公开(公告)号：EP2259665A1

公开(公告)日：2010-12-08

申请号：EP10008962.2

申请日：2002-04-25

Applicant: MEC COMPANY LTD.

Inventor： Kawaguchi, Mutsuyuki ,  Hisada, Jun ,  Nakagawa, Toshiko

IPC: H05K3/38 ,  B32B15/08 ,  C23C22/52 ,  C23F11/14 ,  B32B37/00

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0038 ,  B32B38/0012 ,  B32B2311/12 ,  B32B2398/00 ,  B32B2457/08 ,  C23C22/52 ,  H05K3/389 ,  Y10S428/91 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/273 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681

Abstract: A solution for forming an azole-copper complex compound that is used for adhering at least one copper or copper alloy layer to a resin layer comprises an azole compound in a range from 1 mass % to 5 mass %, and an organic acid in a range from 1 mass % to 30 mass %, and optionally comprises nonionic surfactants or metal compounds selected from the group consisting of zinc acetate, zinc hydroxide, zinc formate, copper chloride, copper formate, lead acetate, nickel acetate, and nickel sulfide, the balance being aqueous solvents, wherein said azole compound is at least one compound selected from the group consisting of oxazole, thiazole, triazole, tetrazole, oxatriazole, thiatriazole and derivatives thereof, and has a group to react with resin.

Abstract translation: 用于将至少一个铜或铜合金层粘附到树脂层上的用于形成唑 - 铜络合物的溶液包括1质量％至5质量％范围内的唑类化合物和一种范围内的有机酸 1质量％至30质量％，并且任选地包含选自乙酸锌，氢氧化锌，甲酸锌，氯化铜，甲酸铜，乙酸铅，乙酸镍和硫化镍的非离子表面活性剂或金属化合物，余量 是含水溶剂，其中所述唑类化合物是至少一种选自恶唑，噻唑，三唑，四唑，恶三唑，噻三唑及其衍生物的化合物，并且具有与树脂反应的基团。

公开(公告)号：EP1662020A1

公开(公告)日：2006-05-31

申请号：EP06004367.6

申请日：2004-06-29

Applicant: MEC COMPANY LTD.

Inventor： Otani, Minoru ,  Hisada, Jun ,  Mawatari, Toyoki

IPC: C23C16/00

CPC classification number: C23C18/08

Abstract: A method for producing a copper thin film, comprising:

heating a copper compound at a temperature of 100°C to 300°C in a non-oxidizing atmosphere of copper; and
cooling the copper compound to 60°C or lower to form a copper thin film,
the copper compound having a decomposition temperature in a range of 100°C to 300°C and comprising one unit or an oligomer or polymer of units represented by the following Formula (1):

         [R 1 COO] n [NH 3 ] m CuX 1 p      (1)

where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R 1 respectively represent the following Formula (2), CH 2 X 2 , CH 2 X 2 (CHX 2 ) q , NH 2 , or H, and may be the same or different from each other, or n is 2 and two pieces of [R 1 COO] represent together the following Formula (3); R 2 , R 3 , and R 4 are respectively CH 2 X 2 , CH 2 X 2 (CHX 2 ) q , NH 2 , or H; R 5 is -(CHX 2 ) r -; X 2 is H, OH, or NH 2 ; r is 0 to 4; q is 1 to 4; and X 1 is NH 4 + , H 2 O or solvent molecules


         [-OOC-R 5 -COO-]     (3).

Abstract translation: 一种铜薄膜的制造方法，其特征在于，在铜的非氧化性气氛中，在100〜300℃的温度下加热铜化合物， 并将铜化合物冷却至60℃以下，形成铜薄膜，所述铜化合物的分解温度为100℃〜300℃，所述铜化合物为1单元或低聚物或由 以下公式（1）：€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ[R 1 COO] n [NH 3] m CuX 1 p€ƒ€ƒ€ƒ€ƒ（1）其中 n为1〜3; m为1〜3; p为0〜1; n个R 1分别表示下式（2），CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H，可以相同也可以不同，n为2 和两个[R 1 COO]一起表示下式（3）。 R 2，R 3和R 4分别为CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H; R 5为 - （CHX 2）r - ; X 2是H，OH或NH 2; r为0〜4; q为1〜4; 和X 1是NH 4 +，H 2 O或溶剂分子€ƒ€ƒ€ƒ€ƒ€ƒ[-OOC-R 5 -COO-]€ƒ€ƒ€ƒ€ƒ （3）。

公开(公告)号：EP1607435A1

公开(公告)日：2005-12-21

申请号：EP05012795.0

申请日：2005-06-14

Applicant: MEC COMPANY LTD.

Inventor： Nakamura, Sachiko ,  Miyata, Yoshinari ,  Ishida, Terukazu ,  Misumi, Miho

IPC: C08J7/12 ,  C09K13/04

CPC classification number: C08J7/06 ,  C08J7/12 ,  H05K3/381

Abstract: The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.

Abstract translation: 本发明涉及含有至少一种选自四价和三价铈化合物的铈化合物作为有效成分的树脂表面处理剂。 本发明的表面处理方法是使树脂的表面与含有选自四价和三价铈化合物的至少一种铈化合物作为有效成分的表面处理剂接触，然后用 酸性水溶液。 这激活树脂表面，从而增加例如具有金属线的聚酰亚胺系树脂膜的粘合强度，以及聚酰亚胺系树脂膜与其他树脂的密合强度。 因此，提供了提供优异的生产率和降低加工成本的树脂表面处理剂，以及使用该树脂表面处理剂的表面处理方法。

公开(公告)号：EP4410798A1

公开(公告)日：2024-08-07

申请号：EP23220281.2

申请日：2023-12-27

Applicant: MEC COMPANY., LTD.

