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    Method of supporting electronic component elastically, and electronic device
    142.
    发明专利
    Method of supporting electronic component elastically, and electronic device 有权
    支持电子元件弹性的方法和电子设备

    公开(公告)号：JP2011124598A

    公开(公告)日：2011-06-23

    申请号：JP2011020051

    申请日：2011-02-01

    Applicant: Sony Ericsson Mobile Communications Ab ,  ソニー エリクソン モバイル コミュニケーションズ, エービー

    Inventor： HOLMBERG PER

    IPC: H05K9/00 ,  H05K1/02 ,  H05K3/30

    CPC classification number: H05K9/0026 ,  H05K1/0218 ,  H05K3/301 ,  H05K2201/0133 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/2045

    Abstract: PROBLEM TO BE SOLVED: To provide a method of supporting an electronic component that can prevent an error operation because of a crack of soldered joint resulting from dynamic force, and to provide an electronic device for supporting an electronic component reliably.
    SOLUTION: The electronic device includes a printed circuit substrate 14 and a structure component 15 to cover at least a part of the PCB 14. The method includes a step to mount the electronic component 17 on the PCB 14, a step to supply an elastically compressible impact absorbable component 18 on the area 22 of the structure component 15, and a step to assemble the PCB 14 and structure component 15. The impact absorbing component 18 is composed to cover the electronic component 17. When assembling, the elastically compressible impact absorbing component 18 is located so as to affect an pressure onto the electronic component 17 on the PCB 14. The electronic device whose elastically-compressible impact absorbing component 18 is located between the structure component and PCB is disclosed.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 解决的问题：提供一种支持电子部件的方法，该电子部件能够防止由于动力引起的焊接接头的裂纹引起的错误操作，并且提供用于可靠地支撑电子部件的电子设备。 解决方案：电子设备包括印刷电路基板14和覆盖PCB 14的至少一部分的结构部件15.该方法包括将电子部件17安装在PCB 14上的步骤，供应步骤 在结构部件15的区域22上的弹性可压缩的冲击吸收部件18以及组装PCB14和结构部件15的步骤。冲击吸收部件18构成为覆盖电子部件17.当组装时，可弹性压缩 冲击吸收部件18被定位成影响对PCB 14上的电子部件17的压力。其弹性可压缩冲击吸收部件18位于结构部件和PCB之间的电子设备被公开。 版权所有（C）2011，JPO＆INPIT

    Electro-optical device, mounting structure, electronic apparatus, and method of manufacturing the electro-optical device
    144.
    发明专利
    Electro-optical device, mounting structure, electronic apparatus, and method of manufacturing the electro-optical device 审中-公开
    电光装置，安装结构，电子设备和制造电光装置的方法

    公开(公告)号：JP2007156288A

    公开(公告)日：2007-06-21

    申请号：JP2005354355

    申请日：2005-12-08

    Applicant: Epson Imaging Devices Corp ,  エプソンイメージングデバイス株式会社

    Inventor： SAITO ATSUSHI

    IPC: G09F9/00 ,  G02F1/1345 ,  H05K1/18 ,  H05K3/32

    CPC classification number: H05K3/323 ,  G02F1/13452 ,  H05K3/284 ,  H05K3/285 ,  H05K3/301 ,  H05K2201/0133 ,  H05K2201/10393 ,  H05K2201/10674

    Abstract: PROBLEM TO BE SOLVED: To suppress the occurrence of conductive connection defects, caused by the reduction in the adhesive strength of insulating resin for making improved the electrical reliability of the mounting structure of a substrate and an electronic component bonded with insulating resin or an electro-optical device, including this mounting structure. SOLUTION: An electro-optical device 100 has a substrate 126, on which an electro-optical material is disposed, and an electronic component 130 is mounted on the substrate 126. A conductor, provided on the substrate and an electrode provided to the electronic component are conductively connected directly or indirectly, and the substrate and the electronic component are bonded by the insulating resin, and an inhibitor 140 which generates reaction, at least when the conductor and the electrode are separated is provided separate from the insulating resin. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 解决的问题为了抑制由于绝缘树脂的粘合强度的降低导致的导电连接缺陷的发生，提高了用绝缘树脂粘合的基板和电子部件的安装结构的电可靠性或 包括该安装结构的电光装置。 解决方案：电光装置100具有基板126，其上设置有电光材料，电子部件130安装在基板126上。设置在基板上的导体和设置在基板126上的电极 电子部件直接或间接地导电连接，并且基板和电子部件通过绝缘树脂接合，至少在导体和电极分离时产生反应的抑制剂140与绝缘树脂分开设置。 版权所有（C）2007，JPO＆INPIT

