公开(公告)号：US5448021A

公开(公告)日：1995-09-05

申请号：US234877

申请日：1994-04-28

Applicant: Keiji Arai

Inventor： Keiji Arai

IPC: H05K3/24 ,  C23C18/32 ,  H05K1/09 ,  H05K3/26 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/429 ,  H05K3/4641 ,  H05K1/09 ,  H05K2201/0344 ,  H05K3/422 ,  H05K3/427

Abstract: An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

Abstract translation: 使用化学镀镍作为电镀铜的底漆。 优选地，在强酸性条件（pH：1以下）下，用镍盐对铝的表面进行镍取代之后进行无电镀镍。 更优选地，在铝的表面上的氧化物膜被去除之后进行镍取代。

公开(公告)号：US5322976A

公开(公告)日：1994-06-21

申请号：US793611

申请日：1991-11-18

Applicant: Philip D. Knudsen ,  Daniel P. Walsh

Inventor： Philip D. Knudsen ,  Daniel P. Walsh

IPC: C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38 ,  H05K1/00

CPC classification number: C23C18/22 ,  C25D5/56 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10S205/917 ,  Y10S205/92 ,  Y10S205/926

Abstract: Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

Abstract translation: 通过用含二醇的蚀刻剂蚀刻聚醚酰亚胺网的表面，然后通过无电镍或钴沉积，然后通过铜沉积来形成聚醚酰亚胺 - 金属层压体。 可以使用含二醇的蚀刻剂来形成穿过网的通孔。

公开(公告)号：US5066545A

公开(公告)日：1991-11-19

申请号：US464230

申请日：1990-01-12

Applicant: Daniel R. Walsh

Inventor： Daniel R. Walsh

IPC: C23C18/22 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38 ,  B32B15/08

CPC classification number: C23C18/22 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

Abstract translation: 通过用含二醇的蚀刻剂蚀刻聚酰亚胺网的表面，然后通过无电镀镍或钴沉积，然后通过铜沉积来形成聚酰亚胺金属层压体。 可以使用含二醇的蚀刻剂来形成穿过网的通孔。

公开(公告)号：US4913768A

公开(公告)日：1990-04-03

申请号：US293261

申请日：1989-01-04

Applicant: Gerhard D. Wolf ,  Kirkor Sirinyan ,  Ulrich von Gizycki ,  Rudolf Merten ,  Friedrich Langer

Inventor： Gerhard D. Wolf ,  Kirkor Sirinyan ,  Ulrich von Gizycki ,  Rudolf Merten ,  Friedrich Langer

IPC: H05K3/24 ,  C23C2/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC classification number: C23C2/02 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1152 ,  Y10T29/49165

Abstract: Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.

Abstract translation: 如果需要增敏的情况下，如果需要增敏的情况下，如果用铜箔包覆的基片具有化学或机械去除的所述包层被激活，并且设置有0.05-2.0μm厚的层，则获得具有良好粘附的导体轨迹的导体板 的镍，钴，锰，镍/铁或镍/钴混合物，在随后的铜浴中加入0.5-5.0μm厚的铜层，然后将导体图案由标准半 加法方法。

公开(公告)号：US4512829A

公开(公告)日：1985-04-23

申请号：US597315

申请日：1984-04-06

Applicant: Hideo Ohta ,  Tatuzo Hakuzen ,  Yasunori Ito ,  Fusao Takagi

Inventor： Hideo Ohta ,  Tatuzo Hakuzen ,  Yasunori Ito ,  Fusao Takagi

IPC: H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  B05D5/12 ,  B44C1/22 ,  C03C15/00 ,  C23F1/02

CPC classification number: H05K3/243 ,  H05K3/427 ,  H05K2201/0344 ,  H05K2201/09736 ,  H05K2203/025 ,  H05K2203/0571 ,  H05K3/187 ,  H05K3/28 ,  Y10T29/49165

Abstract: This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.

Abstract translation: 本发明提供了一种制造印刷电路板的方法，其特征在于以下步骤：在覆铜层压板上钻孔，用催化剂处理包括孔限定内表面的层压体的整个表面，从催化剂表面去除催化剂 通过机械地清洗铜箔的表面，将无电镍仅沉积在孔限定的内表面上，用抗蚀剂形成图案，除去除了图案区域之外的铜箔，除去抗蚀剂 用阻焊剂掩模除了在孔限定的内表面和焊盘之外的整个表面，并且对孔限定的内表面和焊盘进行化学镀铜。

公开(公告)号：US3984290A

公开(公告)日：1976-10-05

申请号：US564354

申请日：1975-04-02

Applicant: Georgy Avenirovich Kitaev ,  Vadim Alexandrovich Ploskikh ,  Viktor Alexeevich Minkov ,  Kurbakov, Viktor Georgievich ,  Evangelina Mikhailovna Chernysheva ,  Tatyana Nikolaevna Zlatkovskaya ,  Viktor Timofeevich Brunov

Inventor： Georgy Avenirovich Kitaev ,  Vadim Alexandrovich Ploskikh ,  Viktor Alexeevich Minkov ,  Kurbakov, Viktor Georgievich ,  Evangelina Mikhailovna Chernysheva ,  Tatyana Nikolaevna Zlatkovskaya ,  Viktor Timofeevich Brunov

IPC: C25D5/54 ,  H05K3/38 ,  H05K3/42 ,  C25D5/34 ,  C25D7/00

CPC classification number: C25D5/54 ,  C23C18/54 ,  H05K3/424 ,  H05K3/429 ,  H05K2201/0344 ,  H05K2203/0716 ,  H05K2203/073 ,  H05K2203/173 ,  H05K3/383 ,  H05K3/427 ,  Y10S205/92

