公开(公告)号：EP2930557A3

公开(公告)日：2015-12-09

申请号：EP15162072.1

申请日：2015-03-31

Applicant: Samsung Display Co., Ltd.

Inventor： Bae, Han-Sung ,  Kwak, Wonkyu ,  An, Cheolgeun

IPC: G02F1/1345 ,  H05K1/11

CPC classification number: H01L24/49 ,  G02F1/13458 ,  H01L24/06 ,  H01L2224/49431 ,  H01L2924/00014 ,  H05K1/117 ,  H05K1/118 ,  H05K3/323 ,  H05K2201/09418 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided is an electronic component comprising a first pad row (IPP1-110) having pads extending along corresponding extension lines (L1, L2, L3, L4) and a second pad row (IPP2-110) having pads extending along corresponding extension lines (L10, L20, L30, L40), wherein the pads of the first pad row include first pads (PG1, PG3) and second pads (PG2, PG4), wherein extension lines (L1, L3) of the first pads substantially converge to a first point (P1-1, P3-1), and extension lines (L2, L4) of the second pads substantially converge to a second point (P2-1, P4-1) different from the first point, and wherein the pads of the second pad row include third pads (PG10, PG30) and fourth pads (PG20, PG40), wherein extension lines (L10, L30) of the third pads substantially converge to a third point (P1-2, P3-2), and extension lines of the fourth pads substantially converge to a fourth point (P2-2, P4-2) different from the third point.

公开(公告)号：EP2826346A1

公开(公告)日：2015-01-21

申请号：EP13712380.8

申请日：2013-03-14

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO ,  IMEC

Inventor： VAN HECK, Gerardus Titus ,  DE KOK, Margaretha Maria

IPC: H05K1/02

CPC classification number: H05K1/111 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/189 ,  H05K3/301 ,  H05K13/00 ,  H05K2201/09263 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10962 ,  Y10T29/49002

Abstract: The present invention pertains to a submount (1) for mechanically and electrically coupling an electronic component (4) to a carrier (6). The submount (1) has a mounting portion (10) for mounting the submount to the carrier and has attachment portions (12a, 12b, 12c, 12d) for holding the electronic component. The submount further has primary electric contacts (14a, 14b) for cooperation with respective electrical conductors (61a, 61b) in the carrier, and secondary electric contacts (16a, 16b, 16c) for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions (18a, 18b, 18c) that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

公开(公告)号：EP2811337A1

公开(公告)日：2014-12-10

申请号：EP14162711.7

申请日：2014-03-31

Applicant: Samsung Display Co., Ltd.

Inventor： Bae, Han-Sung ,  Kwak, Wonkyu

IPC: G02F1/1345 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K7/06 ,  G02F1/13458 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A display panel (110) includes a display configured to display an image by receiving a drive signal, and a pad region including first (PG1, PG3) and second (PG2, PG4) pad groups configured to receive the drive signal from an outside and to provide the received drive signal to the display, wherein the first pad group (PG1, PG3) includes a plurality of first pads extending along a plurality of first imaginary lines (L4), the first imaginary lines being tilted at a predetermined angle with respect to a reference line (RL), wherein the second pad group (PG2, PG4) includes a plurality of second pads extending along a plurality of second imaginary lines (L3), the second imaginary lines being tilted at a predetermined angle with respect to the reference line (RL), and wherein the plurality of first imaginary lines converges into a first point (P1, P3) and the plurality of second imaginary lines converges into a second point (P2, P4), the first and second points being located at different positions.

Abstract translation: 显示面板（110）包括被配置为通过接收驱动信号来显示图像的显示器和包括被配置为从外部接收驱动信号的第一（PG1，PG3）和第二（PG2，PG4） 以向所述显示器提供所接收的驱动信号，其中所述第一焊盘组（PG1，PG3）包括沿着多个第一假想线（L4）延伸的多个第一焊盘，所述第一假想线相对于 参考线（RL），其中所述第二焊盘组（PG2，PG4）包括沿着多个第二假想线（L3）延伸的多个第二焊盘，所述第二假想线相对于所述第二假想线倾斜预定角度 参考线（RL），并且其中所述多个第一假想线收敛到第一点（P1，P3），并且所述多个第二假想线收敛到第二点（P2，P4），所述第一和第二点位于 不同的posi 蒸发散。

公开(公告)号：EP1976354A4

公开(公告)日：2012-08-01

申请号：EP06712032

申请日：2006-01-20

Applicant: FUJITSU LTD

Inventor： YOKOZAWA HIROSHI

IPC: H05K3/32 ,  H01L33/00

CPC classification number: H05K1/181 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

公开(公告)号：EP1928217B1

公开(公告)日：2011-02-23

申请号：EP07119068.0

申请日：2007-10-23

Applicant: NEC Corporation

Inventor： Chikuma, Tadayuki

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3489 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/025 ,  Y02P70/611 ,  Y10T428/24826

公开(公告)号：EP2218144A2

公开(公告)日：2010-08-18

申请号：EP08846823.6

申请日：2008-10-30

Applicant: FCI

Inventor： JOHNESCU, Douglas M. ,  MINICH, Steven ,  SMITH, Stephen B.

