Abstract:
A component alignment casing system (10) for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component (12) which has a plurality of exposed leads (28), a prepared component (14) which has a plurality of exposed traces (16), an alignment base (18) onto which the prepared component (14) and the surface mountable component (12) are laid, and a compressive cover (20) that attaches to said alignment base (18). The alignment base (18) has a plurality of alignment ribs (22) to isolate and align the exposed traces (16) of the prepared component (14). The prepared component (14) and the at least one surface mountable components (12) are electrically connected and attached together, preferably by soldering. The method includes laying the prepared component (14) on the alignment base (18) and ribs (22), and overlaying the surface mountable component (12), with its exposed leads (28), onto the alignment base (18) and the prepared component (14), and electrically connecting the components together, preferably by soldering, to the alignment base (18). The cover (20) is then snapped on, and supplies compressive force to assure good contact between the leads (28) of the surface mountable component (12) and the traces (16) of the prepared component (14).
Abstract:
A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.
Abstract:
The invention relates to an electronic control unit, in particular of a motor vehicle brake system, comprising at least one circuit carrier (5) for electronic components. At least one electronic component (1) has at least one electrical conductor (2). The electronic control unit is further distinguished in that the electrical conductor (2) of the electronic component (1) is connected to at least one contact element (3) mechanically and in an electrically conductive manner and the contact element (3) is connected to at least one contact point (4) of the circuit carrier (5) mechanically and in an electrically conductive manner, at least the mechanical and electrically conductive connection of the electrical conductor (2) to the contact element (3) being a connection established by means of ultrasonic welding. The invention further relates to a method for arranging at least one electronic component on and electrically connecting said at least one electronic component to a circuit carrier of an electronic control unit.
Abstract:
Die Erfindung betrifft eine Bildsensor-Baugruppe für eine Kamera, vorzugsweise eine digitale Industriekamera, mit einer Leiterplatte (5) und einem oder mehreren elektronischen Bauteilen, ein Verfahren zu deren Herstellung und ein Biegewerkzeug, wobei zumindest eines der Bauteile ein modifizierter THD-Bildsensor (54) ist, der mittels eines angepassten Biegewerkzeugs modifizierte Bildsensor-Drahtanschlüsse aufweist, die durch ein Fertigungsverfahren auf der Oberfläche der Leiterplatte (5) montiert werden, so dass die Drahtanschlüsse nicht durch die Leiterplatte (5) durchgesteckt und verlötet werden müssen und dass sie eine Referenz zu einer optisch sensitiven Fläche des Bildsensors (54) bilden. Der modifizierte THD-Bildsensor (54) kann somit in einem SMD-Fertigungsprozess bestückt werden.
Abstract:
An LED assembly includes a circuit board, one or more LED modules, one or more positioning plates and a heat dissipating plate. One or more openings are disposed in the circuit board. An electric terminal is provided on either side of each hole. A circuit pattern is provided on the circuit board to allow a parallel connection of each electric terminal. The heat dissipating plate is installed under the circuit board. Several connective holes are provided in the heat dissipating plate. In assembly, each hole is aligned with the corresponding LED module and the positioning plate is installed on top of the corresponding LED module. Several fasteners are used to fixedly connect the positioning plates, LED modules, circuit board and heat dissipating plate together. Therefore, the LED modules may be securely fixed.
Abstract:
The invention relates to a method for producing a device comprising a transponder antenna connected to contact pins, said method comprising the steps of: providing or producing an antenna (3) with terminal connections (7b, 8b) in contact with a substrate, placing the contact pad (5, 6) on the substrate ad connecting the same to the terminal sections of the antenna (7b, 8b), the connection being produced by means of a soldering (38) by introducing energy between the pads (5, 6) and the terminal sections (7b, 8b). The method is characterised in that the pads (5, 6) are placed such as to provide a surface (40) facing an antenna terminal connection section (7b, 8b), said section being arranged on the substrate (2, 2b, 2f ) and the soldering energy being directly applied to the pads (5, 6). The invention also relates to the device obtained.
Abstract:
Es wird eine Bauteilanordnung mit einem elektronischen Bauteil (10) mit wenigstens einem elektrischen Anschlusspin (16); einer Leiterplatte (12) mit wenigstens einer elektrischen Kontaktfläche (14), mit welcher der Anschlusspin (16) des Bauteils (10) in elektrisch leitendem Kontakt steht; und einer Befestigungsvorrichtung zum Sichern des elektrisch leitenden Kontakts zwischen dem Anschlusspin (16) und der Kontaktfläche (14) vorgesehen, bei welchem der Anschlusspin (16) in seinem Endbereich (18) im Wesentlichen parallel zur Leiterplatte (12) verlaufend ausgebildet ist; die Kontaktfläche (14) im Randbereich der Leiterplatte (12) angeordnet ist; und die Befestigungsvorrichtung eine auf den Rand der Leiterplatte (12) aufschiebbare Klemme (20) aufweist, die einen ersten Abschnitt (22) auf der der Kontaktfläche (14) abgewandten Seite der Leiterplatte (12) und einen zweiten Abschnitt (24) auf der der Kontaktfläche (14) zugewandten Seite der Leiterplatte aufweist, welche die Leiterplatte (12), die Kontaktfläche (14) und den Endbereich (18) des Anschlusspins (16) so zwischen sich aufnehmen, dass der Endbereich (18) des Anschlusspins (16) gegen die Kontaktfläche (14) der Leiterplatte (12) gedrückt wird. Eine bevorzugte Anwendung wird zum Beispiel in der lötfreien Verbindung eines Displays mit einer Leiterplatte bei einer Herdschaltuhr gesehen.