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    Light source module
    131.
    发明授权
    Light source module 有权
    光源模块

    公开(公告)号：US07535727B2

    公开(公告)日：2009-05-19

    申请号：US11656525

    申请日：2007-01-23

    Applicant: Tsukasa Tokida

    Inventor： Tsukasa Tokida

    IPC: H05K7/00

    CPC classification number: F21V29/74 ,  F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2224/16225 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/328 ,  H05K2201/09172 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1034

    Abstract: A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.

    Abstract translation: 光源模块包括其上形成有预定导电图案的电路板，安装在电路板上的半导体发光元件和多个供电端子，用于向半导体发光元件供电的电源线为 连接的。 电路板的整个下表面是电绝缘的，并且多个供电端子固定在电路板上的导电图案上。 多个供电端子从电路板突出。

    Electronic Module Expansion Bridge
    133.
    发明申请
    Electronic Module Expansion Bridge 审中-公开
    电子模块扩展桥

    公开(公告)号：US20090025962A1

    公开(公告)日：2009-01-29

    申请号：US12088546

    申请日：2006-09-29

    Applicant: John A. Gelardi

    Inventor： John A. Gelardi

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/141 ,  H05K1/148 ,  H05K3/222 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/09172 ,  H05K2201/0969 ,  Y10T29/49147

    Abstract: Taught herein is an electronic module expansion bridge (115). In an exemplary embodiment, the bridge (115) includes a flexible mounting plate (155). In contact with the mounting plate (155) is a conductive lead (160) with at least one first contact area (165) and at least one second contact area (170). The bridge (115) is configured to connect an electronic module (110), at the first contact area (165), to a conductive trace (125) that is in contact with a substrate (105) at the second contact area (170). In one embodiment, a substrate (105) is used to form a package (100) for enclosing one or more articles. An electronic module (110) is positioned in the package (100) and connected to the conductive trace (125) via the bridge (115). In an alternative embodiment, the bridge (115) is extended to form an inner sleeve to enclose or otherwise cover or protect the electronic module (110).

    Abstract translation: 这里讲的是一个电子模块扩展桥（115）。 在示例性实施例中，桥（115）包括柔性安装板（155）。 与安装板（155）接触的是具有至少一个第一接触区域（165）和至少一个第二接触区域（170）的导电引线（160）。 桥（115）被配置为将第一接触区域（165）处的电子模块（110）连接到在第二接触区域（170）与衬底（105）接触的导电迹线（125） 。 在一个实施例中，衬底（105）用于形成用于封闭一个或多个物品的包装（100）。 电子模块（110）定位在封装（100）中并通过桥（115）连接到导电迹线（125）。 在替代实施例中，桥（115）被延伸以形成内套筒以封闭或以其他方式覆盖或保护电子模块（110）。

    Surface mount transformer
    138.
    发明申请
    Surface mount transformer 审中-公开
    表面贴装变压器

    公开(公告)号：US20070035372A1

    公开(公告)日：2007-02-15

    申请号：US11435786

    申请日：2006-05-18

    Applicant: Asao Ishikawa ,  Yuji Ichikawa

    Inventor： Asao Ishikawa ,  Yuji Ichikawa

    IPC: H01F27/02

    CPC classification number: H01F27/292 ,  H01F19/04 ,  H01F27/2828 ,  H01F2017/067 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/1003 ,  H05K2201/10287

    Abstract: It is intended to provide a surface mount transformer which can be mounted without affecting the configuration of the wiring pattern of a printed wiring board. For that purpose, the transformer includes, a transformer body 10 configured by winding a winding on a ferrite core, and a seating 20 that has an insulating substrate 21 having a size necessary to place said transformer body thereon, a wiring pattern formed on at least one surface thereof, and connection terminals 22 for connecting the edges of the winding formed on the circumference of said insulating substrate.

    Abstract translation: 旨在提供一种可安装的表面贴装变压器，而不影响印刷电路板的布线图案的构造。 为此，变压器包括通过将绕组卷绕在铁氧体磁芯上而构成的变压器主体10和具有绝缘基板21的座部20，该绝缘基板21具有将所述变压器主体放置在其上的必要尺寸，至少形成有布线图案 一个表面，以及用于连接形成在所述绝缘基板的圆周上的绕组的边缘的连接端子22。

    Terminal structure of multi-layer substrate and method for forming the same
    139.
    发明申请
    Terminal structure of multi-layer substrate and method for forming the same 审中-公开
    多层基板的端子结构及其形成方法

    公开(公告)号：US20060001181A1

    公开(公告)日：2006-01-05

    申请号：US11223260

    申请日：2005-09-12

    Applicant: Seok Jun

    Inventor： Seok Jun

    IPC: H01L29/739

    CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K2201/09172 ,  H05K2201/10727 ,  Y02P70/613

    Abstract: Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.

    Abstract translation: 公开了多层基板的端子结构及其形成方法。 在端子结构中，在至少两个相邻的基板层上形成多个端子，每个端子与相邻的基板间隔开至预定间隔。 开口形成在至少一个基板层中。 每个开口形成在至少一个基板层中的每个相邻的第一端子之间，并且与每个第一端子间隔开至预定的间隙，并且具有与第一端子的尺寸相同的尺寸。 将基板层叠在一起并压缩在一起，使形成在至少一个对应基板层上的第二端子突出到形成相应端子的最外层基板层的平面上。 当端子形成时，端子结构和方法可以确保封装中的多个端子的预定间隔，并且简化其形成。

    Fixed network resistor
    140.
    发明申请
    Fixed network resistor 有权
    固定网络电阻

    公开(公告)号：US20050285713A1

    公开(公告)日：2005-12-29

    申请号：US10533035

    申请日：2003-10-28

    Applicant: Takahiro Kuriyama

    Inventor： Takahiro Kuriyama

    IPC: H01C1/16 ,  H01C13/02 ,  H05K3/34 ,  H01C1/02

    CPC classification number: H05K3/3442 ,  H01C1/16 ,  H01C13/02 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

    Abstract: A fixed resistor network has an insulating substrate, a plurality of film resistors arranged on a top surface of the insulating substrate, terminal electrodes formed for the film resistors on each lengthwise sidewall of the insulating substrate at a given pitch along the sidewall, and recesses provided between the terminal electrodes. The occurrence of solder bridges between the terminal electrodes during solder mounting and the occurrence of chipping in the terminal-electrode-forming areas between the recesses on the lengthwise sidewall are both reduced by making the width of the recesses along the lengthwise sidewall either 0.44 to 0.48 times or 0.525 to 0.625 times the pitch.

    Abstract translation: 固定电阻网络具有绝缘基板，布置在绝缘基板的顶表面上的多个薄膜电阻器，沿着侧壁以给定的间距为绝缘基板的每个纵向侧壁上的薄膜电阻器形成的端子电极和设置的凹部 在端子电极之间。 在焊接安装期间在端子电极之间出现焊接桥，并且在纵向侧壁上的凹部之间的端子电极形成区域中发生切屑的情况都通过使沿着纵向侧壁的凹部的宽度为0.44至0.48 次或0.525到0.625倍。

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