公开(公告)号：EP1212585B1

公开(公告)日：2010-08-04

申请号：EP00960094.1

申请日：2000-09-13

Applicant: KIONIX, INC. ,  MilliSensor Systems and Actuators, Inc

Inventor： ADAMS, Scott, G. ,  GROVES, James ,  CARDARELLI, Donato ,  CARROLL, Raymond ,  DAUWALTER, Charles, R.

IPC: G01C19/56

CPC classification number: G01C19/5719

Abstract: An oscillatory gyroscope is described with decoupled drive and sense oscillators and reduced cross-axis sensitivity. The gyroscope is fabricated using a plasma micromachining process on standard silicon wafers. The electrical isolation of the drive and sense functions of the gyroscope, contained within the same micromechanical element, reduce cross-coupling while obtaining high inertial mass and high sensitivity.

公开(公告)号：EP2130052A1

公开(公告)日：2009-12-09

申请号：EP08744509.4

申请日：2008-03-27

Applicant: KIONIX, INC.

Inventor： KIM, Dong Yoon ,  MILLER, Scott, A.

IPC: G01P15/18

CPC classification number: G01P15/0891 ,  G11B19/043

Abstract: A system (10) and method detect freefall associated with an object that is spinning or tumbling as it falls. Two tri-axis accelerometers (14, 16) provide inputs to an algorithm (28) that detects the freefall of a spinning object that would not otherwise be detected by a conventional freefall detection system, due to the centrifugal and centripetal forces being placed on the falling object as it spins. The system can be used to detect the freefall of portable devices with onboard memory or hard disk drives, allowing the devices to have time to park the read/write head and reduce the potential of losing data that can be damaged by impact. This freefall detection system may be applied to such portable devices as notebook computers, PDAs, MP3 players, digital cameras, mobile phones and even automobiles.

公开(公告)号：EP1446671A4

公开(公告)日：2009-02-18

申请号：EP02789205

申请日：2002-10-16

Applicant: KIONIX INC

Inventor： ADAMS SCOTT G ,  MILLER SCOTT A ,  JOHNSON WENDY JO H

IPC: G01P9/04 ,  G01P15/125 ,  G01P15/08 ,  H01L29/00

CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828

Abstract: An accelerometer. A silicon wafer is etched to form a fixed portion, a movable portion, and a resilient coupling between, the fixed and movable portions generally arranged in the plane of the wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restores the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of the first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.

Abstract translation: 加速度计。 蚀刻硅晶片以形成固定部分，可移动部分以及通常布置在晶片的平面内的固定部分和可移动部分之间的弹性耦合，可移动部分的质量集中在弹性耦合件的一侧上 。 硅结构的固定部分和可移动部分之一包括第一电极。 固定部分和可移动部分中的另一个包括平行于加速轴取向的第二电极和作为与第二电极机械耦合的共面的第三电极电连接的导电层。 第二电极和第三电极与第一电极电容性地相对设置，第一电极与第三电极之间的电容随着可移动部分相对于固定部分沿着加速度轴线的方向移动而增加并且随着可移动部分移动而减小 在相反的方向。 弹性联接器保持第一和第三电极跨越电容间隙彼此电容性地相反，同时响应于沿着垂直于晶片平面的加速轴的加速度允许第一电极相对于第二和第三电极的运动， 并且在加速停止时将第一电极弹性恢复到平衡位置。 当电极处于平衡位置时，第二电极与第一电极的大部分表面区域相对。 测量第一和第三电极之间的电容以获得沿轴的加速度的测量结果。

公开(公告)号：EP1706467A1

公开(公告)日：2006-10-04

申请号：EP04795012.6

申请日：2004-10-13

Applicant: KIONIX, INC.

Inventor： ZHOU, Peng ,  YOUNG, Lincoln, C.

IPC: C09J5/10 ,  G01N15/06 ,  G01N33/00 ,  G01N33/48

CPC classification number: B29C66/54 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/4895 ,  B29C66/543 ,  B29C66/71 ,  B29L2031/756 ,  B29K2069/00 ,  B29K2033/08 ,  B29K2025/06

Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.

公开(公告)号：EP2414798B1

公开(公告)日：2018-01-10

申请号：EP10759299.0

申请日：2010-03-30

Applicant: KIONIX, INC.

