公开(公告)号：EP2777094A1

公开(公告)日：2014-09-17

申请号：EP12847319.6

申请日：2012-10-25

Applicant: Rapisarda, Carmen

Inventor： Rapisarda, Carmen

IPC: H01R4/18

CPC classification number: F21V23/06 ,  F21Y2115/10 ,  H01M2/1044 ,  H01M2/20 ,  H01M2220/30 ,  H01R4/2404 ,  H01R4/26 ,  H01R12/592 ,  H01R12/79 ,  H01R13/41 ,  H01R13/506 ,  H01R13/665 ,  H01R25/003 ,  H05K1/184 ,  H05K3/325 ,  H05K5/0026 ,  H05K5/0091 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2201/10393 ,  H05K2203/0173

Abstract: An electrical component with two conductive leads and two conductive wires are held within a housing. Each lead is inserted into a housing hole to make electrical contact with a wire conductor. Multiple additional electrical components (which may or may not be LEOs) can be held in similar housings attached their own pairs of wires. A PCB assembly can be attached to hold one or more such assemblies. A resilient PCB housing holds a PCB by an interference fit while conductive wires are inserted into its wire cavity so that exposed portions of conductive wires make electrical contact with electrical traces of the PCB which is biased by wire insulation. Two conductors can be held by the PCB housing which are forced into electrical contact with the PCB when it is inserted into the resilient PCB housing which then biases such contacts.

公开(公告)号：EP2701474A2

公开(公告)日：2014-02-26

申请号：EP13171349.7

申请日：2013-06-11

Applicant: Tellabs Oy

Inventor： Björklöf, Alf ,  Holma, Antti

IPC: H05K3/30 ,  H01R13/04 ,  H01R43/20

CPC classification number: H01R13/04 ,  H01R43/205 ,  H05K3/222 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system comprising a circuit board (301) comprising a first (321) and a second functional entity (322) galvanically connected by electrically conductive elements comprising a first electrically conductive lining (317) in a hole of a circuit board, a press-fit connection pin (315) providing a friction fit with the first lining, a second lining (318) in another hole of the circuit board, a second press-fit connection pin (316) providing a friction fit with the second lining, and a connection part (302) providing a galvanic connection between the first and second press-fit connection pins, the press-fit connection pins being comprised in a press-fit installable electrical connector element (324) on an edge of the circuit board, said connection part (302) being located between the circuit board (301) the connector element (324); a method for manufacturing said circuit board system comprising testing the first and second functional entity independently before providing a galvanic connection between said functional entities.

Abstract translation: 1。一种电路板系统，包括电路板（301），所述电路板包括通过导电元件电流连接的第一功能实体（321）和第二功能实体（322），所述导电元件包括​​电路板的孔中的第一导电衬里（317） - 配合连接销（315），其提供与第一衬里的摩擦配合， - 电路板的另一个孔中的第二衬里（318）， - 与第二衬里摩擦配合的第二压配连接销（316），以及 在第一和第二压配合连接引脚之间提供电连接的连接部分（302），所述压配连接引脚被包括在电路板的边缘上的压配可安装电连接器元件（324）中，所述 连接部分（302）位于电路板（301）与连接器元件（324）之间; 一种用于制造所述电路板系统的方法，包括在提供所述功能实体之间的电连接之前独立地测试第一和第二功能实体。

公开(公告)号：EP2609791A1

公开(公告)日：2013-07-03

申请号：EP11819246.7

申请日：2011-07-14

Applicant: Cooledge Lighting Inc.

Inventor： TISCHLER, Michael ,  SCHICK, Philippe ,  SHEEN, Calvin Wade ,  JUNGWIRTH, Paul

IPC: H05B37/00 ,  F21K99/00 ,  F21S2/00 ,  H05B37/04

CPC classification number: H05B37/04 ,  H01L25/0753 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0821 ,  H05K1/0292 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/173 ,  H01L2924/00

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

公开(公告)号：EP2109141B1

公开(公告)日：2011-10-12

申请号：EP08168852.5

申请日：2008-11-11

Applicant: MediaTek Inc.

Inventor： Chen, Nan-Jang

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/222 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board (500a-d) is disclosed. The printed circuit board comprises a substrate (200) having a top surface (202) and a bottom surface (203). A ground plane (228) is on the bottom surface. A signal trace (212c) is on the top surface along a first direction. At least two isolated power planes (208,210) are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection (330) along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.

公开(公告)号：EP2188013A2

公开(公告)日：2010-05-26

申请号：EP09733999.8

申请日：2009-04-22

Applicant: Medtronic, Inc.

Inventor： ENGMARK, David, B. ,  GROSE, Gary, M. ,  SCHAEFER, Todd, H. ,  CEBALLOS, Thomas, I. ,  RIES, Andrew, J.

