公开(公告)号：US5943555A

公开(公告)日：1999-08-24

申请号：US954307

申请日：1997-10-17

Applicant: Hiromu Shiomi ,  Yoshiki Nishibayashi ,  Shin-ichi Shikata

Inventor： Hiromu Shiomi ,  Yoshiki Nishibayashi ,  Shin-ichi Shikata

IPC: B81B3/00 ,  B81C1/00 ,  G01C19/56 ,  G01H3/08 ,  G01H11/00 ,  G01H11/06 ,  G01L9/00 ,  G01P15/08 ,  G01P15/125 ,  G01Q70/14 ,  G01Q80/00 ,  H01L21/00

CPC classification number: G01P15/0802 ,  B81B3/007 ,  B81C1/0015 ,  B81C1/00682 ,  G01H11/00 ,  G01H11/06 ,  G01H3/08 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/034 ,  B81B2201/035 ,  B81B2201/054 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C2201/0109 ,  G01P2015/0828

Abstract: A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.

Abstract translation: 本发明的微型机械部件包括基座和至少一个支撑在基座上并相对驱动到基座的驱动部分，驱动部分由金刚石层形成。 因此，由于驱动部具有优异的机械强度和弹性模量，因此从以往的水平来看，作为微细的机械零件加工成微细的机械部件，可以大大提高其操作性能。 此外，由于驱动部在恶劣的环境下表现出优异的器件特性，所以作为微机械部件的应用范围可以从传统的范围得到广泛的扩展。

公开(公告)号：US5909078A

公开(公告)日：1999-06-01

申请号：US767192

申请日：1996-12-16

Applicant: Robert L. Wood ,  Vijayakumar R. Dhuler

Inventor： Robert L. Wood ,  Vijayakumar R. Dhuler

IPC: B81B3/00 ,  F03G7/06 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H02N11/00 ,  F01L1/00 ,  H01G7/00

CPC classification number: F03G7/06 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  G02B6/3803 ,  G02B6/4226 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H9/14

Abstract: Microelectromechanical actuators include at least one arched beam which extends between spaced apart supports on a microelectronic substrate. The arched beams are arched in a predetermined direction and expand upon application of heat thereto. A coupler mechanically couples the plurality of arched beams between the spaced apart supports. Heat is applied to at least one of the arched beams to cause further arching as a result of thermal expansion thereof, and thereby cause displacement of the coupler along the predetermined direction. Internal heating of the arched beams by passing current through the arched beams may be used. External heating sources may also be used. The coupler may be attached to a capacitor plate to provide capacitive sensors such as flow sensors. The coupler may also be attached to a valve plate to provide microvalves. Compensating arched beams may be used to provide ambient temperature insensitivity.

Abstract translation: 微机电致动器包括至少一个拱形梁，其在微电子衬底上的间隔开的支撑件之间延伸。 拱形梁在预定方向上拱形并且在施加热量时膨胀。 耦合器在间隔开的支撑件之间机械耦合多个拱形梁。 对至少一个拱形梁施加热量，由于其热膨胀而导致进一步的拱起，从而引起联接器沿着预定方向的位移。 可以使用通过拱形梁使电流通过拱形梁的内部加热。 也可以使用外部加热源。 耦合器可以附接到电容器板以提供诸如流量传感器的电容式传感器。 联接器还可以附接到阀板以提供微型阀。 补偿拱形梁可用于提供环境温度不敏感性。

公开(公告)号：EP3284714A1

公开(公告)日：2018-02-21

申请号：EP17187125.4

申请日：2017-08-21

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： LISEC, Thomas ,  LOFINK, Fabian

IPC: B81C1/00

CPC classification number: C12Q1/002 ,  B81B2201/0235 ,  B81B2201/054 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00182 ,  C23C16/45525 ,  G01R33/02

Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen einer Vorrichtung, wobei ein Substrat (10) bereitgestellt wird, das eine Aussparung (11) aufweist. In die Aussparung (11) wird eine Vielzahl loser Partikel (12) eingebracht. Ein erster Anteil (1) der Partikel (12) wird, unter Verwendung eines Beschichtungsprozesses, der eine Eindringtiefe von einer Öffnung (11 d) der Aussparung (11) ausgehend entlang einer Tiefenrichtung (14) in die Aussparung (11) hinein aufweist, beschichtet, so dass der erste Anteil (1) zu einer verfestigten porösen Struktur (13) verbunden wird. Die Eindringtiefe des Beschichtungsprozesses in die Aussparung (11) wird so eingestellt, dass ein zweiter Anteil (2) der Partikel (12) nicht mittels der Beschichtung verbunden wird, und so dass der verfestigte erste Anteil (1) der Partikel (12) zwischen dem zweiten Anteil (2) der Partikel (12) und einer Umgebung (15) der Aussparung (11) angeordnet ist. Erfindungsgemäß wird der zweite Anteil (2) der Partikel (12) zumindest teilweise aus der Aussparung (11) entfernt.

