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公开(公告)号：WO2013059006A1
公开(公告)日：2013-04-25
申请号：PCT/US2012/059075
申请日：2012-10-05
Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
Inventor： BOS, Jan , HEALD, David , LIN, Yen Hua , LAI, Yung-Wei , LIAO, Jui-Chih , TAN, Yoke-Hou , TADEPALLI, Nageswara Rao , DU, Yan , LIU, Jianwei , PIETRI, Richard
CPC classification number: G02B26/001 , B81B3/0005 , B81C1/00285 , B81C2201/112
Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.
Abstract translation: 本公开提供了用于制造机电系统（EMS）封装的装置，系统和方法。 一种方法包括制造包含无气体防粘涂层的EMS包装。 抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。 在一些实施方式中，该方法包括将EMS装置密封到包装中，然后使用排出至少一部分残留溶剂的温度曲线来加热包装。 该方法可以包括孵育烘烤循环，以将抗静电材料分配到EMS包装内的显示元件。 温育烘烤循环还可以更均匀地分布EMS包装内的污染物，以减少其影响。
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公开(公告)号：WO2011115578A1
公开(公告)日：2011-09-22
申请号：PCT/SG2011/000104
申请日：2011-03-17
Applicant: NATIONAL UNIVERSITY OF SINGAPORE , SINHA, Sujeet, Kumar , LEONG, Jonathan, Yonghui , NALAM, Satyanarayana , YU, Hongbin , VIJAYAN, Harikumar , ZHOU, Guangya
Inventor： SINHA, Sujeet, Kumar , LEONG, Jonathan, Yonghui , NALAM, Satyanarayana , YU, Hongbin , VIJAYAN, Harikumar , ZHOU, Guangya
CPC classification number: B05D5/00 , B05C5/00 , B81B3/0005 , B81C1/00984 , B81C2201/0197 , B81C2201/112 , C10M107/32 , Y10T428/24793 , Y10T428/24802
Abstract: According to an embodiment of the present invention, a method of applying a lubricant to a micromechanical device is provided. The method includes: positioning a dispensing portion of a lubricant liquid dispenser over a surface portion of a micromechanical device; and controlling the dispenser such that a single lubricant liquid droplet of a predefined volume is forced out of the dispensing portion and impinges onto the surface portion.
Abstract translation: 根据本发明的一个实施例，提供了一种向微机械装置施加润滑剂的方法。 该方法包括：将润滑剂液体分配器的分配部分定位在微机械装置的表面部分上; 并且控制分配器，使得预定体积的单个润滑剂液滴被迫离开分配部分并撞击到表面部分上。
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133.发明申请
公开(公告)号：WO2009083565A3
公开(公告)日：2009-09-11
申请号：PCT/EP2008068283
申请日：2008-12-24
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , CAPLET STEPHANE
Inventor： CAPLET STEPHANE
IPC: B81C1/00
CPC classification number: B81C1/0096 , B81B3/0005 , B81C2201/112
Abstract: The invention relates to a micromechanical and/or nanomechanical device (100) comprising a first member (108) containing a semiconductor and mobile relative to a second member (106) of the device also containing a semiconductor, the first mobile member being capable of movement opposite a cavity formed in the device, wherein walls of the first mobile member, provided opposite a wall of the second member and a wall of the cavity containing a semiconductor material, can be brought into contact with said walls of the second member and the cavity, and said walls of the first mobile member, of the second member and of the cavity are at least partially coated with a conducting anti-bonding material (118) so that the conducting anti-bonding material covering said walls of the second member and of the cavity is provided at least partially opposite the conducting anti-bonding material covering said walls of the first mobile member.
Abstract translation: 本发明涉及一种微机械和/或纳米机械装置（100），其包括第一构件（108），所述第一构件（108）包含半导体并且相对于还包含半导体的所述装置的第二构件（106）可移动，所述第一移动构件能够移动 与形成在该装置中的空腔相对，其中与第二构件的壁相对设置的第一可移动构件的壁和容纳半导体材料的空腔的壁可以与第二构件和空腔的壁接触 ，并且所述第一移动构件，所述第二构件和所述空腔的所述壁至少部分地涂覆有导电抗粘合材料（118），使得覆盖所述第二构件的所述壁的导电抗粘合材料和 所述空腔至少部分地与覆盖所述第一移动构件的所述壁的导电抗粘合材料相对。
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公开(公告)号：WO2009006340A3
公开(公告)日：2009-03-26
申请号：PCT/US2008068655
申请日：2008-06-27
Applicant: QUALCOMM MEMS TECHNOLOGIES INC , NATARAJAN BANGALORE R , KHAZENI KASRA , HEALD DAVID , HE RIHUI , AKELLA SRIRAM , GOUSEV EVGENI
Inventor： NATARAJAN BANGALORE R , KHAZENI KASRA , HEALD DAVID , HE RIHUI , AKELLA SRIRAM , GOUSEV EVGENI
CPC classification number: B81C1/0092 , B81B3/0005 , B81B2201/047 , B81C2201/112 , G02B26/001
Abstract: Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
Abstract translation: 方法，装置和系统提供了使用用水蒸气处理的MEMS器件表现出减小静摩擦，降低亲水性或降低某些电特性的可变性中的至少一种的MEMS器件。 认为该处理在MEMS器件的内部和/或外部上形成一个或多个钝化表面。 相对平缓的温度和压力条件确保了在去除牺牲材料以释放MEMS器件之后没有过量吸水的表面化学修饰。
