公开(公告)号：US20060168803A1

公开(公告)日：2006-08-03

申请号：US11392532

申请日：2006-03-30

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: H05K3/36

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0218 ,  H05K2201/068 ,  H05K2203/0425 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup layer, wherein the junction layer includes an adhesive and metallic particles contained in the adhesive, wherein each of the metallic particles has a first melting point, serves as a filler, and is plated with solder having a second melting point lower than the first melting point.

Abstract translation: 分层板包括用作印刷电路板的芯层，与芯层电连接的积层，积层层包括绝缘部分和布线部分，以及将芯层电连接和结合的接合层 其中所述接合层包括粘合剂和包含在所述粘合剂中的金属颗粒，其中所述金属颗粒具有第一熔点，用作填料，并且镀有第二熔点低于所述粘合剂的焊料 第一熔点

公开(公告)号：US20050230667A1

公开(公告)日：2005-10-20

申请号：US11073099

申请日：2005-03-03

Applicant: Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

Inventor： Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32 ,  H01B1/00

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5:22.5 to 0:100; and a circuit connected by using the conductive adhesive.

Abstract translation: 本发明提供一种导电性粘合剂，其包含导电性粒子和树脂，其中导电性粒子的30重量％以上基本上含有银和锡，并且导电性粘合剂的金属成分中的银和锡的摩尔比在该范围内 为77.5:22.5至0：100; 以及通过使用导电粘合剂连接的电路。

公开(公告)号：US06924971B2

公开(公告)日：2005-08-02

申请号：US10212750

申请日：2002-08-07

Applicant: Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

Inventor： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC: H05K3/46 ,  H01B3/00 ,  H01B3/30 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H01L23/66 ,  H05K1/16 ,  H01G4/06

CPC classification number: H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

Abstract: A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

Abstract translation: 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US20050100743A1

公开(公告)日：2005-05-12

申请号：US10702280

申请日：2003-11-06

Applicant: Gareth Hougham ,  Xiao Liu ,  S. Chey ,  James Doyle ,  Joseph Zinter ,  Michael Rooks ,  Brian Sundlof ,  Jon Casey

Inventor： Gareth Hougham ,  Xiao Liu ,  S. Chey ,  James Doyle ,  Joseph Zinter ,  Michael Rooks ,  Brian Sundlof ,  Jon Casey

IPC: B32B15/08 ,  B32B27/00 ,  H01R13/24 ,  H01R43/00 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

Abstract translation: 负系数的热膨胀粒子包括具有第一双层内层和第一双层外层的第一双层和具有第二双层内层和第二双层外层的第二双层。 第一和第二双层分别沿着第一和第二双层外层以及第一和第二双层内层的周边连接在一起。 第一双层内层和第二双层内层由第一材料制成，第一双层外层和第二双层外层由第二材料制成。 第一种材料具有比第二种材料更大的热膨胀系数。

公开(公告)号：US20040161906A1

公开(公告)日：2004-08-19

申请号：US10779824

申请日：2004-02-17

Inventor： S. Kumar Khanna

IPC: H01L021/76 ,  H01L021/30 ,  H01L021/46

CPC classification number: H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/8322 ,  H01L2224/83222 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10727 ,  H05K2203/104 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Conductive material or particles of an anisotropic conductive compound or material sandwiched between at least two aligned conductive contacts are vibrated mechanically, magnetically, or both mechanically and magnetically while the anisotropic conductive compound is curing. The conductive material is subjected to a static, substantially homogeneous DC magnetic field (i) before, (ii) following or (iii) at least partially during the time the conductive material is being vibrated.

Abstract translation: 夹杂在至少两个对准的导电接触件之间的各向异性导电化合物或材料的导电材料或颗粒在各向异性导电化合物固化期间机械地，磁性地或机械地和磁性地振动。 导电材料在导电材料振动之前至少部分地经受静电的，基本上均匀的直流磁场（i），（ii）之后或（iii））。

公开(公告)号：US20040016505A1

公开(公告)日：2004-01-29

申请号：US10205515

申请日：2002-07-25

Applicant: Shiva Consulting, Inc.

