公开(公告)号：EP1325538B1

公开(公告)日：2004-04-21

申请号：EP01965238.7

申请日：2001-08-31

Applicant: DaimlerChrysler AG

Inventor： KANBACH, Helmut

IPC: H01R4/02 ,  H01R12/08 ,  H01R43/02

CPC classification number: H01R12/61 ,  H01R4/025 ,  H01R43/0242 ,  H05K3/363 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/175 ,  Y10T29/49149

Abstract: The invention relates to a method for connecting two film cable ends. A metal strip (4), which is tin-plated with a solder, is placed transversally across the conductor strips (2) between the two film cable ends (1), the latter are pressed together with the interposed tin-plated metal strip, the metal strip is supplied with current and heated until the solder of the metal strip melts and fuses with the conductor strips of the film cable. Once the solder connection has been made, the metal strip is severed in the intermediate spaces between two neighbouring conductor strips.

公开(公告)号：EP1315780A2

公开(公告)日：2003-06-04

申请号：EP01968695.5

申请日：2001-09-07

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro ,  HIRASAWA, Yuji

IPC: C09J7/02 ,  C09J5/06 ,  H01R4/04

CPC classification number: H05K3/321 ,  C09J5/06 ,  C09J7/28 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2461/00 ,  C09J2463/00 ,  H01R4/04 ,  H05K3/4015 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2203/1189

Abstract: A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.

公开(公告)号：EP0800338B1

公开(公告)日：2001-05-30

申请号：EP97105474.7

申请日：1997-04-02

Applicant: Langer, Gunter

Inventor： Langer, Gunter

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K3/341 ,  H05K3/3452 ,  H05K9/0039 ,  H05K2201/09236 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2201/10818 ,  Y02P70/613

公开(公告)号：EP0999253A1

公开(公告)日：2000-05-10

申请号：EP99919580.3

申请日：1999-05-14

Applicant: Sony Chemicals Corporation

Inventor： KUMAKURA, Masayuki, Sony Chemicals Corp.

IPC: C09J167/00 ,  C09J7/02 ,  H01B3/00 ,  H01B7/08 ,  H05K1/03

CPC classification number: H05K3/386 ,  C09J167/00 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0769 ,  H05K2201/1028 ,  H05K2203/122 ,  H05K2203/1545 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2958

Abstract: When an adhesive is applied on a metallic wiring, the metal forming the metallic wiring film dissolutes as ions into the adhesive with time. If the adhesive is based on a polyester resin and placed in an environment of high temperature or high temperature and high humidity, adhesion and insulation are deteriorated by the free metallic ions. However, adhesives of the present invention contain a cation scavenger to scavenge the free metallic ions in the adhesives. Thus, highly durable flat cables can be obtained.
Thus, flat cables with reduced loss in adhesive strength and insulation are provided.

Abstract translation: 当将粘合剂施加在金属布线上时，形成金属布线膜的金属随时间溶解成粘合剂中的离子。 如果粘合剂基于聚酯树脂并且放置在高温或高温和高湿度的环境中，则通过游离的金属离子使粘合和绝缘劣化。 然而，本发明的粘合剂含有阳离子清除剂以清除粘合剂中的游离金属离子。 因此，可以获得高度耐用的扁平电缆。 因此，提供了具有降低的粘合强度和绝缘损失的扁平电缆。

公开(公告)号：EP0510516A3

公开(公告)日：1993-04-28

申请号：EP92106571.0

申请日：1992-04-16

Applicant: Dr. Johannes Heidenhain GmbH

Inventor： Kraus, Heinz ,  Bayer, Erich

IPC: G01D5/34 ,  G01D5/26

CPC classification number: G01D5/34707 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/36 ,  H05K3/4092 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/1084

Abstract: Bei einer derartigen Sensoranordnung, beispielsweise zur Abtastung einer Meßteilung bei einer Positionsmeßeinrichtung, weist ein Substrat (2) die Sensoren (5) und in integrierter Form mit diesen Sensoren (5) elektrisch verbundene Leiterbahnen (6) eines ersten Teils eines elektrischen Verbindungselements (7) auf. Diese Leiterbahnen (6) überragen das Substrat (2) in einen zweiten Teil des elektrischen Verbindungselements (7) freitragend und werden an ihren freien Enden (13) mit Kontaktstellen einer Leiterplatte durch Lötung verbunden.

