公开(公告)号：WO2002061765A1

公开(公告)日：2002-08-08

申请号：PCT/JP2002/000499

申请日：2002-01-24

Applicant: ジェイエスアール株式会社 ,  伊藤 信幸 ,  増子 英明 ,  長谷川 里美 ,  能村 仲篤

Inventor： 伊藤 信幸 ,  増子 英明 ,  長谷川 里美 ,  能村 仲篤

IPC: H01B3/00

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A composition for forming a dielectric substance, characterized in that it comprises (A) composite particles for a dielectric substance comprising inorganic particles having a permittivity of 30 or more and an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance which covers a part or the whole of the surface of the above inorganic particles, and (B) a resin component comprising at least one of a polymerizable compound and a polymer; or in that it comprises ultramicroparticulate composite resin particles comprising (J) inorganic ultramicroparticles having an average particle diameter of 0.1 mu m or less and (B) a resin component comprising at least one of a polymerizable compound and a polymer, wherein a part or the whole of the surface of the above inorganic ultramicroparticles (J) is covered by the above resin component (B) and the above inorganic ultramicroparticles (J) is contained in an amount of 20 wt % or more, and inorganic particles having an average particle diameter of 0.1 mu m or less and having a permittivity of 30 or more, or inorganic composite particles comprising these inorganic particles and, adhered to a part or the whole of the surface thereof, an electroconductive metal or its compound, an electroconductive organic compound or an electroconductive inorganic substance.

Abstract translation: 一种形成电介质的组合物，其特征在于，其包含（A）包含电容率为30以上的无机粒子和导电性金属或其化合物的电介质的复合粒子，导电性有机化合物或导电性无机物， 覆盖上述无机粒子的一部分或全部表面，（B）含有聚合性化合物和聚合物中的至少一种的树脂成分; 或者其包含（J）平均粒径为0.1μm以下的（J）无机超微粒子的超微晶复合树脂粒子，（B）含有聚合性化合物和聚合物中的至少一种的树脂成分，其中， 上述无机超微粒子（J）的整个表面被上述树脂成分（B）覆盖，上述无机超微粒子（J）的含量为20重量％以上，无机粒子的平均粒径 0.1μm以下，介电常数为30以上的无机复合粒子，或者包含这些无机粒子的无机复合粒子，并且在其表面的一部分或全部附着有导电性金属或其化合物，导电性有机化合物或 导电无机物质。

公开(公告)号：WO0109054A9

公开(公告)日：2001-08-16

申请号：PCT/US0020459

申请日：2000-07-28

Applicant: PPG IND OHIO INC

Inventor： NOVICH BRUCE E ,  LAMMON-HILINSKI KAMI ,  ROBERTSON WALTER J ,  WU XIANG ,  VELPARI VEDAGIRI ,  LAWTON ERNEST L ,  RICE WILLIAM B

IPC: C03C25/10 ,  C03C25/00 ,  C03C25/48 ,  C08J5/08 ,  D06M15/507 ,  D06M15/564 ,  D06M15/59 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和在300K的温度下具有至少1瓦/米K的热导率的层状颗粒。 本发明还提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和不可水合的层状颗粒。 本发明还提供至少部分涂覆的纤维束，其包含多种纤维，所述纤维束在至少一种所述纤维的至少一部分表面上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 由选自非热膨胀性有机材料，无机聚合物材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有足以使纤维束湿润的平均粒度; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供至少部分涂覆的纤维束，其包含多种玻璃纤维，所述纤维束在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供一种至少部分涂覆的纤维束，其包含多种玻璃纤维，所述玻璃纤维在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）多个中空非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：WO99044955A1

公开(公告)日：1999-09-10

申请号：PCT/US1999/004056

申请日：1999-02-25

IPC: B29B15/10 ,  B29K105/08 ,  C03C25/10 ,  C03C25/26 ,  C03C25/42 ,  C08J5/08 ,  D06M11/00 ,  D06M11/58 ,  D06M11/79 ,  D06M11/80 ,  D06M11/81 ,  D06M13/513 ,  D06M15/11 ,  D06M15/507 ,  D06M15/55 ,  D06M15/564 ,  D06M23/08 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00 ,  C03C25/02

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

Abstract translation: 本发明提供浸渍有非研磨性固体颗粒的玻璃纤维线，其提供在用于增强复合材料的线内的相邻纤维之间至少3微米的间隙。

公开(公告)号：WO1988000527A1

公开(公告)日：1988-01-28

申请号：PCT/US1987001805

申请日：1987-07-24

Applicant: CLARK-SCHWEBEL, FIBERGLASS CORPORATION

Inventor： CLARK-SCHWEBEL, FIBERGLASS CORPORATION ,  VAUGHAN, Dennis, J. ,  CREECH, Mansfield, H., Jr. ,  PEEK, Roy, C., Jr.

