公开(公告)号：US06404476B1

公开(公告)日：2002-06-11

申请号：US08962448

申请日：1997-10-31

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F11345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US06356333B1

公开(公告)日：2002-03-12

申请号：US09448552

申请日：1999-11-23

Applicant: Kenji Uchiyama

Inventor： Kenji Uchiyama

IPC: G02F11345

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/189 ,  H05K3/323 ,  H05K3/341 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A conductive adhesive which can withstand exposure to high temperature during a solder reflow process comprises an adhesive resin and a plurality of conductive particles mixed in the adhesive resin. The conductive particles each include a core formed of a synthetic resin and a conductive material coated around the core. The cores are each formed of a material having a thermal deformation temperature higher than that of the adhesive resin, and more preferably formed of a material having a thermal deformation temperature (18.6 kg/cm2) higher than 120° C. as measured according to the measuring method defined in the ASTM standard D648, and still more preferably formed of a material selected from the group consisting of polyphenylene oxide, polysulfone, polycarbonate, polyacetal, and polyethylene terephthalate.

Abstract translation: 在回流焊接过程中可承受高温暴露的导电粘合剂包括粘合树脂和粘合树脂中混合的多个导电颗粒。 导电颗粒各自包括由合成树脂形成的芯和围绕芯部涂覆的导电材料。 芯部由热变形温度高于粘合剂树脂的材料形成，更优选由热变形温度（18.6kg / cm 2）高于120℃的材料形成，如根据 测定方法在ASTM标准D648中定义，并且还更优选由选自聚苯醚，聚砜，聚碳酸酯，聚缩醛和聚对苯二甲酸乙二醇酯的材料形成。

公开(公告)号：US20010046021A1

公开(公告)日：2001-11-29

申请号：US09141021

申请日：1998-08-27

Inventor： TAKESHI KOZUKA ,  TSUTOMU YAMAZAKI ,  IKUMI SAKATA

IPC: G02F001/1345

CPC classification number: G02F1/13452 ,  C09J9/02 ,  H01L2224/29399 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0307 ,  H01L2924/00

Abstract: A conductive particle used for an anisotropic conductive adhesive provides an anisotropic conductive bonding between terminal electrodes without deforming a wiring pattern or the terminal electrode of a circuit board. A conductive layer is formed on a surface of a core particle of the conductive particle. The conductive particle has a yield point within a range of degree of deformation from 5% to 40% so that a modulus of compressive deformation of the conductive particle drastically increases at the yield point.

Abstract translation: 用于各向异性导电粘合剂的导电颗粒在端子电极之间提供各向异性导电结合，而不会使电路板的布线图案或端子电极变形。 在导电性粒子的核心粒子的表面上形成导电层。 导电颗粒的屈服点在5％至40％的变形度范围内，使得导电颗粒的压缩变形模量在屈服点显着增加。

公开(公告)号：US20010002330A1

公开(公告)日：2001-05-31

申请号：US09768112

申请日：2001-01-23

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L021/44 ,  H01L021/46 ,  H01L021/50 ,  H01L023/48

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

公开(公告)号：US06177729B1

公开(公告)日：2001-01-23

申请号：US09303290

申请日：1999-04-03

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2348

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US6042894A

公开(公告)日：2000-03-28

申请号：US890342

申请日：1997-07-09

Applicant: Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

Inventor： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

IPC: C08J5/00 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24 ,  H05K3/10 ,  H05K3/32 ,  C08J7/04 ,  B05D5/00 ,  B05D1/36

CPC classification number: H01R13/2414 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H05K3/102

Abstract: An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Abstract translation: 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘着层并且填充与导电颗粒之间的粘合材料不相容的成膜树脂而产生的各向同性导电树脂薄膜材料仅通过该导电颗粒在膜厚度方向上具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。

公开(公告)号：US5770305A

公开(公告)日：1998-06-23

申请号：US534445

申请日：1995-09-27

Applicant: Shinji Terasaka

Inventor： Shinji Terasaka

IPC: G02F1/1345 ,  H01B1/22 ,  H01B5/00 ,  H01B5/16 ,  H01R11/01 ,  H05K3/32 ,  H05K3/38 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01L2224/29499 ,  H01L2224/83101 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  Y10S428/901 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/2998 ,  Y10T428/31511

Abstract: In an anisotropic conductive film, ultraresilient alloy particles, playing the role of conductive particles, are dispersed in a resin. With this configuration, the ACF reduces line defects to occur on a liquid crystal display panel and attributable thereto to one-tenth.

Abstract translation: 在各向异性导电膜中，发挥导电粒子的作用的超微细合金粒子分散在树脂中。 采用这种结构，ACF减少了在液晶显示面板上发生的线缺陷，并将其归因于十分之一。

公开(公告)号：US5120665A

公开(公告)日：1992-06-09

申请号：US671472

申请日：1991-03-19

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC: H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US4999460A

公开(公告)日：1991-03-12

申请号：US432135

申请日：1989-11-06

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R4/04 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/323 ,  H05K3/361

Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接第一和第二电子部件的导电连接结构，每个具有以小间距布置的多个连接端子。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US4740657A

公开(公告)日：1988-04-26

申请号：US13904

申请日：1987-02-12

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

IPC: H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  H01B1/16 ,  H01R43/00

CPC classification number: H01R4/04 ,  H01B1/22 ,  H05K3/323 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  H05K3/361 ,  Y10T29/49194

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.