Inventor： KIM, Dong Yoon ,  MILLER, Scott

IPC: G06F1/16 ,  G01L1/00

CPC classification number: G06F1/1694 ,  G06F1/1626 ,  G06F2200/1636

Abstract: A directional tap detection algorithm and a single tri-axis accelerometer are employed to extend the number of unique button less input commands available for a small mobile electronic device. The algorithm analyzes acceleration data from the tri-axis accelerometer to detect the direction and number of taps imparted to any of the six sides of a housing of the device, yielding 12 unique inputs. The algorithm employs a parameter referred to as the performance index (PI) to identify tap induced movements. The PI is determined by calculating the time derivative of each acceleration signal for each axis and then calculating the sum of the absolute values of the calculated acceleration derivatives. A tap is determined to have occurred if the sum exceeds a threshold value for a predetermined amount of time. If a second tap is detected within a predetermined time after the first tap, then a double tap is determined to have occurred.

公开(公告)号：EP2675748A2

公开(公告)日：2013-12-25

申请号：EP12704642.3

申请日：2012-02-13

Applicant: KIONIX, INC.

Inventor： BLACKMER, Charles, W. ,  ADAMS, Scott, G. ,  HOCKING, Andrew, S. ,  LYNCH, Kristin, J. ,  SHAH, Ashish, A.

IPC: B81B3/00

CPC classification number: B81C1/00698 ,  B81B2203/0118 ,  B81B2203/033 ,  H01L21/76232

Abstract: In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

公开(公告)号：EP1979097A2

公开(公告)日：2008-10-15

申请号：EP07716595.9

申请日：2007-01-12

Applicant: KIONIX, INC.

Inventor： ZHOU, Peng ,  YOUNG, Lincoln

IPC: B01L3/00

CPC classification number: G01N1/28 ,  B01L3/5025 ,  B01L3/502715 ,  B01L3/50273 ,  B01L3/502738 ,  B01L7/00 ,  B01L2200/026 ,  B01L2200/027 ,  B01L2200/028 ,  B01L2200/04 ,  B01L2200/0621 ,  B01L2200/0684 ,  B01L2200/10 ,  B01L2200/16 ,  B01L2300/0654 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/0867 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/1827 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0633 ,  B01L2400/0655 ,  B01L2400/0666 ,  B01L2400/084 ,  F04B43/043 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0059 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0324 ,  Y10T436/117497 ,  Y10T436/2575

Abstract: The systems and methods described herein include a microfluidic chip having a plurality of microfeatures interconnected to provide a configurable fluid transport system for processing at least one reagent. Inserts are provided to removably interfit into one or more of the microfeatures of the chip, wherein the inserts include sites for interactions with the reagent. As will be seen from the following description, the microfluidic chip and the inserts provide an efficient an accurate approach for conducting parallel assays.

公开(公告)号：EP1952165A2

公开(公告)日：2008-08-06

申请号：EP06837791.0

申请日：2006-11-16

Applicant: KIONIX, INC.

Inventor： ADAMS, Scott G. ,  MILLER, Scott A. ,  SHEN-EPSTEIN, June ,  EPSTEIN, Keith

IPC: G01P15/18 ,  G01P15/125 ,  H01L21/00

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0828

Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

公开(公告)号：EP1706467A4

公开(公告)日：2007-09-26

申请号：EP04795012

申请日：2004-10-13

Applicant: KIONIX INC

Inventor： ZHOU PENG ,  YOUNG LINCOLN C

IPC: C09J5/10 ,  G01N15/06 ,  G01N33/00 ,  G01N33/48

CPC classification number: B29C66/54 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/4895 ,  B29C66/543 ,  B29C66/71 ,  B29L2031/756 ,  B29K2069/00 ,  B29K2033/08 ,  B29K2025/06

Abstract: A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.

公开(公告)号：EP1062685A1

公开(公告)日：2000-12-27

申请号：EP99905434.9

申请日：1999-01-14

Applicant: Kionix, Inc.

Inventor： DAVIS, Timothy, J. ,  ADAMS, Scott, G.

IPC: H01L21/00 ,  H01L21/30

CPC classification number: B81C1/00484 ,  B81B2203/0118 ,  B81B2203/0136

Abstract: Deep reactive ion etching creates a single mask MEMS structure 20-50 micrometer deep on the top surface of the wafer. Thereafter, a bottom surface etch cooperates with trenches formed in the MEMS structure to provide through trenches which release large area structures (86) of arbitrary shape and having a thickness up to that of the wafer. The releases structure is supported in the wafer by MEMS support beams (102, 104) and motion is detected and affected by MEMS sensors and actuators, respectively.