Abstract:
A multilayer mirror is constructed and arranged to reflect radiation having a wavelength in the range of 2-8 nm. The multilayer mirror has alternating layers selected from the group consisting of: Cr and Sc layers, Cr and C layers, C and B4C layers, U and B4C layers, Th and B4C layers, C and B9C layers, La and B9C layers U and B9C layers, Th and B9C layers, La and B layers, C and B layers, U and B layers, and Th and B layers.
Abstract:
A collector optical system for extreme ultraviolet (EUV) or X-ray applications, including lithography and imaging, for example at 13 5 nm, comprising a grazing incidence collector in combination with a laser produced plasma (LPP) source In one embodiment, one or more further optical elements act upon one or more laser beams used to generate the EUV or X-ray plasma source, whereby said laser beam(s) ιmpact(s) on the fuel target from a side thereof on which an intermediate focus is disposed Also disclosed is a collector for EUV and X-ray applications, in which radiation from a laser produced plasma source is reflected by the collector to an intermediate focus, the line joining the source and intermediate focus defining an optical axis, a first direction on the optical axis being defined from the source to the intermediate focus, characterised by the collector comprising one or more grazing incidence mirrors, and by the collector comprising one or more further optical elements for redirecting a received laser beam so as to be incident upon the source (a) in a second direction, opposite to said first direction, or (b) at an acute angle to said second direction The further optical elements may comprise plane or spherical mirrors and/or lenses, for example disposed on the optical axis Also disclosed is a collector for application at about 13 5 nm with Laser Produced Plasma sources, the collector comprising between 5 and 16 concentrically aligned mirrors, and preferably between 6 and 12 mirrors, that operate at grazing incidence such that the maximum grazing angle between the incident radiation and the reflective surface of the mirrors is about 30°, and more preferably about 25°, in order to allow a maximum collection angle from the source of about 40° to about 85°, and preferably about 45° to about 75° Also disclosed is an EUV lithography system comprising a radiation source, for example a LPP source, the collector, an optical condenser, and a reflective mask
Abstract:
The subject of the invention is a procedure for manufacturing a neutron-guiding flat surface of low waviness in the course of which a thin plate coated by a material suitable for neutron reflection, advantageously of multilayered structure, is glued onto a significantly thicker carrier surface. The procedure is characterised by placing the thin neutron-reflecting plate onto a base surface of low flatness, typically of the order of magnitude of 10 -5 radian, advantageously onto a vacuum table, so that the thin plate lies on the base surface with the neutron-reflecting coating facing the base surface, then the thin plate is positioned on the base surface by means of applying reclining contact points formed along the base edge determined by the size of the thin plate, the thin plate is fixed onto the base surface by means of vacuum suction, then the reclining contacts are removed and a glue is attached to the upper surface of the fixed thin plate which displays low absorption capacity to neutrons and retains its binding strength in the presence of incident neutrons, then the thick carrier plate is stuck to the upper surface of the thin plate by moving the thick plate back and forth thus providing the homogeneous dispersion of the glue, then the thick carrier plate is fixed onto the base surface by reclining points and the binding process of the glue is accelerated by a known and appropriately selected procedure of binding acceleration, then finally the glued plates are removed from the base surface by undoing the reclining points.
Abstract:
An X-ray lens assembly, a device including the X-ray lens assembly and a method of manufacturing the X-ray lens assembly are described. The X-ray assembly comprises a tube member (50) including an inlet opening (90) for X-rays and an outlet opening (94) for X-rays. Additionally, the assembly comprises a capillary X-ray lens (28) mounted inside the tube member (50). The X-ray lens (28) may be mounted inside the tube member (50) by a stabilizing agent and/or by one or more separate mounting structures (96A, 96B).