Abstract translation: 本发明涉及一种用于制造装置的方法，其中提供具有凹部（11）的基板（10）。 在凹槽（11）中引入多个松散颗粒（12）。 所述微粒（12），使用涂布过程的第一部分（1），开口（11 d）的穿透深度在凹槽（11）沿所述凹槽（11）的深度方向（14）开始进入，经涂覆的 使得第一部分（1）连接到凝固的多孔结构（13）。 涂覆工艺的渗透在凹槽的深度（11）被设定为使得所述颗粒的第二部分（2）（12）不被涂覆的方式连接，使得之间的颗粒（12）的固化的第一部分（1） 布置颗粒（12）的第二部分（2）和凹部（11）的环境（15）。 根据本发明，颗粒（12）的第二部分（2）至少部分地从凹槽（11）移除。

公开(公告)号：EP2554510B1

公开(公告)日：2018-01-10

申请号：EP12177755.1

申请日：2012-07-25

Applicant: Teledyne Dalsa Semiconductor Inc.

Inventor： Johnstone, Robert ,  Martel, Stéphane

IPC: B81C1/00

CPC classification number: B81C1/00182 ,  B81B2201/054 ,  B81C2201/019 ,  B81C2203/0735

Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

公开(公告)号：EP2554510A2

公开(公告)日：2013-02-06

申请号：EP12177755.1

申请日：2012-07-25

Applicant: Teledyne Dalsa Semiconductor Inc.

Inventor： Johnstone, Robert ,  Martel, Stéphane

IPC: B81C1/00

CPC classification number: B81C1/00182 ,  B81B2201/054 ,  B81C2201/019 ,  B81C2203/0735

Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

Abstract translation: 通过在衬底上沉积第一金属层以提供静电致动器的第一电极，在第一金属层上方沉积第一结构聚合物层，在第一结构聚合物层上方沉积第二金属层以形成微结构聚合物层 静电致动器的第二电极，在所述第一结构聚合物层上沉积绝缘层，平坦化绝缘层，通过绝缘层和第二金属层蚀刻第一结构聚合物层以切割第二金属层，提供额外的预形成 结构聚合物层，其中至少一个已经被预先图案化，并且最后将平坦化的第二绝缘层上的堆叠形式的附加结构层结合到一个或多个微流体通道。 该技术还可以用于在没有静电致动器的装置中跨越通道，在这种情况下可以省略金属层。

公开(公告)号：EP2520367A1

公开(公告)日：2012-11-07

申请号：EP12179245.1

申请日：2006-10-03

Applicant: Rheonix, Inc.

Inventor： Lincoln, Young ,  Peng, Zhou

IPC: B01L3/00 ,  F04B43/04 ,  B32B27/00 ,  F04B53/10 ,  B01F11/00 ,  B01F13/00 ,  B01F5/06 ,  B29C65/48 ,  B81B1/00 ,  C09J5/00 ,  F16K99/00 ,  F04B43/06 ,  B81C1/00

CPC classification number: F16K7/12 ,  B01F5/0683 ,  B01F5/0688 ,  B01F11/0071 ,  B01F13/0059 ,  B01F2215/0034 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0861 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/06 ,  B01L2400/0638 ,  B01L2400/0655 ,  B01L2400/084 ,  B29C65/4895 ,  B29C66/004 ,  B29C66/54 ,  B29C66/5412 ,  B29C66/71 ,  B29K2025/00 ,  B29K2025/04 ,  B29K2033/08 ,  B29K2069/00 ,  B29K2101/12 ,  B29L2031/7496 ,  B29L2031/7506 ,  B29L2031/756 ,  B81B3/0021 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127 ,  B81C1/00103 ,  B81C1/00158 ,  F04B43/028 ,  F04B43/043 ,  F04B43/06 ,  F15C1/08 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0021 ,  F16K99/0034 ,  F16K99/0055 ,  F16K99/0057 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T29/49405 ,  Y10T137/212 ,  Y10T137/2202 ,  Y10T137/2218 ,  Y10T137/8593 ,  Y10T137/85978 ,  Y10T156/1002 ,  Y10T156/1043 ,  B29K2033/12 ,  B29K2025/06

Abstract: Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

Abstract translation: 塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜与衬底的表面相抵靠，并且其中隔膜从衬底移开的致动状态。 从下面的描述可以看出，用该隔膜形成的微流体结构提供易于制造和坚固的系统，以及容易制造的部件，例如阀和泵。