IPC: H01R12/16

CPC classification number: H01R13/6471 ,  H01R12/51 ,  H01R12/7082 ,  H01R12/71 ,  H01R13/514 ,  H01R13/6477 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/325 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49222

Abstract: Disclosed are electrical connectors and methods of assembling an electrical connector having 'standard' (i.e., with electrical contacts having in-line tails), jogged (i.e., with electrical contacts having jogged tails but not connected orthogonally to another connector through a substrate), and/or 'orthogonal' (i.e., with electrical contacts having jogged tails that are used in an orthogonal application) leadframe assemblies in the same connector. This provides the flexibility of using some of the available contacts in an orthogonal application and, at the same time, having remaining contacts available for routing on the midplane PCB. Though this could be done using only orthogonal leadframe assemblies, the combination of standard leadframe assemblies with orthogonal leadframe assemblies creates additional spacing between the PCB vias, so that signal traces can be more easily routed on the midplane PCB.

公开(公告)号：EP1625619A1

公开(公告)日：2006-02-15

申请号：EP04733356.2

申请日：2004-05-17

Applicant: Nokia Corporation

Inventor： HUSSA, Esa

IPC: H01L23/498

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the interconnections are aligned such that the pattern has substantially rounded or chamfered corners. The present invention provides an improved interconnection life and reliability of ball grid array packages and it is easily implemented.

公开(公告)号：EP1209736A3

公开(公告)日：2002-07-24

申请号：EP01127267.1

申请日：2001-11-16

Applicant: SONY CORPORATION

Inventor： Yoshida, Koji

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0665 ,  H05K3/328 ,  H05K2201/09418 ,  H05K2201/10674 ,  H05K2203/0285 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor device includes a wiring pattern formed on a board, and a semiconductor chip bonded to the wiring pattern by ultrasonic welding. The wiring pattern is formed such that when the semiconductor chip is disposed on the wiring pattern, a range shared between the wiring pattern and positional variation regions of portions to be bonded of the semiconductor chip accompanied by the ultrasonic welding becomes as wide as possible. Such a semiconductor device makes it possible to ensure a sufficient positional deviation range of a wiring pattern with respect to a positional deviation in each bump type electrode, and hence to cope with a multipin structure for flip-chip mounting and to improve both an initial bonding characteristic and a mounting reliability.

公开(公告)号：EP0712142B1

公开(公告)日：2001-12-05

申请号：EP95306719.6

申请日：1995-09-22

Applicant: DALE ELECTRONICS, INC.

Inventor： Adelman, Jeffrey T., ,  Veik, Thomas L., ,  Zwick, Scott D.,

IPC: H01F41/04 ,  H02K3/00 ,  H05K3/40 ,  H01C17/06

CPC classification number: H01G4/232 ,  H01F41/046 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K2201/09172 ,  H05K2201/09418 ,  H05K2203/0143 ,  Y10T29/435 ,  Y10T29/49016 ,  Y10T29/49204 ,  Y10T29/49224 ,  Y10T29/49789 ,  H01L2924/00

公开(公告)号：EP0715489A3

公开(公告)日：1997-02-19

申请号：EP95308025.6

申请日：1995-11-09

Applicant: NCR International, Inc.

Inventor： König, Walter (NMI) ,  Mödl, Albert (NMI) ,  Baur, Peter Franz

IPC: H05K3/36 ,  H01R23/72

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H01R12/714 ,  H01R13/658 ,  H05K1/117 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: A printed circuit board assembly includes two-dimensional arrays of connectors (14,16) to provide significantly higher data transfer rates than typical one-dimensionally arranged connectors, without sacrificing board space. The assembly includes a plurality of connection pads (14,16) on each printed circuit board (10,12). A layer of anisotropically conducting material (26) is placed between the connection pads and the boards are held together by fastening screws (28).

Abstract translation: 印刷电路板组件包括连接器（14,16）的二维阵列，以提供比典型的一维布置的连接器显着更高的数据传输速率，而不牺牲电路板空间。 该组件在每个印刷电路板（10,12）上包括多个连接垫（14,16）。 在连接垫之间放置一层各向异性传导材料（26），并且通过紧固螺钉（28）将这些板保持在一起。