    Printed circuit board assembly with reinforcing material for ball grid array
    145.
    发明专利
    Printed circuit board assembly with reinforcing material for ball grid array 审中-公开
    印刷电路板组件，用于球网阵列的增强材料

    公开(公告)号：JP2006216944A

    公开(公告)日：2006-08-17

    申请号：JP2006016582

    申请日：2006-01-25

    Applicant: Agilent Technol Inc ,  アジレント・テクノロジーズ・インクAgilent Technologies, Inc.

    Inventor： BERTO THOMAS E ,  VAZE ANIRUDH N

    IPC: H05K1/02 ,  H01L23/40 ,  H05K1/18 ,  H05K7/20

    CPC classification number: H05K3/301 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To increase reliability by reducing the stress formed at a junction between a BGA device and a substrate.
    SOLUTION: A ball grid array device 322 is attached to a first side of a circuit board 320, and a reinforcing material 310 is secured to the circuit board 320 so as to surround the ball grid array device. Legs 332, 334, 336, 338 are formed in the reinforcing material and elements of the reinforcing material extending at each of legs, and bearing the strength for reinforcing the substrate are prepared so as to be separated from the ball grid array device mounting face on the substrate. Because the elements are separated, the rigidity against a bending moment which acts to the substrate and reinforcing material is increased, and the reliability is increased by reducing the stress formed at the junction between the ball grid array device and the substrate. Moreover, electronic parts can be mounted in the lower position of the element, and the mounting area on the substrate can be increased.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：通过减少在BGA器件和衬底之间的接合处形成的应力来提高可靠性。 解决方案：球栅阵列器件322附接到电路板320的第一侧，并且加强材料310固定到电路板320以围绕球栅阵列器件。 腿332,334,336,338形成在增强材料中，并且在每个腿处延伸并且承受用于加强基底的强度的增强材料的元件被制备成与球栅阵列装置安装面分离 底物。 由于元件分离，所以抵抗作用于基板和增强材料的弯矩的刚性增加，并且通过减小在球栅阵列器件和基板之间的接合处形成的应力而提高可靠性。 此外，电子部件可以安装在元件的下部位置，并且可以增加基板上的安装面积。 版权所有（C）2006，JPO＆NCIPI

    Socket and manufacturing method thereof
    150.
    发明专利
    Socket and manufacturing method thereof 有权
    插座及其制造方法

    公开(公告)号：JP2012028408A

    公开(公告)日：2012-02-09

    申请号：JP2010163141

    申请日：2010-07-20

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： HORIKAWA YASUYOSHI ,  IHARA YOSHIHIRO ,  MOCHIZUKI KENJI ,  TANAKA MASATO

    IPC: H01L23/32 ,  H01R33/76 ,  H01R43/00

    CPC classification number: H01R12/716 ,  H01R13/2442 ,  H05K3/301 ,  H05K3/3436 ,  H05K7/1069 ,  H05K2201/10325 ,  H05K2201/10393 ,  Y10T29/49147

    Abstract: PROBLEM TO BE SOLVED: To provide a socket capable of reducing the height and also capable of reducing the connection distance between a connection object and a mounting substrate or the like, as well as to provide a manufacturing method of the socket.SOLUTION: A socket comprises a connection terminal having a first connection formed on one end and a second connection formed on the other end. The socket detachably connects a connection object to a substrate via the connection terminal. The socket also comprises: a support body for fixing the connection terminal; and a through-hole formed on the support body. The connection terminal is inserted into the through-hole. The first connection is fixed to one face of the support body, and the second connection protrudes from the other face of the support body.

    Abstract translation: 要解决的问题：提供一种能够降低高度并且还能够减少连接对象和安装基板等之间的连接距离的插座，以及提供插座的制造方法。 解决方案：插座包括具有形成在一端上的第一连接和在另一端形成的第二连接的连接端子。 插座通过连接端子将连接对象可拆卸地连接到基板。 插座还包括：用于固定连接端子的支撑体; 以及形成在所述支撑体上的通孔。 连接端子插入到通孔中。 第一连接件固定在支撑体的一个面上，第二连接部从支撑体的另一个面突出。 版权所有（C）2012，JPO＆INPIT

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