Abstract:
A light scattering EUVL mask and a method of forming the same comprises depositing (300) a crystalline silicon layer (110) over an ultra low expansion substrate (100), depositing a hardmask over the crystalline silicon layer (310), patterning the hardmask (340); etching the crystalline silicon layer (350), removing the hardmask (360), and depositing a Mo/Si layer over the crystalline silicon layer (360), wherein etched regions of the crystalline silicon layer comprise uneven surfaces in the etched regions. The method further comprises depositing a photoresist mask (320) over the hardmask, creating a pattern in the photoresist mask (330), and transferring the pattern to the hardmask (340). The Mo/Si layer (160) comprises uneven surfaces conformal with the sloped surfaces off the crystalline silicon layer (110), wherein the sloped surfaces of the Mo/Si layer may be configured as roughened, jagged, sloped, or curved surfaces, wherein the uneven surfaces deflect incoming extreme ultraviolet radiation waves to avoid collection by exposure optics and prevent printing onto a semiconductor wafer.
Abstract:
A light scattering EUVL mask and a method of forming the same comprises depositing (300) a crystalline silicon layer (110) over an ultra low expansion substrate (100), depositing a hardmask over the crystalline silicon layer (310), patterning the hardmask (340); etching the crystalline silicon layer (350), removing the hardmask (360), and depositing a Mo/Si layer over the crystalline silicon layer (360), wherein etched regions of the crystalline silicon layer comprise uneven surfaces in the etched regions. The method further comprises depositing a photoresist mask (320) over the hardmask, creating a pattern in the photoresist mask (330), and transferring the pattern to the hardmask (340). The Mo/Si layer (160) comprises uneven surfaces conformal with the sloped surfaces off the crystalline silicon layer (110), wherein the sloped surfaces of the Mo/Si layer may be configured as roughened, jagged, sloped, or curved surfaces, wherein the uneven surfaces deflect incoming extreme ultraviolet radiation waves to avoid collection by exposure optics and prevent printing onto a semiconductor wafer.
Abstract:
An apparatus and method for EUV light production is disclosed which may comprise a laser produced plasma ("LPP") extreme ultraviolet ("EUV") light source control system comprising a target delivery system adapted to deliver moving plasma initiation targets and an EUV light collection optic having a focus defining a desired plasma initiation site, comprising: a target tracking and feedback system comprising: at least one imaging device providing as an output an image of a target stream track, wherein the target stream track results from the imaging speed of the camera being too slow to image individual plasma formation targets forming the target stream imaged as the target stream track; a stream track error detector detecting an error in the position of the target stream track in at least one axis generally perpendicular to the target stream track from a desired stream track intersecting the desired plasma initiation site. At least one target crossing detector may be aimed at the target track and detecting the passage of a plasma formation target through a selected point in the target track. A drive laser triggering mechanism utilizing an output of the target crossing detector to determine the timing of a drive laser trigger in order for a drive laser output pulse to intersect the plasma initiation target at a selected plasma initiation site along the target track at generally its closest approach to the desired plasma initiation site. A plasma initiation detector may be aimed at the target track and detecting the location along the target track of a plasma initiation site for a respective target. An intermediate focus illuminator may illuminate an aperture formed at the intermediate focus to image the aperture in the at least one imaging device. The at least one imaging device may be at least two imaging devices each providing an error signal related to the separation of the target track from the vertical centerline axis of the image of the intermediate focus based upon an analysis of the image in the respective one of the at least two imaging devices. A target delivery feedback and control system may comprise a target delivery unit; a target delivery displacement control mechanism displacing the target delivery mechanism at least in an axis corresponding to a first displacement error signal derived from the analysis of the image in the first imaging device and at least in an axis corresponding to a second displacement error signal derived from the analysis of the image in the second imaging device.
Abstract:
A process for the production of optical broad band elements for the ultra violet to hard x-ray wavelength range, especially the extreme ultra violet wavelength range is described. A set from series of layers made of at least two materials in relation to the layer sequence is designed and numerical optimization of the the layer thicknesses and of the cap layer thickness is performed. The materials are chosen in such a way that two successive layers interact with each other as little as possible or controllably. The set can be formed from Mo2C- and Sidayers. The numerical optimization takes into account interlayers of a certain thickness and composition.