公开(公告)号：EP2568784A3

公开(公告)日：2013-12-11

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H05K5/02 ,  H01R24/60

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

公开(公告)号：EP2151862A1

公开(公告)日：2010-02-10

申请号：EP08752712.3

申请日：2008-05-14

Applicant: Shindo Company, Ltd.

Inventor： RYUTANI, Katsuhiro

IPC: H01L23/12 ,  G02F1/1345 ,  G09F9/00

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L23/13 ,  H01L23/49838 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/189 ,  H05K3/005 ,  H05K3/0052 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor device in which a semiconductor has good heat dissipation efficiency, a display employing such a semiconductor device and a method for manufacturing a semiconductor device. A conductive pattern providing a semiconductor-connecting terminal portion and further providing first and second external-connection terminal portion on the opposite sides of the semiconductor-connecting terminal portion is formed on the surface of a flexible insulating substrate to produce a flexible printed wiring board on which a semiconductor is mounted and connected with the semiconductor-connecting terminal portion in the conductive pattern. In such a semiconductor device, a slit is formed in the insulating substrate to surround the semiconductor while leaving a part around the semiconductor thus providing a semiconductor holding part. The insulating substrate is turned down such that the surface comes inside excepting the semiconductor holding part, and the slit is formed such that the mounted semiconductor projects from the backside of the insulating substrate to the outside when the first and second external-connection terminal portion are connected, respectively, with other components.

Abstract translation: 一种半导体器件，其中半导体具有良好的散热效率，显示用人寻求一种半导体器件以及制造半导体器件的方法。 的导电图案提供半导体连接用端子部和另外的半导体连接用端子部的相对侧上提供第一和第二外部连接端子部分被形成在柔性绝缘基板的表面上产生的柔性印刷布线板上 其中半导体被安装并用在导电图案的半导体连接用端子部连接。 在寻求一种半导体器件，狭缝设置在绝缘基片形成为围绕半导体，同时留下围绕半导体的一部分，从而提供半导体保持部。 绝缘基板被调低搜索DASS模具表面作为内侧以外的半导体保持部，并且形成检查并安装从绝缘基板向外部当第一和第二外部连接端子部分的背面侧半导体项目狭缝 连接，分别与其他组分。

公开(公告)号：EP1946625A1

公开(公告)日：2008-07-23

申请号：EP06807009.3

申请日：2006-10-05

Applicant: Continental Automotive GmbH ,  ZF FRIEDRICHSHAFEN AG

Inventor： WOLF, Daniela ,  REKOFSKY, Andreas ,  INGENBLEEK, Robert ,  JUNG, Erik ,  KOLB, Alfred ,  SCHÖLLHORN, Roland

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/049 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The inventive electronic circuit arrangement (10) comprises a heat sink (12) and a first circuit carrier (16) which is thermally coupled to the heat sink (12), lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component (34-1) is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component (34-1) and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component (34-1) is arranged under a second circuit carrier (18-1) which is held in a recess (24-1) in the first circuit carrier (16), said recess passing through to the top side (14) of the heat sink (12).

公开(公告)号：EP1906719A1

公开(公告)日：2008-04-02

申请号：EP07018411.4

申请日：2007-09-19

Applicant: Denso Corporation

Inventor： Kashiwazaki, Atsushi

IPC: H05K3/32 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/181 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/09745 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10924 ,  H05K2203/049 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic controller (100) having a circuit board (110) with an element (112) disposed thereon, a base member (130) with the circuit board (110) adhered thereon and a lead terminal (150) in an electrical connection with the circuit board (110) includes as the element (112) thick film resistors (113) and electric components (114) soldered by solder (117) on a bottom side of the circuit board (110), and also includes electronic components (115) including bare chips (115a, 115b) being at least wired without soldering on a top surface of the circuit board (110). The electronic controller (100) has a first concave portion (131) at a position corresponding to a position of the components (114) on a surface that has the circuit board (110) of the base member (130) adhered thereon, and the circuit board (110) is molded by a sealing resin (170) so as to expose a portion of the base member (130) and a portion of the lead terminal (150).

Abstract translation: 一种电子控制器（100），具有设置在其上的元件（112）的电路板（110），其上粘附有电路板（110）的基座构件（130）和与该电路板（110）电连接的引线端子 电路板（110）包括作为电路板（110）的底面上的作为元件（112）的厚膜电阻器（113）和由焊料（117）焊接的电气部件（114），并且还包括电子部件（115） 包括在电路板（110）的顶表面上至少布线而不焊接裸芯片（115a，115b）。 电子控制器（100）具有在与基座部件（130）的电路基板（110）粘接在其上的表面上的部件（114）的位置对应的位置处的第一凹部（131） 电路板（110）由密封树脂（170）模制，以便露出基底构件（130）的一部分和引线端子（150）的一部分。

公开(公告)号：EP1864324A2

公开(公告)日：2007-12-12

申请号：EP06707427.8

申请日：2006-03-04

Applicant: Sew-Eurodrive GmbH & Co. KG

Inventor： PRAUTZSCH, Harald

IPC: H01L23/34 ,  H01L23/373

CPC classification number: H01L23/34 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/62 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: The invention relates to a method for determining the temperature of a heat source and an electronic device comprising a printed circuit board that is equipped with a sensor and a heat sink, said sensor and heat sink being connected in a thermally conductive manner.

公开(公告)号：EP1734800A2

公开(公告)日：2006-12-20

申请号：EP06076163.2

申请日：2006-06-02

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A.

