公开(公告)号：EP2737996A4

公开(公告)日：2015-04-15

申请号：EP12817350

申请日：2012-07-27

Applicant: TOPPAN PRINTING CO LTD

Inventor： KANO MITSURU ,  SATO JIN ,  YOSHIHARA TOSHIAKI ,  KON MASATO

IPC: B32B9/00 ,  B32B5/14 ,  B32B7/10 ,  C23C16/02 ,  C23C16/40 ,  C23C16/455 ,  C23C28/00 ,  C23C28/04

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/0008 ,  C08K3/0033 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).

Abstract translation: 本发明的层压体（1）包括在所述基材的外表面的至少一部分上形成的基材（2），薄膜状或膜状的底涂层（3或103） （2），并且在原子层沉积电影（4）没有形成在面的相反侧进入在厚度方向上与所述底涂层（3或103）的两个表面之间的基体材料（2）接触其表面的 ， 至少在原子层沉积电影（4）结合到所述底涂层（3或103）的前体，以及原子层沉积电影的部分（4）形成为膜形状覆盖所述底涂层（3或103） ，

公开(公告)号：EP1283235B1

公开(公告)日：2014-01-22

申请号：EP02254618.8

申请日：2002-07-01

Applicant: ROHM AND HAAS COMPANY

Inventor： Deitch, Jeffrey Harold ,  Zupancic, Joseph James ,  Chen, Mai

IPC: C09J177/00 ,  C09J167/00 ,  C09D167/00 ,  C09D177/00 ,  C08G81/02 ,  C09J201/06

CPC classification number: C09J201/06 ,  C08G61/12 ,  C08G81/027 ,  C08G2261/334 ,  C08G2261/35 ,  C08G2261/42 ,  C08G2261/76 ,  Y10T428/31554 ,  Y10T428/31855

公开(公告)号：EP2393880A4

公开(公告)日：2012-11-14

申请号：EP10739197

申请日：2010-02-05

Applicant: KNC NER ACQUISITION SUB INC

Inventor： LEE BRUCE P ,  SILVARY SUNIL ,  MURPHY JOHN L

IPC: C08L89/00 ,  A61L24/04 ,  C08G81/00 ,  C08L77/06 ,  C09J171/02 ,  C09J177/06 ,  C09J201/06

CPC classification number: C09D5/1656 ,  C08G65/3317 ,  C08G65/33396 ,  C08G81/00 ,  C08G2650/50 ,  C08L89/00 ,  C08L2203/02 ,  C09D189/00 ,  C09J177/06 ,  C09J179/02 ,  C09J201/06

公开(公告)号：EP1717851B1

公开(公告)日：2012-10-17

申请号：EP06115661.8

申请日：1998-03-31

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Watanabe, Itsuo c/o Goshomiya Works ,  Fujinawa, Tohru c/o Goshomiya Works ,  Arifuku, Motohiro c/o Goshomiya Works ,  Kanazawa, Houko c/o Research & Developement Center ,  Kuwano, Atsushi

IPC: H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

公开(公告)号：EP1242554B1

公开(公告)日：2006-02-15

申请号：EP99968455.8

申请日：1999-11-05

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro ,  TAKAMATSU, Yorinobu ,  YAMAGUCHI, Hitoshi ,  MURAMATSU, Akito

IPC: C09J7/02 ,  C09J201/06 ,  C09J133/14

CPC classification number: C09J133/066 ,  C08L67/04 ,  C08L2666/14 ,  C09J7/10 ,  C09J201/06 ,  C09J2201/61 ,  C09J2433/00 ,  C09J2467/00

Abstract: The present invention provides thermally activated adhesive compositions comprising adhesive polymer and polyester, wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.

公开(公告)号：EP1054932B1

公开(公告)日：2005-08-24

申请号：EP98932837.2

申请日：1998-06-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： STARK, Peter, A. ,  EVERAERTS, Albert, I. ,  SHERMAN, Audrey, A.

