Abstract:
Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.
Abstract:
A polyphenylene sulfide composition useful for plating is disclosed, comprising a polyphenylene sulfide resin, glass fibers, and potassium titanate fibers. Molded articles of this composition, when plated after etching, provide a plated article which is excellent in appearance and peel strength. Thus these plated articles can be used in outer applications, such as electric parts and automobile parts.
Abstract:
A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.
Abstract:
A flexible circuit laminate is presented comprising a microglass reinforce fluoropolymer layer sandwiched between a fluoropolymer coated polyimide and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the fluoropolymer coated polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass.
Abstract:
A sheet molding material comprising (1) an interlayer containing a photopolymerizable resin and a photocuring agent for the photopolymerizable resin, and (2) a surface layer of a thermosetting resin containing a heat curing agent for the thermosetting resin on both surfaces of the interlayer (1); and a process for the production of the sheet molding material.
Abstract:
PROBLEM TO BE SOLVED: To provide a molded motor having high quality in that the motor is durable against stress concentration due to shrinkage in molding and a tension stress in mold release, and peeling is prevented in an interface between a resin and a substrate. SOLUTION: A round hole 8 is opened between each of lands 7 and is filled with a thermosetting resin 12, a glass fiber in the thermosetting resin 12 which the round hole 8 is filled with is almost oriented in the plate thickness direction of a printed board 14, and thus, the mold motor is durable against stress concentration due to shrinkage in molding and a tension stress in mold release, and peeling is prevented from being generated in the interface between the thermosetting resin 12 and the printed board 14. In this way, the molded motor 1 is provided which ensures the high quality wherein tracking never occurs even when the motor is used in a space of high temperature and high humidity. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light-permeable flexible substrate with a low coefficient of thermal expansion and an improved gas barrier property, and its manufacturing method. SOLUTION: The flexible substrate 10 includes a substrate 1 formed of cellulose-based nanofibers and low-melting glass 2 provided to be impregnated in the substrate 1. In addition, the other flexible substrate 10 includes a substrate 1 formed of cellulose-based nanofibers and low-melting glass joined to one of principal planes of the substrate 1. A glass-transition temperature of the low-melting glass 2 is 300°C or lower. The flexible substrate 10 is light-permeable. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To inexpensively obtain a nanofiber sheet in which the constituent cellulose fiber is made fine enough by fiber-opening and has a high crystallinity and which can realize a fiber-reinforced composite material having high transparency, high modulus of elasticity, a low coefficient of linear thermal expansion, high heat resistance, flatness, and smoothness. SOLUTION: The nanofiber sheet is a nanofiber sheet principally made of crystalline cellulose and has a lignin content of 10 ppm to 10 wt.% and is characterized in that a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20J/cm 2 , and heat-treating the cured product in vacuum at 160°C for 2 h and having a cured tricyclodecane dimethacrylate content of 60 wt.% and a nanofiber content of 40 wt.% satisfies the following physical properties (1) to (3): (1) a parallel light transmittance ≥70% (to light of a wavelength of 600 nm at a sheet thickness of 100μm), (2) a Young's modulus ≥5.0 GPa, and (3) a coefficient of linear thermal expansion ≤20 ppm/K. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a sheetlike composite material in which a filler is oriented in a fixed direction in an organic resin matrix by an electric field. SOLUTION: The sheetlike composite material 10 comprises a filler 1 and an organic resin 3. The filler 1 is aggregated in a dendritic state in the organic resin matrix and oriented in the thickness direction. Consequently the sheetlike composite material has greatly improved properties such as dielectric characteristics, conductivity, thermal conductivity, etc., in comparison with a conventional composite material in which a filler is simply dispersed. COPYRIGHT: (C)2008,JPO&INPIT