公开(公告)号：EP0343377B1

公开(公告)日：1991-03-27

申请号：EP89107073.2

申请日：1989-04-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Dederer, Günther, Dipl.-Ing. (FH)

IPC: H05K3/22

CPC classification number: H05K3/225 ,  B21D28/06 ,  H05K3/3457 ,  H05K2201/1028 ,  H05K2201/10924 ,  H05K2203/173 ,  Y10T83/0577 ,  Y10T83/06 ,  Y10T83/2159 ,  Y10T83/4453 ,  Y10T83/4534 ,  Y10T83/4635

公开(公告)号：EP0297018A3

公开(公告)日：1990-05-30

申请号：EP88500008.3

申请日：1988-02-03

Applicant: CIRCUITGRAPH, S.L.

Inventor： Valenciano Melero, Pedro

IPC: H05K3/22 ,  H05K7/06 ,  H05K13/06

CPC classification number: H05K3/222 ,  H05K3/225 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2203/173

Abstract: The invention refers to a tip to mount or repair printed circuit board lines, designed as an accessory to the electronic circuit wiring device described in Patented Invention 538.302. This tip includes a means of attachment to this device intended to substitute the latter's classic tip, at the free end of which device the flat tip itself is located whose section is equal to that of a thin band of tin coated copper designed to be the wiring element to obtain or repair circuit lines, fed by a reel attached to the device.

Abstract translation: 本发明涉及安装或修理专利发明538.302中描述的电子电路布线装置附件的印刷电路板线的尖端。 该尖端包括附接到该装置的装置，其用于替代后者的经典尖端，在平坦尖端本身所在的装置的自由端，其截面等于被设计为布线的镀锡铜薄带的截面 元件，以获得或修理电路线，由连接到该装置的卷轴馈送。

公开(公告)号：EP0297018A2

公开(公告)日：1988-12-28

申请号：EP88500008.3

申请日：1988-02-03

Applicant: CIRCUITGRAPH, S.L.

Inventor： Valenciano Melero, Pedro

IPC: H05K3/22 ,  H05K7/06 ,  H05K13/06

CPC classification number: H05K3/222 ,  H05K3/225 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2203/173

Abstract: The invention refers to a tip to mount or repair printed circuit board lines, designed as an accessory to the electronic circuit wiring device described in Patented Invention 538.302. This tip includes a means of attachment to this device intended to substitute the latter's classic tip, at the free end of which device the flat tip itself is located whose section is equal to that of a thin band of tin coated copper designed to be the wiring element to obtain or repair circuit lines, fed by a reel attached to the device.

Abstract translation: 本发明涉及到尖端以安装或修理的印刷电路板线，设计为向附件在专利发明538302描述的电子电路接线装置。 此尖端包括附连到该设备用于代替后者的经典尖端，在该装置的自由端的平头本身的装置位于其截面等于没有设计成布线镀锡铜的薄带的 元件来获得或修复电路线，通过卷轴馈送附接到装置。

公开(公告)号：EP0265613A3

公开(公告)日：1988-09-28

申请号：EP87111950

申请日：1987-08-18

Applicant: International Business Machines Corporation

Inventor： Amendola, Albert ,  Kumar, Ananda Hosakere ,  Vance, Thomas Ray

IPC: H01L23/52 ,  H01L21/48 ,  H01L21/90 ,  H03K03/22

CPC classification number: H05K3/4015 ,  H05K3/04 ,  H05K3/20 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/0317 ,  H05K2201/1028 ,  H05K2203/0156 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/0528 ,  H05K2203/0743 ,  H05K2203/1105 ,  H05K2203/173

Abstract: Disclosed is a method for repairing opens (12) in thin film conductor lines (11) on a substrate (10), preferably a multilayered ceramic substrate. An unpatterned repair metal film (20) is placed over a general area of open defects (12) in conductive lines (11) on a substrate (10). Preferably, this metal is placed over the conductive lines and opens therein by decal transfer. The assembly is then heated to cause diffusion bonding between the repair metal (20) and conductive lines (11), but not between the repair metal (20) and substrate (10). After diffusion bonding, the structure has metal bridges formed across any open defects covered by the repair film and also between adjacent conductive lines. The area of repair is then subjected to ultrasonic energy in a liquid ambient for a time at least long enough to remove metal bridges between adjacent conductive lines, but less than that required to remove repair metal bridges over the opens in the conductive lines. The resultant structure has metal bridges spanning opens in the conductive lines, and no metal bridges between adjacent conductive lines.

公开(公告)号：EP0043586B1

公开(公告)日：1987-04-08

申请号：EP81105265.3

申请日：1981-07-07

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Thorwarth, Rüdiger

IPC: H05K3/22 ,  B23K11/32

CPC classification number: H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49742