公开(公告)号：EP2298448A3

公开(公告)日：2012-05-30

申请号：EP10181157.8

申请日：2003-09-24

Applicant: California Institute of Technology

Inventor： Maerkl, Sebastian J ,  Thorsen, Todd A ,  Xiaoyan, Bao ,  Quake, Stephen R ,  Studer, Vincent

IPC: B01L3/00 ,  B81B1/00 ,  F16K99/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: C12Q1/28 ,  B01L3/5025 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/0214 ,  B81B2201/054 ,  B81B2201/07 ,  B81C1/00119 ,  F15C5/00 ,  F16K11/20 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0318 ,  Y10T137/0329 ,  Y10T137/2224 ,  Y10T137/85938 ,  Y10T137/87249

Abstract: High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (LSI). A component of these networks is the fluidic multiplexor, which is a combinatorial array of binary valve patterns that exponentially increases the processing power of a network by allowing complex fluid manipulations with a minimal number of inputs. These integrated microfluidic networks can be used to construct a variety of highly complex microfluidic devices, for example devices for isolating elements of heterogeous samples.

Abstract translation: 高密度微流控芯片包含具有数千个微机械阀门和数百个可单独寻址的腔室的管道网络。 这些流体装置类似于使用大规模集成（LSI）制造的电子集成电路。 这些网络的一个组成部分是流体多路复用器，它是二进制阀模式的组合阵列，通过允许使用最少数量的输入的复杂流体操纵来指数地增加网络的处理能力。 这些集成的微流体网络可用于构建各种高度复杂的微流体装置，例如比较器阵列的微流体模拟装置和类似于电子随机存取存储器的微流体存储器存储装置。

公开(公告)号：EP2309130A2

公开(公告)日：2011-04-13

申请号：EP10180441.7

申请日：2000-06-27

Applicant: California Institute of Technology

Inventor： Unger, Marc A. ,  Scherer, Axel ,  Quake, Stephen R. ,  Chou, Hou-Pu ,  Thorsen, Todd A.

IPC: F04B43/04 ,  F15C5/00 ,  F16K99/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer, bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿着所述第二弹性体层的底表面延伸的第二凹槽，将所述第二弹性体层的底表面接合到顶部 第一弹性体层的表面，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将所述第一弹性体层定位在平面基底的顶部上，使得在所述第一弹性体层和所述平面基底之间的所述第一凹部中形成流动通道。

公开(公告)号：EP2213615A2

公开(公告)日：2010-08-04

申请号：EP09172447.6

申请日：2003-09-24

Applicant: California Institute of Technology

Inventor： Maerkl, Sebastian J ,  Thorsen, Todd A ,  Bao, Xiaoyan ,  Quake, Stephen R ,  Studer, Vincent

IPC: B81C1/00

CPC classification number: C12Q1/28 ,  B01L3/5025 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/0214 ,  B81B2201/054 ,  B81B2201/07 ,  B81C1/00119 ,  F15C5/00 ,  F16K11/20 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0318 ,  Y10T137/0329 ,  Y10T137/2224 ,  Y10T137/85938 ,  Y10T137/87249

Abstract: High-density microfluidic chips contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using large scale integration (LSI). A component of these networks is the fluidic multiplexor, which is a combinatorial array of binary valve patterns that exponentially increases the processing power of a network by allowing complex fluid manipulations with a minimal number of inputs. These integrated microfluidic networks can be used to construct a variety of highly complex microfluidic devices, for example the microfluidic analog of a comparator array, and a microfluidic memory storage device resembling electronic random access memories.

公开(公告)号：EP1317399B1

公开(公告)日：2006-08-30

申请号：EP01970902.1

申请日：2001-09-14

Applicant: MCNC

Inventor： GOODWIN-JOHANSSON, Scott, H. ,  MCGUIRE, Gary, E.

IPC: B81B3/00 ,  F16J3/02 ,  F15C5/00

CPC classification number: F16K99/0001 ,  B81B3/0021 ,  B81B2201/054 ,  B81B2203/0127 ,  B81B2203/04 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0028 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2059/0081

Abstract: A MEMS valve device driven by electrostatic forces is provided. The MEMS valve device includes a substrate having an aperture formed therein, a substrate electrode, a moveable membrane that overlies the aperture and has an electrode element and a biasing element. Additionally, at least one resiliently compressible dielectric layer is provided to insure electrical isolation between the substrate electrode and electrode element of the moveable membrane. In operation, a voltage differential is established between the substrate electrode and the electrode element of the moveable membrane to move the membrane relative to the aperture to thereby controllably adjust the portion of the aperture that is covered by the membrane. In another embodiment the resiliently compressible dielectric layer(s) have a textured surface; either at the valve seat, the valve seal or at both surfaces. In another embodiment of the invention a pressure-relieving aperture is defined within the substrate and is positioned to underlie the moveable membrane.