IPC: A61N1/375 ,  H05K1/14 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/189 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/053 ,  H05K2201/10083 ,  H05K2201/10363 ,  Y10T29/49126

Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

公开(公告)号：EP1614326B1

公开(公告)日：2009-07-29

申请号：EP04726762.0

申请日：2004-04-09

Applicant: Panasonic Corporation

Inventor： SUENAGA, Haruo ,  MORIYA, Hideaki ,  MORIKAWA, Hisashi ,  SAKAI, Shinichi ,  MIHARA, Makoto ,  SHIROKAWA, Nobuo ,  MATSUKURA, Toyotsubu ,  MATSUDA, Masato

IPC: H05B6/68 ,  H05B6/66 ,  H05K1/02 ,  H01L23/34

CPC classification number: H05B6/666 ,  H01L2924/0002 ,  H05K1/18 ,  H05K2201/10363 ,  H01L2924/00

公开(公告)号：EP1771815A1

公开(公告)日：2007-04-11

申请号：EP05772630.9

申请日：2005-07-21

Applicant: FCI

Inventor： MISCHLER, Jean-Jacques ,  RADENNE, Jean-Pierre ,  BARLERIN, Stéphane

IPC: G06K19/077 ,  H05K3/00

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H05K1/118 ,  H05K3/4685 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10363

Abstract: The invention relates to a method of making an RFID tag comprising the steps of: a) providing a dielectric substrate (502); b) forming on said substrate an antenna circuit (515), said antenna circuit comprising more than one turn (515) and a first (521) and second (522) antenna terminals, said first terminal comprising an arm portion (5211) and a terminal end (5212), c) cutting out said dielectric substrate to form a dielectric tongue (540), d) bending said dielectric tongue so that a portion of said dielectric tongue is used as an insulating layer between said more than one turn and a conductive path between said first and second.

公开(公告)号：EP1705970A2

公开(公告)日：2006-09-27

申请号：EP05112754.6

申请日：2005-12-22

Applicant: Weidmüller Interface GmbH & Co. KG

Inventor： Reker, Stefan

IPC: H05K3/22 ,  H05K1/00

CPC classification number: H05K3/222 ,  H05K1/029 ,  H05K2201/10287 ,  H05K2201/10363 ,  H05K2203/175

Abstract: Ein Verteiler (1) umfasst ein Gehäuse (2), das eine Mehrzahl erster Anschlüsse für externe Feldgeräte wie Sensoren, Aktoren, Initiatoren und dgl. aufweist und wenigstens ein oder mehrere zweite Anschlüsse zum Anschluss des Verteilers z.B. an ein übergeordnetes Bussystem oder zur Verbindung des Verteilers mit weiteren Verteilern. Die ersten und zweiten Anschlüsse sind auf einer Leiterplatte (9) angeordnet und über eine elektrische Schaltung, die zumindest Leiterbahnen umfasst, leitend miteinander verbunden, wobei eine zwei Punkte (P1, P2) auf der Leiterplatte (9) leitend miteinander verbindende und mit einem Schneidwerkzeug wie einem Seitenscheider durchtrennbare leitende Brücke zwischen den Punkten (P1, P2) vorgesehen ist.

Abstract translation: 分配器（1）具有壳体（2），其具有用于外部现场设备的多个第一连接，例如传感器，致动器和启动器，以及用于连接分配器的至少一个或多个第二连接器。 到一个监督总线系统，用于将分销商连接到其他分销商。 点（P1，P2）之间的可分离的导电桥将电路板（9）上的点导电地连接到诸如对角线切割器的切割工具。

公开(公告)号：EP0876691A1

公开(公告)日：1998-11-11

申请号：EP96933660.0

申请日：1996-10-21

Applicant: Koninklijke Philips Electronics N.V.

Inventor： GODIJN, Paul, Willem ,  OUD, Martinus, Adrianus ,  DEKKER, Jan ,  WELLING, Antonius, Johannes ,  DE KEIZER, Johannes, Cornelis

IPC: H01R12 ,  H05K1 ,  H05K3

CPC classification number: H01R12/526 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10363 ,  H05K2201/10984

Abstract: The invention relates to a solder element for making electrically conducting connections on either side of a printed circuit board, comprising an electrically conducting wire which is provided with at least one body composed of solder material and flux material, wherein the body is preferably composed of solder material and provided with a recess in which the flux material is received, or the flux material is preferably accommodated between two bodies of solder material arranged on the wire.

公开(公告)号：EP0367076B1

公开(公告)日：1994-04-27

申请号：EP89119740.2

申请日：1989-10-24

Applicant: SALORA OY

Inventor： Anttio, Markku Ilmari ,  Suominen, Aarre Tapani

IPC: H05K3/34 ,  H01R9/09 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01R12/58 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/10363 ,  H05K2201/10401 ,  H05K2201/10651 ,  H05K2201/10916