IPC: B32B17/04

CPC classification number: H05K1/0366 ,  B32B17/10018 ,  B32B17/10688 ,  B32B17/10697 ,  C03C25/26 ,  C08J5/08 ,  H05K2201/0239

Abstract: Use of synthetic resins with glass and glass fibers to produce composite glass structures. In particular, the present invention provides a method for coating glass surfaces with a combination of a reinforcement resin and a coupling agent to produce composites which resist electrical, chemical and mechanical stresses before the incorporation of a final resin. These final coated glass fibers exhibit enhanced stability and resistance to electrical, chemical and mechanical stresses and can be layered and pressed into glass laminate products.

Abstract translation: 使用合成树脂与玻璃和玻璃纤维来生产复合玻璃结构。 特别地，本发明提供了一种通过增强树脂和偶联剂的组合来涂覆玻璃表面的方法，以产生在引入最终树脂之前抵抗电，化学和机械应力的复合材料。 这些最终涂覆的玻璃纤维表现出增强的稳定性和对电，化学和机械应力的抵抗性，并且可以分层并压制成玻璃层压制品。

公开(公告)号：US09386701B2

公开(公告)日：2016-07-05

申请号：US14092188

申请日：2013-11-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yeon Seop Yu ,  Moon Il Kim ,  Jun Young Kim

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2924/3511 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.

Abstract translation: 电子部件嵌入式印刷电路板包括具有空腔的芯体; 插入腔内的电子部件; 绝缘层层叠在芯的顶部和底部，并与具有分别作用在有机材料和无机材料上的官能团的偶联剂混合以结合到电子部件的外周表面; 以及设置在绝缘层上的电路图案。

公开(公告)号：US09330807B2

公开(公告)日：2016-05-03

申请号：US14088737

申请日：2013-11-25

Applicant: Empire Technology Development LLC

Inventor： Kazufumi Ogawa ,  Kazuhiro Soejima

IPC: H05K1/09 ,  H01B1/12 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12

CPC classification number: H01B1/12 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.

Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。

公开(公告)号：US09253911B2

公开(公告)日：2016-02-02

申请号：US13702485

申请日：2011-11-30

Applicant: Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

Inventor： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC: H05K7/04 ,  H01R43/00 ,  H01B1/10 ,  H01B1/08 ,  H01B1/20 ,  H01L23/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K7/04 ,  H01B1/08 ,  H01B1/10 ,  H01B1/20 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R43/00 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

Abstract translation: 本发明提供了一种各向异性导电材料及其制造方法，其中连续性较低，粘合强度较高。 当玻璃基板和金属布线材料被热压和粘合时，在玻璃基板和各向异性导电材料之间的界面中，玻璃基板的表面上的Si与二硫化硅烷末端的烷氧基（OR）反应 通过疏水性二氧化硅改性，并与其化学结合。 此外，在金属配线材料和各向异性导电材料之间的界面处，二硫化硅烷中的一部分S-S键（二硫键）由于热压接合时的热量而解离，并且解离的硫化硅化合物与 金属我。

公开(公告)号：US09175151B2

公开(公告)日：2015-11-03

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: C08K5/34 ,  H05K1/03 ,  H05K3/00 ,  C09D125/08 ,  C09D133/08 ,  C08K5/3475 ,  H05K3/10 ,  H05K3/18 ,  C08L33/02 ,  C08K5/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US09148953B2

公开(公告)日：2015-09-29

申请号：US14046408

申请日：2013-10-04

Applicant: Tyco Electronics Japan G. K.

Inventor： Katsunori Fukuda ,  Akira Torigoe

IPC: H05K1/03 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K1/0306 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239

Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.

Abstract translation: 提供一种玻璃布线板，其包括玻璃基板和底漆层。 主层设置在玻璃基板上，并且包括设置在中间层上的中间层和镀铜层。 中间层包括树脂偶联剂和分散在树脂偶联剂中的金属元素。

公开(公告)号：US20150240132A1

公开(公告)日：2015-08-27

申请号：US14189302

申请日：2014-02-25

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  C09J163/00 ,  H05K3/30 ,  C09K5/14 ,  B32B37/12 ,  B32B37/18

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Abstract translation: 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。