Abstract:
A LED directional illumination energy-saving luminaire and a manufacturing method thereof. The luminaire comprises: a circuit board with an X direction and a Y direction defined; and illumination units including a first illumination unit arranged at the center of the circuit board, and two second illumination units arranged at both sides of the first illumination unit. Each illumination unit includes LEDs mounted to said circuit board in a tilted state with said LED bodies positioned at a predetermined height from the circuit board, and said LEDs are arranged at intervals in an array along said X direction and Y direction and distributed with respect to the center of said array. Each LED deviates from both X and Y directions at a predeterminative angle, so that the illumination units can form predeterminative project angles in the X direction and the Y direction respectively.
Abstract:
There is provided a liquid ejecting head including a channel forming member in which a pressure generating chamber is provided, a piezoelectric element that is provided at one surface side of the channel forming member, a terminal portion electrically connected to the piezoelectric element; the terminal portion being provided at the one surface side of the channel forming member, a wiring substrate which has a wiring layer, and an adhesive layer for electrically connecting the wiring layer and the terminal portion and for combing the wiring substrate and the channel forming member, the adhesive layer being formed by an anisotropic conductive material. A gap layer that is electrically discontinuous with the terminal portion and the wiring layer is provided on at least one surface of the channel forming member and the wiring substrate in an area in which the adhesive layer is provided.
Abstract:
A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.
Abstract:
An integrated light-emitting diode (LED) indicator display assembly having a carrier plate including a plurality of LED mounting steps. Electrical contact leads for LEDs carried on the mounting steps extend through openings in the mounting steps and out the bottom side of the carrier plate for engaging a metal fret to power the LED array. Preferably, a vibration dampening member is positioned between the LED and the LED mounting step, and a protective covering is applied over the metal fret along the bottom side of the carrier plate to enclose the metal fret and secures the metal fret in place.
Abstract:
A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.
Abstract:
A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.
Abstract:
An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs. In another aspect of the invention an LED task light includes a transparent tube and an LED lighting array disposed within the tube. An electrical drive circuit associated with the mounting substrate within the tube provides pulsed direct current for driving the LED's.
Abstract:
An integrated light-emitting diode (LED) indicator display assembly having a carrier plate including a plurality of LED mounting steps. Electrical contact leads for LEDs carried on the mounting steps extend through openings in the mounting steps and out the bottom side of the carrier plate for engaging a metal fret to power the LED array. Preferably, a vibration dampening member is positioned between the LED and the LED mounting step, and a protective covering is applied over the metal fret along the bottom side of the carrier plate to enclose the metal fret and secures the metal fret in place.
Abstract:
A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.
Abstract:
An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.