Abstract:
A main wire 111 has inner layer wiring patterns 161 to 165 which are wired on an inner layers 114 and 115 connected by via conductors 166 to 169 in series. In addition, a main wire 112 has inner layer wiring patterns 181 to 185 which are wired on the inner layers 114 and 115 connected by via conductors 186 to 189. The inner layer wiring patterns 161 to 165 and the inner layer wiring patterns 181 to 185 are wired so as to change the layer to the inner layer on the opposite side to each other. Branch wires 121 1 to 121 4 and 122 1 to 122 4 are branched from the via conductors 166 to 169 and 186 to 189, respectively. Thereby, the present invention provides an inexpensive printed wiring board which can reduce ringing without upsizing the printed wiring board.
Abstract:
A method for forming closed vies In a mgtfflayßr printed circuit board. A dielectric layer Is laminated to one side of a central. core having a metal layer on each side. A second dielectric layer is laminated to the other side of the central core. Closed vtas In the central core have been formed by drilling partially through but not completely penetrating the central core, and then completing the via from the opposite side with a hole that Is much smaller In diameter to form a pathway that penetrates completely through the central core from one side to another. The via is then plated with metal to substantially close the smaller hols. Approximately one half of the closed vlas are situated such that the closed aperture faces one dielectric layer and a remainder of the dosed vias are situated such that the closed aperture faces the other dielectric layer.
Abstract:
A method for forming closed vias in a multilayer printed circuit board. A dielectric layer (1085) is laminated to one side of a central core having a metal layer (120, 130) on each side. A second dielectric layer (1080) is laminated to the other side of the central core. Closed vias in the central core have been formed by drilling partially through but not completely penetrating the central core, and then completing the via from the opposite side with a hole that is much smaller in diameter to form a pathway that penetrates completely through the central core from one side to another. The via is then plated with metal to substantially close the smaller hole. Approximately one half of the closed vias are situated such that the closed aperture (355) faces one dielectric layer and a remainder of the closed vias are situated such that the closed aperture (350) faces the other dielectric layer. Resin from one dielectric layer (1085) fills the cavities of approximately one half of the closed vias, and resin from the other dielectric layer (1080) fills the circular cavities of the remainder of the closed vias. The total amount of resin migrated from each of the dielectric layers into the closed via cavities is approximately equal.
Abstract:
A wireless communications device can include a power amplifier that is configured to transmit information to a wireless communications network during a first time interval and configured to avoid transmitting information during a second time interval. A circuit substrate is coupled to the power amplifier and a power source is configured to provide power to the power amplifier. First and second conductor are coupled to the power amplifier and to the power source, and have respective overlapping and non-overlapping portions on the circuit substrate.
Abstract:
A non-uniform transmission line includes at least one patterned conductive layer 8102, 104), a dielectric layer (103) adjacent to the patterned conductive layer(s) (102, 104), and insulating layer (101, 105) surrounding the patterned conductive layer(s) and the dielectric layer.
Abstract:
The electrical connector has a multilevel printed circuit board (42) connecting between two sets of terminals. For example, one set of terminals is a set of insulation displacement contacts (14) and the other is a set of tails (16) for connecting to a plug inserted into a socket (26). Tracks on the printed circuit board (42) connect between respective terminals (14, 16). Signals are assigned to particular pairs signal paths through pairs of terminals and tracks. The multilevel printed circuit board (42) includes coupling regions coupling between tracks to compensate for crosstalk between the pains.
Abstract:
A wiring apparatus for reducing electromagnetic interference between conductive wires is provided. Wire pairs are incorporated into rigid or flexible printed circuits to precisely control loop alignment and phase differences. This precise alignment helps to cancel radiated electromagnetic fields and reduce voltage polarities induced in nearby wires. In one embodiment, a pair of parallel wires is aligned parallel to a second, twisted pair of wires. In another embodiment, two twisted pairs of wires, with identical loop lengths, are aligned parallel to each other and offset by exactly one half loop length. In a third embodiment, two twisted pairs of wires are aligned parallel to each other, in which one pair has a loop length that is an integer ratio of the other pair.
Abstract:
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board (200) has a first attach region on a first surface for coupling a first set of pins from a first device (205, 210, 215) to a set of signal lines. A second attach region on a second surface is for coupling a second set of pins from a second device (220, 225) to the set of signal lines. The second attach region is predominantly non-overlapping with respect to the first attach region.
Abstract:
A twisted-pair conductor line structure is formed on a substrate (22) having insulated conductive layers (10, 11). The conductive layers are used to form first, second, third, and fourth conductive planar segments (16). A first conductive link (17) joins the first and second planar conductive segments to provide a first signal path. Similarly, a second conductive link (17) joins the third and fourth planar conductive segments to provide a second signal path. The first and second conductive links are operatively arranged to form a twist (17) in the first and second signal paths, such that the resulting magnetic fields (57, 59) around the twisted conductive segments will be opposite to each other for cancelling each other out, in order to reduce the magnetic field radiation to the surrounding environment.