Abstract:
PURPOSE: A stack memory device for efficiently increasing a memory size, a memory system including the same and a control method thereof are provided to efficiently increase a memory size by including a memory core with a memory cell array in a master chip. CONSTITUTION: One or more master chip(120) includes a first input-output circuit and a first memory core for interfacing with the outside of a memory device. One or more slave chip(130) is accumulated on the upper part of master chips. Each slave chip includes a second memory core. The slave chips are electrically connected each other through first penetrating electrodes(141,142). The slave chips are electrically connected to the master chips through the first penetrating electrodes. The first input-output circuit and the first memory core are formed on the first surface of the master chip. Each slave chip is accumulated on the first surface of master chips.
Abstract:
A semiconductor device is provided to extract information required for parity bit generation in response to a continuous decision signal or data masking information, thereby preventing a writing error during continuous writing actions. A memory cell array(201) stores data and parity data. A continuous writing decider(280) decides on identity of a column address in case of a continuous inputting action of a writing command, and generates a continuous decision signal. A parity generator(270) controls generation and output of the current parity data by using previous data and change data in response to the continuous decision signal. The parity generator controls generation and output of the current parity data in response to the continuous decision signal and data masking information.
Abstract:
멀티 레벨 펄스 진폭 변조 트랜스시버(Multi-level Pulse Amplitude Modulation Transceiver) 및 데이터 송수신 방법이 개시된다. 상기 멀티 레벨 펄스 진폭 변조 트랜스시버는 송신부 및 수신부를 구비할 수 있다. 상기 송신부는 입력 데이터에 응답하여 제 1 내지 제 n 전압 레벨(n은 2 x , x는 2이상의 자연수)의 신호들 중 차동 신호쌍을 출력한다. 상기 수신부는 상기 차동 신호쌍을 수신하고, 상기 수신된 차동 신호쌍 및 상기 차동 신호쌍에 대응하는 기준 신호쌍을 이용하여 데이터를 생성한다. 상기 송신부는 상기 제 k 및 제 k+1 전압 레벨(k는 n/2)간의 전압 차이와 다른 인접한 전압 레벨간의 전압 차이가 상이하도록 조정한다. 상기 멀티 레벨 펄스 진폭 변조 트랜스시버 및 데이터 송수신 방법은 종래보다 적은 개수의 기준 신호를 이용하면서 타이밍 마진(timing margin) 및 전압 마진(voltage margin)을 향상시킬 수 있는 장점이 있다.
Abstract:
내부 전압 제어 방법 및 그 방법을 이용하는 멀티 칩 패키지 메모리(multi-chip package memory)가 개시된다. 상기 멀티 칩 패키지 메모리는 전달 메모리 칩 및 제 1 내지 제 n 메모리 칩(n은 자연수)을 구비할 수 있다. 상기 전달 메모리 칩은 신호들을 전달하고, 상기 제 1 내지 제 n 메모리 칩은 내부 전압을 발생하여 출력하는 내부 전압 발생 회로를 포함하고 상기 전달 메모리 칩 위에 적층된다. 상기 전달 메모리 칩은 상기 외부에서 수신되는 신호들에 응답하여 상기 각각의 내부 전압을 제어하는 제 1 내지 제 n 제어 신호를 대응하는 메모리 칩으로 출력한다. 상기 내부 전압 제어 방법 및 그 방법을 이용하는 멀티 칩 패키지 메모리는 적층되는 메모리 칩의 크기를 감소시키고 공정을 단순화할 수 있는 장점이 있다.
Abstract:
A memory module is provided to reduce power consumption of 0.2W by byte slice compared with the conventional device by using a single-end signal method. A memory module is composed of 4 byte slice having tow ranks, which includes a plurality of memory device(230,240, 250, 260). The memory module is made of a data chain structure according to the rank. The byte slice is divided by a byte unit. The memory device is composed of a secondary receiver(RxS), a primary receiver(RxP), a secondary transmitter, a primary transmitter, a primary clock receiver, a primary clock transmitter, and PLL(phase Locked Loop).
Abstract:
A semiconductor memory device having an error detection function, a memory system having the semiconductor memory device, and a data output method of the semiconductor memory device are provided to turn off a part of lanes constituting a data frame in response to an error detection enable signal. An error calculator(1200) receives first data from a memory core, and generates error data based on the first data. A serializer(1300) constitutes a first frame based on the first data and the error data in an error detection mode, and generates second data by serializing the first data and the error data according to the first frame, and constitutes a second frame with different shape from the first frame based on the first data in a first operation mode not performing error detection, and generates third data by serializing the first data according to the second frame. An output buffer generates output data by buffering the second data and the third data.
Abstract:
A refresh circuit of a semiconductor memory device and a refresh method thereof are provided to prevent the increase of refresh time caused by bank group refresh time, when all refresh commands are applied after refresh command of a bank group is applied to the semiconductor memory device. According to a refresh method of a semiconductor memory device comprising a plurality of bank groups having a plurality of banks, refresh is performed for at least one bank. Information of a bank group where the bank of the bank refresh included is stored. An all refresh command to perform refresh for all bank groups after the bank refresh is executed. The information of the bank group stored in the bank group information storing is compared with the information of an initial bank group in the all refresh command applying. If the information of the bank group stored in the bank information does not coincide with the information of the initial bank group, refresh for the initial bank group is performed and then refresh for the other bank groups is performed. Otherwise, refresh for a different bank group from the initial bank group is performed and then refresh for all bank groups is performed.
Abstract:
A memory system with a power throttling scheme based on a power parameter of a memory device is provided to enable optimum power control by controlling power throttling on the ground of power characteristics information of the memory device. A memory device(200) is set as a specific power characteristics mode through a mode register set command, and provides the set power characteristics information. A memory controller(100) transmits the mode register set command to the memory device, and reads the power characteristics information of the set power characteristics mode, and generates power control information on the ground of the read power characteristics information, and makes a command generation schedule in response to the power control information, and provides a command to the memory device by the command schedule. The memory device comprises a mode register for storing mode setting information, and a power register stored with power characteristics information table on the ground of the mode setting information, and an interface part providing the power characteristics information in response to a power characteristics information request command.
Abstract:
A termination circuit and a semiconductor memory device comprising the same are provided to improve problems due to the increase of power consumption by periodically controlling whether to enable the termination circuit when a data signal is input. In a termination circuit connected to an input buffer(110) receiving a data signal, at least one termination resistor is connected to the input buffer for impedance matching. At least one switch part controls the connection between the input buffer and the termination resistor. A control signal generation part(140) generates a control signal to control on/off of the switch part. The control signal generation part generates a control signal having a period of 1/n of the data signal input period, and controls the termination circuit to be enabled in a partial period of the data signal input period.
Abstract:
A semiconductor memory module and a semiconductor memory device are provided to perform the test of the memory module easily by enabling to perform an individual signal line short-circuit test for plural semiconductor memory devices without an additional test dedicated pin or an algorithm for test mode entry. A semiconductor memory module comprises a plurality of semiconductor memory devices and a circuit board. The plurality of semiconductor memory devices are installed on the circuit board, and a plurality of first signal lines connected to the semiconductor memory devices in common and a plurality of second signal lines connected to the semiconductor memory devices respectively are arranged on the circuit board. Each of the semiconductor memory devices includes first ports receiving first signals applied from the first signal lines, a second port receiving an enable signal during a test, a signal transmission part transmitting the first signals through the first ports in response to the enable signals, and third ports outputting the first signals transmitted from the signal transmission part and connected to the second signal lines.