LIQUID CRYSTALLINE RESIN COMPOSITION FOR MOLDING AND MOLDED CIRCUIT BOARD

    公开(公告)号:JP2003268241A

    公开(公告)日:2003-09-25

    申请号:JP2002068533

    申请日:2002-03-13

    Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystalline resin composition for molding which is improved in the adhesiveness of the liquid crystalline resin to a metal and is excellent in thin-wall moldability, precision moldability and dimensional stability based on the excellent fluidity, heat resistance and mechanical properties of the liquid crystalline resin; and a molded circuit board which has circuit adhesiveness, heat resistance and dimensional stability suitable for a small precision electronic circuit instrument. SOLUTION: The liquid crystalline resin composition for molding comprises 10 parts by weight of (A) a liquid crystalline resin and 0.5-30 parts by weight of (B) an amorphous resin having a repeating unit having at least one aromatic ring, wherein the moldings will be treated to have a formed metal film on the surface. The steric molded circuit board is produced by injection molding the composition to get a molding, which is treated with plasma on the surface followed by spattering or the like to form a metal film and then irradiating laser ray to carry out circuit patterning. COPYRIGHT: (C)2003,JPO

    POLYESTER RESIN COMPOSITION HAVING GOOD APPEARANCE

    公开(公告)号:JP2002332396A

    公开(公告)日:2002-11-22

    申请号:JP2001141073

    申请日:2001-05-11

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyester resin composition giving a molded article which has such feelings of massiveness, taxture and gloss as those of chinaware, and also has impact resistance and chemical resistance. SOLUTION: This polyester resin composition having a good appearance, is a resin composition which comprises (a) 31-50 wt.% of a poly(buthylene terephthalate) resin, (b) 10-50 wt.% of a poly(ethylene terephthalate) resin and (c) 10-46 wt.% of barium sulfate and has a weight loss on heat-treating at 250 deg.C for 30 minutes of 0.5 wt.% or less.

    COPOLYESTER
    145.
    发明专利

    公开(公告)号:JPH08225636A

    公开(公告)日:1996-09-03

    申请号:JP30912895

    申请日:1995-11-28

    Abstract: PURPOSE: To obtain a copolyester which can be prepared as a polymer having a high degree of polymerization through melt polymerization only, is moldable with an ordinary molding machine, and is excellent in optical anisotropy, heat resistance, and mechanical properties by constituting the copolyester of specific kinds of structural units in specific proportions. CONSTITUTION: The optically anisotropic copolyester which is made up of structural units I to IV respectively represented by formulae I to IV (wherein R1 is a group of formula V, and R2 is a group of formula VI, V, or VII), the molar amount of the sum of the units II and III being substantially equal to that of the units IV, the sum of the units I and II accounting for more than and 90 or less 95mol% of the sum of the units I, II, and III, the amount of the units III accounting for 5 or more and less than 10mol% of the sum of the units I, II, and III, and the molar ration of units I/units II being 75/25 to 95/5. It has an inherent viscosity (as measured in pentafluorophenol at a concentration of 0.1g/dl at 60 deg.C) of 0.05-5dl/g, and is substantially insoluble in phenol/tetrachloroethane mixture. This copolyester an be obtained as a polymer having a high degree of polymerization through melt polymerization only. It gives a molding excellent in heat resistance and mechanical properties and is hence usable in various applications such as metal substitutes and extrudates.

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