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    TWO-DIMENSIONAL UV COMPATIBLE PROGRAMMABLE SPATIAL FILTER
    131.
    发明申请
    TWO-DIMENSIONAL UV COMPATIBLE PROGRAMMABLE SPATIAL FILTER 有权
    二维UV兼容可编程空间滤波器

    公开(公告)号：US20040001198A1

    公开(公告)日：2004-01-01

    申请号：US10163762

    申请日：2002-06-04

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： Dieter E. Wilk ,  Anlun Tang ,  Eric N. Vella ,  Rex Runyon ,  Jamie Michael Sullivan ,  Ralph Thomas Johnson

    IPC: G01N021/00

    CPC classification number: G02B27/46 ,  G01N21/95623

    Abstract: Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 null per square. The PSF provides selective filtering in two directions. In other words, the PSF provides two dimensional filtering.

    Abstract translation: 公开了一种用于选择性地过滤在光学系统内被检查的样品发出的光的空间部分的机构。 在一个实施例中，可编程空间滤波器（PSF）由与UV波长范围的一部分中的光兼容的材料构成。 在具体实施方案中，PSF由诸如聚合物稳定的液晶材料的UV相容材料构成。 在另一方面，PSF还包括由UV级玻璃形成的一对板。 PSF还可以包括相对薄的第一和第二ITO层，其导致约100和约300Ω/平方之间的薄层电阻。 PSF在两个方向提供选择性滤波。 换句话说，PSF提供二维滤波。

    UV compatible programmable spatial filter
    132.
    发明申请
    UV compatible programmable spatial filter 有权
    UV兼容可编程空间滤波器

    公开(公告)号：US20030184739A1

    公开(公告)日：2003-10-02

    申请号：US10163398

    申请日：2002-06-04

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： Dieter E. Wilk ,  Anlun Tang ,  Eric N. Vella ,  J. Rex Runyon ,  Jamie M. Sullivan

    IPC: G01N021/00

    CPC classification number: G01N21/95623 ,  G02B27/46 ,  G02F2001/13775 ,  G02F2203/055

    Abstract: Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 null per square.

    Abstract translation: 公开了一种用于选择性地过滤在光学系统内被检查的样品发出的光的空间部分的机构。 在一个实施例中，可编程空间滤波器（PSF）由与UV波长范围的一部分中的光兼容的材料构成。 在具体实施方案中，PSF由诸如聚合物稳定的液晶材料的UV相容材料构成。 在另一方面，PSF还包括由UV级玻璃形成的一对板。 PSF还可以包括相对薄的第一和第二ITO层，其导致约100和约300Ω/平方之间的薄层电阻。

    Simultaneous flooding and inspection for charge control in an electron beam inspection machine
    134.
    发明申请
    Simultaneous flooding and inspection for charge control in an electron beam inspection machine 有权
    电子束检查机中充电控制的同时淹没和检查

    公开(公告)号：US20020130260A1

    公开(公告)日：2002-09-19

    申请号：US09912732

    申请日：2001-07-23

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： Mark A. McCord ,  David Walker ,  Jun Pei ,  Neil Richardson

    IPC: H01J037/256 ,  H01J037/28 ,  G01N023/225

    CPC classification number: H01J37/28 ,  G01N23/225 ,  H01J2237/004 ,  H01J2237/2817

    Abstract: Disclosed are methods and apparatus for simultaneously flooding a sample (e.g., a semiconductor wafer) to control charge and inspecting the sample. The apparatus includes a charged particle beam generator arranged to generate a charged particle beam substantially towards a first portion of the sample and a flood gun for generating a second beam towards a second portion of the sample. The second beam is generated substantially simultaneously with the inspection beam. The apparatus further includes a detector arranged to detect charged particles originating from the sample portion. In a further implementation, the apparatus further includes an image generator for generating an image of the first portion of the sample from the detected particles. In one embodiment, the sample is a semiconductor wafer. In a method aspect, a first area of a sample is flooded with a flood beam to control charge on a surface of the sample. A second area of the sample is inspected with an inspection beam. The second area comprises at least a portion of the first area flooded by the flood beam. The inspection beam moves in tandem with the flood beam. In another aspect of the present invention, methods and apparatus are provided for controlling the charge buildup of an area of the sample by an electrode having a voltage applied to it and through which the flood beam and charged particles emitted from the area of the sample can pass.

