Abstract:
This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.
Abstract:
According to an embodiment of the present invention, a method of applying a lubricant to a micromechanical device is provided. The method includes: positioning a dispensing portion of a lubricant liquid dispenser over a surface portion of a micromechanical device; and controlling the dispenser such that a single lubricant liquid droplet of a predefined volume is forced out of the dispensing portion and impinges onto the surface portion.
Abstract:
The invention relates to a micromechanical and/or nanomechanical device (100) comprising a first member (108) containing a semiconductor and mobile relative to a second member (106) of the device also containing a semiconductor, the first mobile member being capable of movement opposite a cavity formed in the device, wherein walls of the first mobile member, provided opposite a wall of the second member and a wall of the cavity containing a semiconductor material, can be brought into contact with said walls of the second member and the cavity, and said walls of the first mobile member, of the second member and of the cavity are at least partially coated with a conducting anti-bonding material (118) so that the conducting anti-bonding material covering said walls of the second member and of the cavity is provided at least partially opposite the conducting anti-bonding material covering said walls of the first mobile member.
Abstract:
Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
Abstract:
Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
Abstract:
Es wird ein mikromechanisches Bauelement mit einem Substrat und einem Funktionselement vorgeschlagen, wobei das Funktionselement eine Funktionsoberfläche mit einer wenigstens bereichsweise aufgebrachten Antihaftschicht zur Reduzierung von Oberflächenhaftkräften aufweist, wobei ferner die Antihaftschicht gegenüber einer Temperatur von über 800 °C stabil ist.
Abstract:
A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer.
Abstract:
The present invention provides unique methods of coating and novel coatings for MEMS devices. In general a two step process includes the coating of a first silane onto a substrate surface followed by a second treatment with or without a second silane and elevated temperatures.
Abstract:
A chemical approach for the attachment of molecules on a surface of a MEMS device, preferably, to provide a monolayer film thereon of relatively low surface energy.
Abstract:
A chemical approach for the attachment of molecules on a surface of a MEMS device, preferably, to provide a monolayer film thereon of relatively low surface energy.