Inventor： MORIKAWA, Koki ,  OGINO, Yuki ,  NISHIMINE, Jun

IPC: C07F7/18 ,  B32B15/00 ,  C09D1/00

CPC classification number: C07F7/1804 ,  C09D5/00

Abstract: Provided is a chemical compound represented by the general formula (A), in which each of substituents Q1 to Q6 is bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Q1 to Q6 is X, and at least one of Q1 to Q6 is Y R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R2 is a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of R51 and R52 is a divalent organic group, and a is an integer of 1 to 3.

公开(公告)号：EP3561151A1

公开(公告)日：2019-10-30

申请号：EP17893423.8

申请日：2017-12-15

Applicant: MEC Company Ltd.

Inventor： AKIYAMA, Daisaku ,  TOMATSU, Itsuro ,  AMITANI, Yasutaka ,  JOKO, Keisuke ,  SATOMI, Tokuya

IPC: C23C22/05 ,  C09D5/00 ,  C09D7/40 ,  C09D201/00 ,  H05K3/38

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

公开(公告)号：EP3388551A1

公开(公告)日：2018-10-17

申请号：EP17753057.3

申请日：2017-02-08

Applicant: MEC Company Ltd.

Inventor： MATSUMOTO, Keisuke

IPC: C23F1/18 ,  H01L21/306 ,  H01L21/308 ,  H05K3/38

CPC classification number: C23F1/18 ,  H01L21/32134 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0776 ,  H05K2203/0789

Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.

公开(公告)号：EP3228730A1

公开(公告)日：2017-10-11

申请号：EP15866351.8

申请日：2015-09-17

Applicant: MEC COMPANY LTD.

Inventor： AKIYAMA,Daisaku ,  RAIJO, Mina

IPC: C23F1/22 ,  B29C45/02 ,  B29C45/14

CPC classification number: C23F1/22 ,  B29C45/02 ,  B29C45/14 ,  B29C45/14311 ,  B29K2705/00

Abstract: The etching agent is an aqueous solution including at least one acid selected from the group consisting of inorganic acids other than nitric acid, and organic acids; and an organic nitrogen compound having a molecular structure containing N-OH or N-O-. The acid concentration of the etching agent is 0.05 to 3 % by weight, and the organic nitrogen compound concentration of the etching agent is 0.005 to 5 % by weight. By bringing the etching agent into contact with a surface of a magnesium component, fine irregularities can be formed on the surface of the magnesium component even when etching depth is large.

Abstract translation: 蚀刻剂是包括选自除硝酸以外的无机酸和有机酸中的至少一种酸的水溶液; 和具有含N-OH或N-O-的分子结构的有机氮化合物。 蚀刻剂的酸浓度为0.05〜3重量％，蚀刻剂的有机氮化合物浓度为0.005〜5重量％。 通过使蚀刻剂与镁成分的表面接触，即使在蚀刻深度大的情况下，也能够在镁成分的表面形成微细的凹凸。

公开(公告)号：EP2878706B1

公开(公告)日：2016-11-09

申请号：EP13804745.1

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami ,  OGINO, Yuki

IPC: C23F1/18 ,  H01L21/308 ,  H05K3/38

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

公开(公告)号：EP2878706A1

公开(公告)日：2015-06-03

申请号：EP13804745.1

申请日：2013-06-25

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami ,  OGINO, Yuki

IPC: C23F1/18 ,  H01L21/308 ,  H05K3/38

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/ or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A% by weight, a concentration of the polymer is B% by weight and a concentration of the nonionic surfactant is D% by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract translation: 本发明提供一种微蚀刻剂，补充溶液加入到所述微蚀刻剂和用于生产使用所述微蚀刻剂的布线板的制造方法。 用于水溶液含有铜离子的有机酸，卤化物离子，聚合物和非离子表面活性的铜besteht的微蚀刻剂。 该聚合物是一种水溶性聚合物包含聚胺链和/或阳离子基团，并且具有1,000或更高的重均分子量。 在本发明的微蚀刻剂，A / B的值是2000到9000和A / D为500〜9000，其中所述卤化物离子的浓度按重量计为A％的值，该聚合物的浓度为 B％（重量），非离子表面活性剂的浓度为D％（重量）。 使用该微蚀刻溶液，粘接性树脂等能够即使在低蚀刻量被均匀地保持。

公开(公告)号：EP2514853A2

公开(公告)日：2012-10-24

申请号：EP12002463.3

申请日：2012-04-05

Applicant: MEC COMPANY LTD.

Inventor： Sengoku, Yoichi ,  Tsutae, Yoichi ,  Tai, Kiyoto ,  Joko, Keisuke ,  Amatani, Tsuyoshi

IPC: C23C22/52 ,  C23F1/18 ,  C23C18/16 ,  H05K3/38

CPC classification number: C23C22/52 ,  C23C18/1689 ,  C23C22/68 ,  H05K3/0079 ,  H05K3/108 ,  H05K2203/124

Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25°C, and a salt thereof, has a pH of more than 4 and not more than 7 at 25°C, and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

Abstract translation: 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，酸解离常数的倒数的对数 在25℃下为3〜8，其盐在25℃下的pH值大于4且不大于7，即使连续使用也能稳定地形成用于提高铜和感光性树脂之间的粘附性的涂层 或反复; 以及形成用于将铜粘合到感光性树脂上的涂层的方法，其包括使铜的表面与涂布液组合物接触以形成涂层。