IPC: H05K3/28 ,  H05K3/00 ,  H05K5/00

CPC classification number: H01L23/3121 ,  H01L23/4334 ,  H01L25/0652 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K7/20854 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A technique for manufacturing an electronic assembly (300) includes a number of steps. Initially, a backplate (302) with a cavity (319) formed into a first side of the backplate (302) is provided. Next, a substrate (304) with a first side of an integrated circuit (IC) die (306A) mounted to a first side of the substrate (304) is provided. The IC die (306A) is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate (304). The substrate (304) includes a hole (320) approximate an outer edge of the IC die (306A). The first side of the substrate (304) is then positioned in contact with at least a portion of the first side of the backplate (302). The IC die (306A) is positioned within the cavity (319) with a second side of the IC die (306A) in thermal contact with the backplate (302). The substrate (304) and at least a portion of the backplate (302) are overmolded with an overmold material (350), which enters the cavity (319) through the hole to substantially underfill the IC die (306A) and substantially fill an unoccupied portion of the cavity (319).

Abstract translation: 一种用于制造电子组件（300）的技术包括多个步骤。 首先，设置有形成在背板（302）的第一侧上的空腔（319）的背板（302）。 接下来，提供安装在基板（304）的第一侧的具有集成电路（IC）管芯（306A）的第一侧的基板（304）。 IC管芯（306A）电连接到形成在衬底（304）的第一侧上的多个导电迹线中的一个或多个。 基板（304）包括近似于IC管芯（306A）的外边缘的孔（320）。 然后将衬底（304）的第一侧定位成与背板（302）的第一侧的至少一部分接触。 IC模具（306A）位于空腔（319）内，IC芯片（306A）的第二面与背板（302）热接触。 衬底（304）和背板（302）的至少一部分用包覆成型材料（350）包覆成型，该二次模制材料通过孔进入空腔（319），以基本上填充IC管芯（306A）并基本上填充未占用 空腔（319）的一部分。

公开(公告)号：EP1604400A2

公开(公告)日：2005-12-14

申请号：EP04709509.6

申请日：2004-02-09

Applicant: INTEL CORPORATION

Inventor： MALLIK, Debendra ,  SANKMAN, Bob

IPC: H01L23/498 ,  H01L23/14 ,  H01L23/34

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/1056 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

公开(公告)号：EP1182768A2

公开(公告)日：2002-02-27

申请号：EP01307112.1

申请日：2001-08-21

Applicant: VLT CORPORATION

Inventor： Saxelby, John R. Jr. ,  Vinciarelli, Patrizio ,  Evans, Michael D.

IPC: H02M3/00

CPC classification number: H05K5/064 ,  H01L2224/05553 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K3/284 ,  H05K7/209 ,  H05K2201/1056 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1 °C - in 2 /Watt.

Abstract translation: 电力转换器组件包括散热板，电路板结构，其侧面面向并与散热板的更靠近所述侧的表面间隔开一个较薄的高热密度散射半导体 安装在所述侧面的部件，填充间隙的封装材料以及相对较高，较低的热密度，安装在电路板的另一侧上的部件，该间隙的特征在于平均热阻小于1℃ <2> /瓦特。

公开(公告)号：EP0717443B1

公开(公告)日：1999-03-03

申请号：EP95923573.0

申请日：1995-07-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： YASUHO, Takeo ,  IWATA, Masao ,  KATSURAGAWA, Ryoichi ,  MATSUNAGA, Hayami ,  SUEHIRO, Yoshikazu ,  YOKOTA, Yasuhiko

IPC: H01L25/10 ,  H01L25/18 ,  H05K1/14 ,  H05K7/02

CPC classification number: H05K7/1092 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/056 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/09781 ,  H05K2201/10318 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

Abstract: An integrated circuit device which has an excellent heat radiating property and is used for such consumer products as electronic equipment, electric equipment, communication equipment, and measurement control equipment, etc. A power source (4) and a plurality of pin terminals (5) are mounted on a metal plate (1). A cache controller (10), a cache memory section (11), a data buffer (LSI) section (14), a (CPU) chip (8), and a connector (12) are mounted on a multiplayer circuit wiring board (7). The plate (1) mounted with the power source (4) is attached to the rear surface of the board (7) through the pin terminals (5). Therefore, an integrated circuit device such that the degree of integration is improved and heat radiating parts have excellent heat radiating properties is provided.

公开(公告)号：EP0779775A1

公开(公告)日：1997-06-18

申请号：EP96402679.3

申请日：1996-12-10

Applicant: VALEO ELECTRONIQUE

Inventor： Herzberger, Erick ,  Wacheux, Patrick ,  Nicolai, Jean-Marc ,  Cassese, Bruno

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0256 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/0338 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2201/10977

Abstract: Assemblage électronique comportant un drain thermique, ainsi qu'une carte à circuits imprimés double face assemblée par pressage à chaud sur ledit drain thermique (12), ladite carte (11) portant sur sa face opposée audit drain thermique (12) une pluralité de composants (13) à montage de surface, caractérisé en ce que ladite carte (11) porte également au moins un composant traversant (13a, 13b), le drain thermique (12) présentant un évidement (14) au droit de la zone de la carte (11) à circuits imprimés qui reçoit ce composant traversant (13a, 13b), les extrémités des pattes dudit composant étant soudées sur ladite carte (11) à l'intérieur dudit évidement (14).

Abstract translation: 高压变压器电路板具有与在上隔离表面（12A）由铝制成的中心的热导体（12）。 存在上的印刷电路板，和下密封板（16）。 部件（13）可以被表面安装在所述上部电路板。 其它部件通过焊接到在热导体的孔的侧部（14），其安装。 所述电路板通过热压装配。