Inventor： S. Kumar Khanna

IPC: B32B031/16

CPC classification number: H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/83192 ,  H01L2224/83222 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10727 ,  H05K2203/104 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An anisotropic conductive compound is cured by exposing it to heat while in the presence of an AC magnetic field followed by a static, substantially homogeneous DC magnetic field.

Abstract translation: 各向异性导电化合物通过将其暴露于热而固化，同时在存在AC磁场，然后是静态的，基本上均匀的DC磁场的情况下。

公开(公告)号：US20030059642A1

公开(公告)日：2003-03-27

申请号：US09963605

申请日：2001-09-27

Inventor： Zequn Mei

IPC: B32B015/02 ,  B05D007/00 ,  B05D001/18 ,  C23C018/00

CPC classification number: C23C18/31 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/282 ,  B23K35/36 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0435 ,  Y10T428/12181

Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.

Abstract translation: 焊剂组合物，焊膏及其制造方法，其具有通过浸涂法或无电镀工艺涂覆有涂料的焊料材料。 焊料组合物和焊膏基本上是无铅的，并具有接近传统锡铅焊料的熔化温度。

公开(公告)号：US20030038375A1

公开(公告)日：2003-02-27

申请号：US10047681

申请日：2002-01-14

Inventor： Kuan-Sheng Hsieh

IPC: H01L023/48

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/293 ,  H01L2224/29344 ,  H01L2224/29399 ,  H01L2224/29411 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/323 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A bonded anisotropic conductive film fabricated using a plastic material and a plurality of conductive particles inside the plastic material. The plastic material is a thermal set material hardening after being raised to a first temperature. Each conductive particle inside the plastic material includes a conductive bead, a bonding layer and a flux layer. The bonding layer is formed over the conductive bead enclosing the conductive bead entirely. The flux layer is formed over the bonding layer. The bonding layer has a melting point at a second temperature where the second temperature is higher than the first temperature.

Abstract translation: 使用塑料材料制成的粘结各向异性导电膜和塑料材料内的多个导电颗粒。 塑料材料是升温至第一温度后的热固化材料硬化。 塑料材料内的每个导电颗粒包括导电珠，粘结层和助焊剂层。 结合层形成在封闭导电珠的导电珠上。 焊剂层形成在结合层上。 接合层的第二温度在第二温度下的熔点高于第一温度。

公开(公告)号：US06461890B1

公开(公告)日：2002-10-08

申请号：US09383640

申请日：1999-08-26

Applicant: Kazutaka Shibata

Inventor： Kazutaka Shibata

IPC: H01L2150

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29344 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: A structure and a method which can reliably electrically connect opposed terminals with each other are disclosed. First and second terminals are opposed to each other, so that an anisotropic conductive film is interposed therebetween. Ultrasonic vibration is supplied between the terminals while applying pressure so that the first and second terminals approach to each other. The first and second terminals are electrically connected with each other through conductive grains contained in the anisotropic conductive film. The conductive grains and the terminals are alloy-bonded with each other.

Abstract translation: 公开了能够可靠地电连接相对端子的结构和方法。 第一和第二端子彼此相对，从而插入各向异性导电膜。 在施加压力的同时，在端子之间提供超声波振动，使得第一和第二端子彼此接近。 第一和第二端子通过包含在各向异性导电膜中的导电晶粒彼此电连接。 导电晶粒和端子彼此合金结合。

公开(公告)号：US06423172B1

公开(公告)日：2002-07-23

申请号：US09582628

申请日：2000-07-07

Applicant: Ciaran McArdle ,  Rory B. Barnes

Inventor： Ciaran McArdle ,  Rory B. Barnes

IPC: B32B3200

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract translation: 本发明提供了涂覆非随机和有序排列阵列的各种相互关联的方法，以及包含这种阵列的膜。 本发明还涉及由其制备的涂覆的非随机和有序排列的颗粒和膜。 通过使用可固化的铁磁流体组合物获得涂布的非随机和有序阵列。 阵列和膜可以包含可用于电子应用中的导电颗粒，用于实现导体之间的接触。