    Abstract translation: 公开了用于同时淹没样品（例如，半导体晶片）以控制电荷并检查样品的方法和装置。 该装置包括带电粒子束发生器，其布置成基本上朝向样品的第一部分产生带电粒子束，以及用于产生朝向样品的第二部分的第二束的泛喷枪。 第二光束基本上与检查光束同时产生。 该装置还包括检测器，其被布置成检测源自样品部分的带电粒子。 在另一实施方式中，该装置还包括图像发生器，用于从检测到的粒子生成样品的第一部分的图像。 在一个实施例中，样品是半导体晶片。 在方法方面，样品的第一区域用泛光束淹没以控制样品表面上的电荷。 用检查梁检查样品的第二个区域。 第二区域包括由洪水束淹没的第一区域的至少一部分。 检查梁与洪水束一起移动。 在本发明的另一方面，提供了一种方法和装置，用于通过施加有电压的电极来控制样品区域的电荷积累，通过该电极，从样品区域发射的泛光束和带电粒子可以 通过。

    Methods and Systems for Inspection of Wafers and Reticles Using Designer Intent Data
    137.
    发明申请
    Methods and Systems for Inspection of Wafers and Reticles Using Designer Intent Data 审中-公开
    使用设计者意图数据检查晶圆和网状物的方法和系统

    公开(公告)号：US20150178914A1

    公开(公告)日：2015-06-25

    申请号：US14639061

    申请日：2015-03-04

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

    IPC: G06T7/00

    CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/30148

    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

    Abstract translation: 提供了使用设计人员意图数据检查晶圆和标线的方法和系统。 一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。 另一种计算机实现的方法包括通过结合表示标线的数据分析由晶片的检查产生的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。 附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。 进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

    Methods and Systems for Determining a Critical Dimension and Overlay of a Specimen
    138.
    发明申请
    Methods and Systems for Determining a Critical Dimension and Overlay of a Specimen 审中-公开
    用于确定样品的临界尺寸和覆盖层的方法和系统

    公开(公告)号：US20130314710A1

    公开(公告)日：2013-11-28

    申请号：US13959621

    申请日：2013-08-05

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

    Inventor： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

    IPC: G01N21/27

    CPC classification number: G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

    Abstract translation: 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

    Process for identifying defects in a substrate having non-uniform surface properties
    139.
    发明申请
    Process for identifying defects in a substrate having non-uniform surface properties 有权

    公开(公告)号：US20040066507A1

    公开(公告)日：2004-04-08

    申请号：US10327484

    申请日：2002-12-20

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： George J. Kren ,  Mehdi Vaez-Iravani ,  David W. Shortt

    IPC: G01N021/00

    CPC classification number: G01N21/9501

    Abstract: A surface inspection method of the invention includes scanning an inspection surface taking surface measurements. Determinations of various noise levels in the surface are made based on variations in the surface measurements. A dynamic threshold is then determined. The dynamic threshold adapts to the noise levels in the inspection surface to provide a varying threshold that can provide areas of high and low defect sensitivity on the same inspection surface. Defects are then identified by comparing surface measurements with the dynamic threshold. Additionally, the invention includes a surface inspection method that uses signal-to-noise ratios to identify defects. Such a method scans an inspection surface to obtain surface measurements. Noise levels associated with the inspection surface are then determined. Signal-to-noise ratios are determined for the surface measurements. The signal-to-noise ratios are compared with a signal-to-noise ratio threshold value. Defects are identified based on the comparisons of the signal-to-noise ratio of the surface measurements with the signal-to-noise ratio threshold value.

    Inspection system with multiple illumination sources
    140.
    发明申请
    Inspection system with multiple illumination sources 有权

    公开(公告)号：US20040012774A1

    公开(公告)日：2004-01-22

    申请号：US10268340

    申请日：2002-10-09

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： Steven R. Lange

    IPC: G01N021/88

    CPC classification number: G01N21/9501 ,  G01N21/8806

    Abstract: The present invention pertains to techniques for increasing the available illumination light, increasing the resolution, and optimizing the spectrum of optical inspection systems. These techniques involve combining the light beams from two or more separate illumination sources. In one embodiment, this performed by utilizing two separate illumination sources wherein one of the illumination sources compensates the other illumination source in the wavelength range where illumination light intensity is low. Specifically, this can be performed by utilizing a broadband illumination source and a narrowband illumination source combined with dichroic beamsplitters.

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