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    Method of manufacturing a multilayer printed wire board
    131.
    发明授权
    Method of manufacturing a multilayer printed wire board 失效
    制造多层印刷线路板的方法

    公开(公告)号：US5592737A

    公开(公告)日：1997-01-14

    申请号：US157077

    申请日：1993-12-03

    Applicant: Erik Middelman ,  Pieter H. Zuuring

    Inventor： Erik Middelman ,  Pieter H. Zuuring

    IPC: H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H05K3/4655 ,  B32B37/12 ,  H05K1/0366 ,  B32B2457/08 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249994

    Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

    Abstract translation: PCT No.PCT / EP92 / 01133 Sec。 371日期1993年12月3日第 102（e）日期1993年12月3日PCT提交1992年5月19日PCT公布。 第WO92 / 22192号公报 日期1992年12月10日一种制造多层印刷线路板的方法，也被称为多层，其包括至少两个电绝缘基板，其中至少三个表面设置有导电迹线或层，其中通过 在压力下层叠的方法，在任一侧设置有痕迹的基于UD-增强合成材料的固化的基底基板与支撑基板结合并结合到支撑基板上，其中在层压过程期间添加备用基板 至基本衬底，备用衬底包括至少在面向碱性衬底的导电迹线的一侧上提供的UD增强的固化芯层，其具有仍然可塑性（可流动的）粘合剂层，并且这种压力施加在 所述层压板使所述支撑基板的所述固化芯层与所述基底基板的导电迹线接触或实际上与所述基底基板的导电迹线接触， 这些迹线填充有粘合剂材料，因此粘合基础基板和支撑基板。

    High-frequency multilayer printed circuit board
    133.
    发明授权
    High-frequency multilayer printed circuit board 失效
    高频多层印刷电路板

    公开(公告)号：US4812792A

    公开(公告)日：1989-03-14

    申请号：US44689

    申请日：1987-05-01

    Applicant: Joseph D. Leibowitz

    Inventor： Joseph D. Leibowitz

    IPC: B32B15/08 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  H05K3/46 ,  H01P3/08 ,  H05K3/06

    CPC classification number: B32B15/08 ,  H05K1/0207 ,  H05K3/4641 ,  H05K1/0243 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/429

    Abstract: A circuit board having multiple layers of a dielectric material, multiple layers of a conductive metal and multiple layers of graphite bonded together to form a composite multilayer printed circuit board having a desired coefficient of expansion and having strip and microstrip transmission lines for electrically connecting very high frequency electronic components mounted on the circuit board. The multiple layers of graphite are positioned in a symmetrical manner with respect to the thickness of the circuit board and selected in number to provide the circuit board with a desired coefficient of expansion. In addition, at least some of the layers of graphite are positioned in close proximity to some of the layers of conductive metal to provide enhanced thermal conduction from the mounted components.

    Abstract translation: 具有多层介电材料的电路板，多层导电金属和多层石墨结合在一起以形成具有所需膨胀系数的复合多层印刷电路板，并具有用于电连接非常高的带状和微带传输线 频率电子元件安装在电路板上。 多层石墨相对于电路板的厚度以对称的方式定位，并且在数量上选择以为电路板提供所需的膨胀系数。 此外，至少一些石墨层被定位成紧邻导电金属的一些层，以提供来自所安装部件的增强的热传导。

    FABRICATION OF UNIDIRECTIONAL LAMINATE PREPREGS USING TAPE CASTING METHODS AND EQUIPMENT
    135.
    发明申请
    FABRICATION OF UNIDIRECTIONAL LAMINATE PREPREGS USING TAPE CASTING METHODS AND EQUIPMENT 审中-公开
    使用胶带铸造方法和设备制造非均匀层压板

    公开(公告)号：WO00072643A1

    公开(公告)日：2000-11-30

    申请号：PCT/US2000/014243

    申请日：2000-05-24

    IPC: B29B15/12 ,  B29C37/00 ,  B29C70/50 ,  H05K1/03 ,  H05K3/02

    CPC classification number: B29C37/0075 ,  B29B15/122 ,  B29B15/125 ,  B29C70/50 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0166 ,  H05K2201/0287

    Abstract: The present invention provides a method of forming unidirectional laminate prepreg, comprising the steps of: providing a support table; advancing a plurality of strands oriented generally parallel to each other along at least a portion of the table; positioning a removable carrier material between the strands and the table to support and move with the strands along at least a portion of the table; coating at least a portion of the strands with a resin matrix material to form a pre-cured prepreg; establishing a uniform thickness for the pre-cured prepreg; at least partially curing the matrix material of the pre-cured prepeg to form an at least partially cured prepreg; and accumulating the at least partially cured prepreg. In one nonlimiting embodiment of the invention, the strands comprise a plurality of glass fibers, the carrier material is plastic, the removing step includes the step of positioning an edge of a doctor blade in contact with an upper surface of the pre-cured prepreg to establish the thickness of the pre-cure prepreg, and the at least partially curing step includes the step of passing the pre-cured prepreg through at least one curing and drying oven.

