公开(公告)号：US20100290205A1

公开(公告)日：2010-11-18

申请号：US12811599

申请日：2009-03-31

Applicant: Yasuhiro Suga

Inventor： Yasuhiro Suga

IPC: H05K7/00 ,  H01B1/22

CPC classification number: H05K3/323 ,  C08K3/36 ,  C08K9/04 ,  C09J163/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0209 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm. An average particle size of the conductive particles does not exceed 1.5 μm. The conductive particles is contained in an amount of 10 to 60 mass % of the filler.

Abstract translation: 即使在半导体芯片的倒装芯片安装期间填充剂和粘合剂组合物在布线板和半导体芯片之间没有被充分地去除，也可以确保可靠的连续性。 粘合膜由包含环氧化合物，固化剂和填料的粘合剂组合物形成。 相对于环氧化合物，固化剂和填料的总量，填充剂的含量为10〜70质量％。 填料包括平均粒径为0.5〜1.0μm的第一非导电性无机粒子，以及通过使平均粒径为0.5〜1.0μm的第二非导电性无机粒子形成的导电粒子。 导电粒子的平均粒径不超过1.5μm。 导电性颗粒的含量为填料的10〜60质量％。

公开(公告)号：US20100247892A1

公开(公告)日：2010-09-30

申请号：US12579791

申请日：2009-10-15

Applicant: Sang-Soo LEE ,  Kyunghee KIM ,  Soon Ho LIM ,  Min PARK ,  Jun Kyung KIM ,  Heesuk KIM ,  Hyunjung LEE

Inventor： Sang-Soo LEE ,  Kyunghee KIM ,  Soon Ho LIM ,  Min PARK ,  Jun Kyung KIM ,  Heesuk KIM ,  Hyunjung LEE

IPC: B32B5/16 ,  H01B1/24

CPC classification number: H05K3/323 ,  C08J3/128 ,  C08J2325/04 ,  H01B1/24 ,  H05K2201/0221 ,  H05K2201/0323 ,  Y10T428/249921 ,  Y10T428/254 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention discloses an electroconductive particle comprising (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.

Abstract translation: 本发明公开了一种导电颗粒，其包含（a）聚合物微粒和（b）接枝在聚合物微粒上的石墨烯涂层，其具有改善的导电性，表面电导率，耐久性和耐热性的长期稳定性，以及 适用于制造用于封装电子器件的各向异性导电膜。

公开(公告)号：US07635862B2

公开(公告)日：2009-12-22

申请号：US11337000

申请日：2006-01-23

Applicant: Daijiro Takano ,  Hikaru Fujita

Inventor： Daijiro Takano ,  Hikaru Fujita

IPC: H01L29/04 ,  H01L31/20 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

Abstract translation: 各向异性导电粘合剂具有分散在粘合剂中的导电颗粒，并且包括具有导电性的硬颗粒，涂覆硬颗粒的树脂层和涂覆树脂层的导电层。 连接结构通过各向异性导电粘合剂将电极彼此电连接。 连接方法包括使各向异性导电体介于电极之间，向各向异性导电粘合剂施加压力并使粘合剂固化的步骤。

公开(公告)号：US07543376B2

公开(公告)日：2009-06-09

申请号：US11622950

申请日：2007-01-12

Applicant: Toyokazu Yoshino ,  Katsuya Okamoto ,  Shigeki Ogata ,  Shinji Morimoto ,  Kouji Nakashima

Inventor： Toyokazu Yoshino ,  Katsuya Okamoto ,  Shigeki Ogata ,  Shinji Morimoto ,  Kouji Nakashima

IPC: H01K3/10

CPC classification number: H05K3/4046 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.

Abstract translation: 提供一种FPC，其包括绝缘层2，层叠在绝缘层2上方和下方的布线层3和4以及用于电连接布线层3和4的层连接。 层连接构成为包括：延伸穿过绝缘层2和上下布线层3和4的锥形导体压入孔5，并扩展到一个布线层3的侧面; 导体6在导体压配合孔内填充并压配合而没有任何间隙，使其接合到变形为导体压配合孔5的锥形的布线上层3，并从另一个突出 布线下层4以使其表面部分涂覆和接合。 结果，可以扩大布线层3和4与填充在导体压入孔5中的导体6之间的接触面积，以充分地保持布线层3和4与导体6之间的接触强度，从而提供 层连接的高连接可靠性。

公开(公告)号：US07413452B2

公开(公告)日：2008-08-19

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: H01R4/58

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20070262452A1

公开(公告)日：2007-11-15

申请号：US11797552

申请日：2007-05-04

Applicant: Kiyoshi Oi

Inventor： Kiyoshi Oi

IPC: H01L23/52

CPC classification number: H05K3/4046 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0221 ,  H05K2201/096 ,  H05K2201/10234 ,  H01L2224/29099 ,  H01L2924/00

Abstract: In an electronic component built-in substrate of the present invention, an electronic component is mounted on a mounted body having a first wiring layer, the electronic component is embedded in an insulating layer, a conductive ball is arranged to pass through the insulating layer and connected electrically to the first wiring layer, a second wiring layer connected electrically to the conductive ball is formed on the insulating layer, and the first wiring layer and the second wiring layer are interlayer-connected via the conductive ball.

