公开(公告)号：US12114437B2

公开(公告)日：2024-10-08

申请号：US17926710

申请日：2021-06-23

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Masaya Toba ,  Kazuyuki Mitsukura

IPC: H05K3/38 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46

CPC classification number: H05K3/381 ,  H01L21/486 ,  H01L23/49838 ,  H05K1/09 ,  H05K3/18 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2203/0723

Abstract: Disclosed is a method for manufacturing a wiring structure including a step of forming a wiring on an insulating resin layer. The step of forming the wiring includes: forming a modified region including pores in a surface layer of the insulating resin layer by treating a surface of the insulating resin layer with a treatment method including surface modification; forming a seed layer on the surface of the insulating resin layer by sputtering; and forming the wiring on the seed layer by electrolytic copper plating.

公开(公告)号：US20240188215A1

公开(公告)日：2024-06-06

申请号：US18314099

申请日：2023-05-08

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： LI-CHUN HUNG

IPC: H05K1/11 ,  H01L23/00

CPC classification number: H05K1/113 ,  H01L24/48 ,  H01L2224/48228 ,  H01L2224/48453 ,  H01L2224/48464 ,  H01L2924/37001 ,  H01L2924/386 ,  H05K2201/032 ,  H05K2201/09745

Abstract: A circuit substrate having an improved bonding structure includes a substrate core layer, an upper protective layer, and at least one bond finger portion. The substrate core layer has a top surface and a bottom surface. The upper protective layer is formed on the top surface of the substrate core layer. The upper protective layer has at least one channel. The at least one bond finger portion is formed on the top surface of the substrate core layer, and is disposed in the at least one channel. A plurality of protrusions are formed on an upper surface of the at least one bond finger portion, so as to increase a bonding area with a bonding wire.

公开(公告)号：US20240117518A1

公开(公告)日：2024-04-11

申请号：US18267130

申请日：2021-12-07

Applicant: Linxens Holding

Inventor： Jerome SANSON ,  Stephanie COQUILLARD

IPC: C25D5/12 ,  C25D3/56 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28

CPC classification number: C25D5/12 ,  C25D3/56 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K2201/032

Abstract: Disclosed is a method for depositing a bronze alloy on a printed circuit. Said method includes an operation of electrolytically depositing at least one layer of bronze on a copper sheet. The bronze layer includes, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit obtained by this method.

公开(公告)号：US11903133B2

公开(公告)日：2024-02-13

申请号：US17955683

申请日：2022-09-29

Applicant: Zhuhai ACCESS Semiconductor Co., Ltd

Inventor： Xianming Chen ,  Lei Feng ,  Gao Huang ,  Benxia Huang ,  Yejie Hong

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/186 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/0035 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/032 ,  H05K2201/09509 ,  H05K2203/061 ,  H05K2203/308

Abstract: A method for manufacturing a structure for embedding and packaging multiple devices by layer includes preparing a polymer supporting frame, mounting a first device in a first device placement mouth frame to form a first packaging layer, forming a first circuit layer and a second circuit layer, forming a second conductive copper pillar layer and a second sacrificial copper pillar layer, forming a second insulating layer on the first circuit layer, and forming a third insulating layer on the second circuit layer, forming a second device placement mouth frame vertically overlapped with the first device placement mouth frame, mounting a second device and a third device in the second device placement mouth frame to form a second packaging layer, forming a third circuit layer on the second insulating layer. A terminal of the second device and a terminal of the third device are respectively communicated with the third circuit layer.

公开(公告)号：US20180153034A1

公开(公告)日：2018-05-31

申请号：US15864301

申请日：2018-01-08

Applicant: Toppan Forms Co., Ltd.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  H05K1/02 ,  G06F3/044 ,  G06F3/041 ,  H05K3/12

CPC classification number: H05K1/092 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0225 ,  H05K1/0274 ,  H05K3/1275 ,  H05K2201/032 ,  H05K2201/09681 ,  H05K2201/098

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

公开(公告)号：US09937555B2

公开(公告)日：2018-04-10

申请号：US14650161

申请日：2013-10-02

Applicant: SUMITOMO METAL MINING CO., LTD.

Inventor： Yuji Kawakami ,  Akihiro Murakami ,  Toshiaki Terao ,  Isao Kaneko

IPC: B22F1/00 ,  C22C5/06 ,  H01B5/00 ,  H05K1/09 ,  H01B1/02 ,  H01B1/22 ,  B22F9/24

CPC classification number: B22F1/0003 ,  B22F1/0011 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/10 ,  C22C5/06 ,  H01B1/02 ,  H01B1/22 ,  H01B5/00 ,  H05K1/09 ,  H05K1/092 ,  H05K2201/02 ,  H05K2201/032 ,  B22F1/0085 ,  B22F9/04

Abstract: The present invention provides a silver powder that has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents flake occurrence. The silver powder has a dibutyl phthalate absorption amount, measured by a method of JIS-K6217-4, of 7.0 to 9.5 ml/100 g, and has an oil absorption profile at the time of measurement of the absorption amount, having two peaks, or one peak having a half width of not more than 1.5 ml/100 g.

公开(公告)号：US09872390B1

公开(公告)日：2018-01-16

申请号：US15239645

申请日：2016-08-17

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey ,  Andrew L. Fassler

IPC: H05K1/09 ,  H05K1/03 ,  H01R4/58 ,  H05K1/14 ,  H05K1/02 ,  H05K3/10 ,  H05K3/28

CPC classification number: H05K1/14 ,  H01L21/486 ,  H01L23/49872 ,  H01L23/5387 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/28 ,  H05K2201/032 ,  H05K2201/0391 ,  H05K2201/10977 ,  H05K2203/1305

Abstract: One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.

公开(公告)号：US09867288B2

公开(公告)日：2018-01-09

申请号：US14386637

申请日：2013-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Seol Hee Lim

IPC: H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  C25D3/14 ,  C25D3/16 ,  C25D5/02 ,  C25D5/12

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

公开(公告)号：US09674949B1

公开(公告)日：2017-06-06

申请号：US14266700

申请日：2014-04-30

Applicant: FLEXTRONICS AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0283 ,  H05K1/028 ,  H05K1/09 ,  H05K1/11 ,  H05K1/118 ,  H05K1/145 ,  H05K2201/0137 ,  H05K2201/0162 ,  H05K2201/032 ,  H05K2201/05 ,  H05K2201/10287

Abstract: A stretchable wire assembly includes a metal wire coupled between two elastic substrates. The two elastic substrates are selectively coupled together, and the metal wire is attached to one or both elastic substrates at select locations. The form of the metal wire is such that when the elastic substrates are in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the coupled elastic substrates. The tortuous path of the metal wire provides slack such that as the elastic substrates are stretched the slack is taken up. Once released, the elastic substrates move from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path.

公开(公告)号：US20170118836A1

公开(公告)日：2017-04-27

申请号：US15301341

申请日：2015-04-01

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC: H05K1/09 ,  C09D11/037 ,  H01B1/22 ,  B22F1/00 ,  H05K3/22 ,  H05K3/02 ,  B22F1/02 ,  C09D11/52 ,  H05K3/12

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent