METHOD AND APPARATUS FOR APPLICATION OF ANTI-STICTION COATING
    131.
    发明申请
    METHOD AND APPARATUS FOR APPLICATION OF ANTI-STICTION COATING 审中-公开
    应用防粘涂料的方法和装置

    公开(公告)号:WO2013059006A1

    公开(公告)日:2013-04-25

    申请号:PCT/US2012/059075

    申请日:2012-10-05

    CPC classification number: G02B26/001 B81B3/0005 B81C1/00285 B81C2201/112

    Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

    Abstract translation: 本公开提供了用于制造机电系统(EMS)封装的装置,系统和方法。 一种方法包括制造包含无气体防粘涂层的EMS包装。 抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。 在一些实施方式中,该方法包括将EMS装置密封到包装中,然后使用排出至少一部分残留溶剂的温度曲线来加热包装。 该方法可以包括孵育烘烤循环,以将抗静电材料分配到EMS包装内的显示元件。 温育烘烤循环还可以更均匀地分布EMS包装内的污染物,以减少其影响。

    MICROMECHANICAL OR NANOMECHANICAL DEVICE WITH ANTI-BONDING INTERFACE LAYER
    133.
    发明申请
    MICROMECHANICAL OR NANOMECHANICAL DEVICE WITH ANTI-BONDING INTERFACE LAYER 审中-公开
    具有抗粘结界面层的微机械或纳米器件

    公开(公告)号:WO2009083565A3

    公开(公告)日:2009-09-11

    申请号:PCT/EP2008068283

    申请日:2008-12-24

    Inventor: CAPLET STEPHANE

    CPC classification number: B81C1/0096 B81B3/0005 B81C2201/112

    Abstract: The invention relates to a micromechanical and/or nanomechanical device (100) comprising a first member (108) containing a semiconductor and mobile relative to a second member (106) of the device also containing a semiconductor, the first mobile member being capable of movement opposite a cavity formed in the device, wherein walls of the first mobile member, provided opposite a wall of the second member and a wall of the cavity containing a semiconductor material, can be brought into contact with said walls of the second member and the cavity, and said walls of the first mobile member, of the second member and of the cavity are at least partially coated with a conducting anti-bonding material (118) so that the conducting anti-bonding material covering said walls of the second member and of the cavity is provided at least partially opposite the conducting anti-bonding material covering said walls of the first mobile member.

    Abstract translation: 本发明涉及一种微机械和/或纳米机械装置(100),其包括第一构件(108),所述第一构件(108)包含半导体并且相对于还包含半导体的所述装置的第二构件(106)可移动,所述第一移动构件能够移动 与形成在该装置中的空腔相对,其中与第二构件的壁相对设置的第一可移动构件的壁和容纳半导体材料的空腔的壁可以与第二构件和空腔的壁接触 ,并且所述第一移动构件,所述第二构件和所述空腔的所述壁至少部分地涂覆有导电抗粘合材料(118),使得覆盖所述第二构件的所述壁的导电抗粘合材料和 所述空腔至少部分地与覆盖所述第一移动构件的所述壁的导电抗粘合材料相对。

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