IPC: C09J201/02 ,  C09J7/02

CPC classification number: C09J201/06 ,  C08L2666/02 ,  C09J7/35 ,  C09J201/02 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2201/61 ,  Y10T428/2813 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31906 ,  Y10T428/31913

Abstract: A hot-melt adhesive composition comprises a blend of at least one acidic polymer and at least one basic polymer. At least one of the polymers is a hot-melt adhesive. Thermally reversible crosslinks are formed between each of the two polymers. These crosslinks impart cohesive strength to the applied adhesive, without sacrificing ease of processing.

公开(公告)号：EP0743970B1

公开(公告)日：2002-12-04

申请号：EP95911679.9

申请日：1995-02-09

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： GSCHNEIDNER, David ,  BOLDIZAR, Leslie ,  JACOBS, William, III ,  ALEXANIAN, Vazken

IPC: C09D167/00 ,  C09D133/06 ,  C09D5/03

CPC classification number: C09D201/06 ,  C08L2666/16 ,  C09D5/032 ,  C09D167/00 ,  C09J201/06 ,  C08L61/20 ,  C08L2666/28

Abstract: Described is a curable powder coating composition that provides a durable decorative wrinkle finish after curing, as well as a method of coating a substrate and a substrate so coated. The powder coating composition includes a specific triazine-type amino resin crosslinking agent, a hydroxyl functional resin and an amine blocked non-halogenated sulfonic acid catalyst.

公开(公告)号：EP1054932A1

公开(公告)日：2000-11-29

申请号：EP98932837.2

申请日：1998-06-29

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： STARK, Peter, A. ,  EVERAERTS, Albert, I. ,  SHERMAN, Audrey, A.

IPC: C09J201/02 ,  C09J7/02

CPC classification number: C09J201/06 ,  C08L2666/02 ,  C09J7/35 ,  C09J201/02 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2201/61 ,  Y10T428/2813 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31906 ,  Y10T428/31913

Abstract: A hot-melt adhesive composition comprises a blend of at least one acidic polymer and at least one basic polymer. At least one of the polymers is a hot-melt adhesive. Thermally reversible crosslinks are formed between each of the two polymers. These crosslinks impart cohesive strength to the applied adhesive, without sacrificing ease of processing.

公开(公告)号：EP0979854A4

公开(公告)日：2000-07-12

申请号：EP98911125

申请日：1998-03-31

Applicant: HITACHI CHEMICAL CO LTD

Inventor： WATANABE ITSUO ,  FUJINAWA TOURU ,  ARIFUKU MOTOHIRO ,  KANAZAWA HOUKO ,  KUWANO ATSUSI

IPC: C08K5/14 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09J157/00 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C08L61/00 ,  C08L63/00 ,  C08L101/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料的所有其电路电极之间插入海誓山盟面对并电在通过彼此压靠的相对的电极挤压方向连接的电极; 所述电路连接材料包括作为主要组分（1）通过加热产生游离自由基的固化剂，（2），其具有10000或更多，（3）自由基聚合性物质的分子量的含羟基基团的树脂 ， 这样提供了一个电路端子连接结构和连接方法的电路端子，这使得使用寻求的材料制成。

公开(公告)号：EP0979854A1

公开(公告)日：2000-02-16

申请号：EP98911125.7

申请日：1998-03-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： WATANABE, Itsuo ,  FUJINAWA, Touru ,  ARIFUKU, Motohiro ,  KANAZAWA, Houko ,  KUWANO, Atsusi

IPC: C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L101/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14 ,  H01B1/20 ,  H01L21/60

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating tree radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料的所有其电路电极之间插入海誓山盟面对并电在通过彼此压靠的相对的电极挤压方向连接的电极; 所述电路连接材料包括作为主要组分（1）通过加热产生树自由基的固化剂，（2），其具有10000或更多，（3）自由基聚合性物质的分子量的含羟基基团的树脂 ， 这样提供了一个电路端子连接结构和连接方法的电路端子，这使得使用寻求的材料制成。