添加应力松弛填料而提高剥离强度，以及 无机填料。 为了提高基材的粘附性，应力松弛填料与无机填料一起分配到树脂中，并且完全分散在清漆中，并且更有效地添加到绝缘层和绝缘层之间的键合界面附近 铜包覆层，从而提高整体粘合性。

公开(公告)号：US20120112215A1

公开(公告)日：2012-05-10

申请号：US12941799

申请日：2010-11-08

Applicant: Yan Chai ,  Calvin B. Ward

Inventor： Yan Chai ,  Calvin B. Ward

IPC: H01L33/08 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/111 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of surface mount LEDs that are bonded to a mounting substrate by a layer of asymmetric conductor. Each LED has surface mount contacts on a first surface thereof and emits light from a second surface thereof that is opposite the first surface. The mounting substrate includes a top surface having a plurality of connection traces. Each connection trace includes an n-trace positioned to underlie a corresponding one of the n-contacts and a p-trace positioned to underlie a corresponding one of the p-contacts, the p-trace having an area greater than the p-contact. The layer of asymmetric conductor is sandwiched between the surface mount contacts and the connection traces, and can optionally extend into the spaces between the LEDs to provide a scattering medium for redirecting light leaving the sides of the LEDs.

Abstract translation: 公开了一种光源及其制造方法。 光源包括通过不对称导体层结合到安装基板的多个表面贴装LED。 每个LED在其第一表面上具有表面安装触点，并且从与第一表面相对的第二表面发射光。 安装基板包括具有多个连接迹线的顶表面。 每个连接迹线包括定位成位于n个触点中的相应一个的下方的n迹线和位于相应一个p触点下方的p迹线，p迹线具有大于p触点的面积。 不对称导体层被夹在表面安装触点和连接迹线之间，并且可以可选地延伸到LED之间的空间中，以提供用于重定向离开LED侧面的光的散射介质。