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公开(公告)号：WO2009006340A2
公开(公告)日：2009-01-08
申请号：PCT/US2008/068655
申请日：2008-06-27
Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. , NATARAJAN, Bangalore, R. , KHAZENI, Kasra , HEALD, David , HE, Rihui , AKELLA, Sriram , GOUSEV, Evgeni
Inventor： NATARAJAN, Bangalore, R. , KHAZENI, Kasra , HEALD, David , HE, Rihui , AKELLA, Sriram , GOUSEV, Evgeni
IPC: B81C1/00
CPC classification number: B81C1/0092 , B81B3/0005 , B81B2201/047 , B81C2201/112 , G02B26/001
Abstract: Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
Abstract translation: 方法，装置和系统提供使用用水蒸汽处理的MEMS装置展现降低的静摩擦，降低的亲水性或某些电气特性的变化性中的至少一个的MEMS装置。 认为处理在MEMS器件的内部和/或外部形成一个或多个钝化表面。 相对温和的温度和压力条件确保在去除牺牲材料以释放MEMS器件之后，不改变表面化学性质而不过度吸水。
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Patent Agency Ranking
公开(公告)号：WO2008049688A1
公开(公告)日：2008-05-02
申请号：PCT/EP2007/059448
申请日：2007-09-10
Applicant: ROBERT BOSCH GMBH , LAERMER, Franz , KRONMUELLER, Silvia , FUCHS, Tino
Inventor： LAERMER, Franz , KRONMUELLER, Silvia , FUCHS, Tino
IPC: B81C1/00
CPC classification number: B81C1/0096 , B81B3/0005 , B81C2201/112 , B81C2203/0109 , B81C2203/031
Abstract: Es wird ein mikromechanisches Bauelement mit einem Substrat und einem Funktionselement vorgeschlagen, wobei das Funktionselement eine Funktionsoberfläche mit einer wenigstens bereichsweise aufgebrachten Antihaftschicht zur Reduzierung von Oberflächenhaftkräften aufweist, wobei ferner die Antihaftschicht gegenüber einer Temperatur von über 800 °C stabil ist.
Abstract translation: 它与基板和功能元件，其中，所述功能元件具有与至少局部地施加抗粘附层用于降低表面的粘附力的功能表面提出了一个微机械部件，进一步地，其中所述非粘性层，以高于800℃的温度下是稳定的。
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公开(公告)号：WO2006138126A2
公开(公告)日：2006-12-28
申请号：PCT/US2006022076
申请日：2006-06-07
Applicant: INNOVATIVE MICRO TECHNOLOGY , RUBEL PAUL J
Inventor： RUBEL PAUL J
CPC classification number: C23C16/56 , B81B3/0005 , B81B3/001 , B81C2201/112 , C23C16/345
Abstract: A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer.
Abstract translation: 用于制造MEMS器件的复合晶片设置有埋在复合晶片的器件层下方的多个抗静电凸块。 通过在复合晶片的组装之前图案化抗静电材料，制备抗静电凸块。
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公开(公告)号：WO2005019351A2
公开(公告)日：2005-03-03
申请号：PCT/US2004/024084
申请日：2004-07-27
Applicant: MICROSURFACES, INC. , ZHU, Xiaoyang
Inventor： ZHU, Xiaoyang
IPC: C09D
CPC classification number: C09D4/00 , B05D1/185 , B05D5/083 , B81B3/0005 , B81C1/0096 , B81C2201/112 , B82Y30/00 , C08G77/04 , C08G77/24
Abstract: The present invention provides unique methods of coating and novel coatings for MEMS devices. In general a two step process includes the coating of a first silane onto a substrate surface followed by a second treatment with or without a second silane and elevated temperatures.
Abstract translation: 本发明提供了用于MEMS器件的独特的涂层方法和新型涂层。 通常，两步法包括将第一硅烷涂覆在基材表面上，随后进行第二次硅烷处理或不使用第二硅烷和升高的温度。
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公开(公告)号：WO2004033364A3
公开(公告)日：2004-10-28
申请号：PCT/US0332250
申请日：2003-10-10
Applicant: UNIV MINNESOTA , MICROSURFACES INC
Inventor： ZHU XIAOYANG , JUN YONGSEOK , YAN HONGWEI
CPC classification number: C23C14/12 , B05D1/185 , B05D1/60 , B05D2401/90 , B81B3/0005 , B81C1/0096 , B81C2201/112 , B82Y30/00 , B82Y40/00
Abstract: A chemical approach for the attachment of molecules on a surface of a MEMS device, preferably, to provide a monolayer film thereon of relatively low surface energy.
Abstract translation: 用于将分子附着在MEMS装置的表面上的化学方法，优选地在其上提供具有相对低表面能的单层膜。
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公开(公告)号：WO2004033364A2
公开(公告)日：2004-04-22
申请号：PCT/US2003/032250
申请日：2003-10-10
Inventor： ZHU, Xioyang , JUN, Yongseok , YAN, Hongwei
IPC: B81B7/00
CPC classification number: C23C14/12 , B05D1/185 , B05D1/60 , B05D2401/90 , B81B3/0005 , B81C1/0096 , B81C2201/112 , B82Y30/00 , B82Y40/00
Abstract: A chemical approach for the attachment of molecules on a surface of a MEMS device, preferably, to provide a monolayer film thereon of relatively low surface energy.
Abstract translation: 用于在MEMS器件的表面上附着分子的化学方法，优选地在其上提供具有相对低的表面能的单层膜。
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