Abstract translation: 在本发明的电子部件内置基板中，电子部件安装在具有第一布线层的安装体上，电子部件嵌入绝缘层中，导电球配置成穿过绝缘层， 与第一布线层电连接，在绝缘层上形成与导电球电连接的第二布线层，并且第一布线层和第二布线层经由导电球层间连接。

公开(公告)号：US20070029107A1

公开(公告)日：2007-02-08

申请号：US11580849

申请日：2006-10-16

Applicant: Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

Inventor： Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

IPC: G03C3/00

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/102 ,  H05K3/4661 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0347 ,  H05K2203/121 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

Abstract: A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Abstract translation: 布线板包括基板; 树脂层，其被选择性地形成在基板的一个主表面上，并且具有包含或粘附到其表面的细金属颗粒; 以及形成在树脂层上的导电金属层，其间插入有金属微粒。

公开(公告)号：US07141873B2

公开(公告)日：2006-11-28

申请号：US10956050

申请日：2004-10-04

Applicant: Akiyoshi Aoyagi

Inventor： Akiyoshi Aoyagi

IPC: H01L23/02

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/094 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external terminals include at least one first external terminal and two or more second external terminals. The first external terminal is formed of a soldering material. Each of the second external terminals includes a soldering material and a plurality of particles formed of a resin and dispersed in the soldering material. The second external terminals are a pair of external terminals among the external terminals, and a distance between the pair of external terminals is greater than a distance between any other pair of external terminals among the external terminals.

Abstract translation: 一种半导体器件，包括：半导体芯片; 其上安装有半导体芯片的布线板; 以及设置在所述布线板上的多个外部端子。 外部端子包括至少一个第一外部端子和两个或更多个第二外部端子。 第一外部端子由焊接材料形成。 每个第二外部端子包括焊接材料和由树脂形成并分散在焊料中的多个颗粒。 第二外部端子是外部端子之间的一对外部端子，并且一对外部端子之间的距离大于外部端子中的任何其它外部端子之间的距离。

公开(公告)号：US20060054867A1

公开(公告)日：2006-03-16

申请号：US10509204

申请日：2003-03-25

Applicant: Yukio Yamada

Inventor： Yukio Yamada

IPC: H01B1/12

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A conductive particle 30 which can be used for connecting a variety of adherends is provided, and the conductive particle 30 includes a resin particle 31, a first conductive particle disposed around the resin particle 31, a first resin coating 25 disposed on the periphery thereof and softer than the resin particle 31, and a second conductive thin film 36 disposed therearound; and if the surface part of, for example, an electrode 13 of an adherend that is to be connected is hard, a first resin coating 35 and the second conductive thin film 36 are destroyed by pressure to bring the second conductive thin film 36 in contact with the electrode 13 and a metal wiring 17. If the surface part of the electrode 13 is soft, the second conductive thin film on the surface side comes in contact with the electrode 13, which makes it possible for the particle to be used regardless of the surface state of an adherend, in other words, be used for connecting a variety of adherends

Abstract translation: 提供了可用于连接各种被粘物的导电粒子30，导电粒子30包括树脂粒子31，设置在树脂粒子31周围的第一导电粒子，设置在其周边的第一树脂被膜25和 比树脂粒子31柔软，以及设置在其周围的第二导电薄膜36。 并且如果例如要连接的被粘物的电极13的表面部分是硬的，则第一树脂涂层35和第二导电薄膜36被压力破坏，以使第二导电薄膜36接触 电极13和金属布线17.如果电极13的表面部分是软的，则表面侧的第二导电薄膜与电极13接触，这使得可以使用颗粒，而不管 被粘物的表面状态，换句话说，用于连接各种被粘体

公开(公告)号：US20050260430A1

公开(公告)日：2005-11-24

申请号：US10343944

申请日：2001-04-27

Applicant: Hiroshi Kuroda ,  Nobuyuki Okinaga

Inventor： Hiroshi Kuroda ,  Nobuyuki Okinaga

IPC: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32 ,  H05K3/34 ,  B32B15/02

CPC classification number: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10−5 to 7×10−5 (1/K).

Abstract translation: 本发明提供一种具有放松施加到基板的电路等的力的能力的导电细粒。 一种导电细颗粒，其包含由其表面覆盖有至少一个金属层的树脂制成的芯细颗粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -6， -5（1 / K）。