    Abstract translation: 本发明提供一种形成单向层压预浸料的方法，包括以下步骤：提供支撑台; 沿着桌子的至少一部分推进大致平行彼此定向的多根股线; 将可移除的载体材料定位在股线和桌子之间，以沿着桌子的至少一部分沿着股线支撑和移动; 用树脂基质材料涂覆至少一部分股线以形成预固化的预浸料坯; 为预固化预浸料制定均匀的厚度; 至少部分地固化预固化的预浸料的基质材料以形成至少部分固化的预浸料; 并积聚至少部分固化的预浸料。 在本发明的一个非限制性实施例中，线束包括多个玻璃纤维，载体材料是塑料，去除步骤包括将刮刀的边缘与预固化的预浸料坯的上表面接触的步骤 确定预固化预浸料的厚度，并且至少部分固化步骤包括使预固化的预浸料通过至少一个固化和干燥炉的步骤。

    RIGID/FLEX PRINTED CIRCUIT BOARD USING ANGLED PREPREG
    136.
    发明申请
    RIGID/FLEX PRINTED CIRCUIT BOARD USING ANGLED PREPREG 审中-公开
    RIGID / FLEX打印电路板使用ANGLED PREPREG

    公开(公告)号：WO98054936A1

    公开(公告)日：1998-12-03

    申请号：PCT/US1998/011093

    申请日：1998-06-01

    IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

    CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0287 ,  H05K2201/09236 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T442/3382 ,  Y10T442/3415

    Abstract: A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges, formed by laminating a conductive layer (56) to a flexible insulator layer (60), the conductor layer containing at least one conductive pathway (50) and the flexible insulator layer comprises fibers (48) dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section, so as to be flexible.

    Abstract translation: 一种刚性柔性印刷电路板，其中所述板的挠曲部分包括通过将导电层（56）层压到柔性绝缘体层（60）而形成的具有边缘的基础复合材料，所述导体层包含至少一个导电通路（50） 并且柔性绝缘体层包括分散在基质聚合物中的纤维（48）。 纤维相对于导电路径定向，使得导电路径基本上与柔性部分中的整个导电路径基本上不对准所述纤维，从而是柔性的。

    LAMINATES FOR PRINTED CIRCUITS USING UNIDIRECTIONAL GLASS FABRIC
    137.
    发明申请
    LAMINATES FOR PRINTED CIRCUITS USING UNIDIRECTIONAL GLASS FABRIC 审中-公开
    使用独立玻璃织物印刷电路的层压板

    公开(公告)号：WO1998019506A1

    公开(公告)日：1998-05-07

    申请号：PCT/EP1997005602

    申请日：1997-10-10

    Applicant: GIVIDI ITALIA S.P.A. ,  SCARI', Diego ,  SCARI', Marco

    Inventor： GIVIDI ITALIA S.P.A.

    IPC: H05K01/03

    CPC classification number: D03D13/006 ,  D03D15/0011 ,  D03D19/00 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10S428/902 ,  Y10T442/2008 ,  Y10T442/3179 ,  Y10T442/322

    Abstract: A description is provided of laminates for printed circuits using unidirectinal glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns with different gramme weights, interlaced warpwise with a leno interwoven binding using glass yarns of 5.5 to 22 Tex at a spacing of up to 20 cm. The application of these laminates to the manufacture of printed circuits offers advantages in terms of surface roughness and waviness, dimensional stability, evenness and perforability.

    Abstract translation: 提供了印刷电路用层压板的描述，其使用由连续纱线制成的单向玻璃织物，该连续纱线被扭曲，具有不同克重重量的低捻数或零扭转匝数，使用5.5至22的玻璃纱与纬纱交织结合 Tex的间距可达20厘米。 这些层压板在制造印刷电路中的应用在表面粗糙度和波纹度，尺寸稳定性，均匀性和穿孔性方面提供了优点。

    A METHOD OF MAKING A COMPOSITE LAMINATE AND A PWB SUBSTRATE SO MADE
    139.
    发明申请
    A METHOD OF MAKING A COMPOSITE LAMINATE AND A PWB SUBSTRATE SO MADE 审中-公开
    制备复合层压板的方法及其制造方法

    公开(公告)号：WO1995020475A1

    公开(公告)日：1995-08-03

    申请号：PCT/EP1995000273

    申请日：1995-01-25

    Applicant: AKZO NOBEL N.V. ,  MIDDELMAN, Erik

    Inventor： AKZO NOBEL N.V.

    IPC: B29B15/12

    CPC classification number: B29C70/506 ,  B29B15/122 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/2905 ,  Y10T428/30 ,  Y10T428/31721 ,  Y10T442/656

    Abstract: The invention relates to a method of making a composite laminate comprising the steps of providing unidirectionally oriented parallel fibres (UD filaments) (3) with a resin matrix to form a composite UD layer and laminating a plurality of UD layers to form a UD crossply laminate (18). In the method of the invention, the UD filaments are impregnated with a melt of a resin which in the uncured form solidifies below a certain temperature (Tm). Thereupon the UD filaments-containing resin is cooled to a temperature below Tm to produce said composite UD layer. The produced composite UD layer is irreversibly cured before or after lamination. Notably latent curing resins are suitable. The impregnation is preferably conducted by coating a process belt (8) with solid resin (6), laying the UD filaments onto the resin, and heating the resin so as to form the resin melt. The heating of the resin is preferably conducted by means of IR irradiation (11).

    Abstract translation: 本发明涉及一种制备复合层压材料的方法，包括以下步骤：用树脂基质提供单向取向的平行纤维（UD长丝）（3），以形成复合UD层并层压多个UD层以形成UD交叉层压 （18）。 在本发明的方法中，UD长丝用未固化形式的树脂熔体浸渍在一定温度（Tm）以下。 随后将含有UD长丝的树脂冷却至低于Tm的温度以产生所述复合UD层。 所制备的复合UD层在层压之前或之后不可逆地固化。 潜在的固化树脂是合适的。 浸渍优选通过用固体树脂（6）涂布处理带（8），将UD长丝铺设在树脂上并加热树脂以形成树脂熔体来进行。 树脂的加热优选通过IR照射进行（11）。

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