Abstract: A method of forming intralayer junctions in a multilayer structure comprising alternating metal and dielectric layers comprising forming an auxiliary electrically conductive film on the surface of the dielectric layers to be metal plated by the method of electrolytical deposition of a metal film. The auxiliary film is formed by immersing the multilayer structure into a solution containing ions of a metal, which is more electropositive than the metal of the metal layers. The structure is allowed to stay in this solution until the formation of a continuous electrically conductive film of the metal, whose ions are contained in the solution, over the entire surface to be metal plated. The film has a monolithic structure in the dielectric zones of this surface and a porous structure in the metal zones. Then the structure is treated with a solution selectively reacting with the metal of the metal layers or with the metal of the metal layers and with the porous zones of the continuous electrically conductive film so as to remove from the metal layers the zones of the continuous electrically conductive film having a porous structure.In another embodiment of this method the auxiliary film is formed by immersing the multilayer structure into a solution containing soluble complex salts, metal salts, pH-controlling additives and chalcogenizers. The structure is allowed to stay in this solution until the formation of a continuous electrically conductive film of metal chalcogenides over the entire surface to be metal plated. Then the structure is treated with a solution selectively reacting with the metal of the metal layers or with the metal of the metal layers and with the zones of the film of metal chalcogenides disposed on the end faces of the metal layers so as to remove these zones.

Abstract translation: 一种在多层结构中形成层间结的方法，包括交替的金属和电介质层，包括通过电解沉积金属膜的方法在待镀金属的电介质层的表面上形成辅助导电膜。 辅助膜通过将多层结构浸入含金属离子的溶液中而形成，金属离子比金属层的金属更具有正电性。 允许该结构停留在该溶液中，直到在待镀金属的整个表面上形成其中离子被包含在溶液中的金属的连续导电膜。 该膜在该表面的电介质区域中具有整体结构，并且在金属区域中具有多孔结构。 然后用选择性地与金属层的金属或与金属层的金属以及连续导电膜的多孔区域反应的溶液处理该结构，以便从金属层移除连续电气的区域 具有多孔结构的导电膜。

公开(公告)号：US3959523A

公开(公告)日：1976-05-25

申请号：US424896

申请日：1973-12-14

Applicant: John J. Grunwald ,  Peter E. Kukanskis ,  Elaine F. Jacovich ,  Eugene D. D'Ottavio

Inventor： John J. Grunwald ,  Peter E. Kukanskis ,  Elaine F. Jacovich ,  Eugene D. D'Ottavio

IPC: C23C18/16 ,  H05K3/18 ,  C23C3/02 ,  B05D5/12

CPC classification number: H05K3/187 ,  C23C18/1605 ,  C23C18/1651 ,  H05K3/184 ,  H05K2201/0344

Abstract: Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.

Abstract translation: 制造电子设备的电路板，其中电路形成导体金属通过全部添加剂无电沉积技术沉积在适当催化和掩蔽的树脂基板上，其中特征特征是使用两级金属沉积 建立所需的金属总厚度。 在第一阶段，在基材上产生细小的金属沉积物，然后水洗，并将其浸入具有足够高沉积速率的第二金属浴中，以在商业实用的时间段内产生所需的金属总厚度 时间。 在热冲击之前和之后，电镀金属对树脂基材的附着力都得到提高，通过这种两阶段电镀工艺来实现。

公开(公告)号：US3916056A

公开(公告)日：1975-10-28

申请号：US31933972

申请日：1972-12-29

Applicant: RCA CORP

Inventor： FELDSTEIN NATHAN

IPC: H05K3/00 ,  C23F1/00 ,  G03F1/54 ,  G03F1/68 ,  H01L21/027 ,  H05K1/03 ,  H05K3/10 ,  B44F1/00

CPC classification number: G03F1/54 ,  G03F1/50 ,  H05K1/0306 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2203/0315 ,  H05K2203/1142 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A thin layer of nickel or a nickel alloy, having a thickness such that it transmits about 30-40% of the visible and ultraviolet light, is deposited on an insulating substrate. A pattern of opaque metal areas is deposited on the thin layer of metal and the thin metal layer is heat-treated in air for a time and at a temperature sufficient to make the thin layer sufficiently transparent, adherent, and durable for the intended purpose.

Abstract translation: 1452116光掩模RCA公司1973年12月18日[1972年12月29日] 58555/73标题G2X [也在C7部分]通过蒸汽或无电沉积或通过溅射在玻璃或塑料基板上沉积Ni或Ni合金层而形成光掩模， 施加光刻胶的图案，无电沉积Ni，Co或Cu层，然后在空气中加热形成Ni氧化物，并使第一层对可见光或紫外光透明至少70％。

公开(公告)号：US3878007A

公开(公告)日：1975-04-15

申请号：US36754173

申请日：1973-06-06

Applicant: RCA CORP

Inventor： FELDSTEIN NATHAN ,  LAW HAROLD BELL

IPC: C23C18/16 ,  G03F1/72 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/22 ,  B29C17/08

CPC classification number: G03F1/72 ,  C23C18/1608 ,  C23C18/1689 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/225 ,  H05K2201/0344 ,  H05K2203/0542 ,  H05K2203/072

Abstract: The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal a pattern of areas of a second metal which has a relatively low degree of solubility in the etchant, and then treating the plated areas with the etchant, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.

Abstract translation: 该方法包括在衬底上的特定蚀刻剂中沉积具有较高溶解度的第一金属薄层，该第一金属被催化以无序沉积待随后沉积的第二金属，无电沉积在第一金属a上 在蚀刻剂中具有相对低的溶解度的第二金属的区域图案，然后用蚀刻剂处理镀覆区域，使得第一金属在不被第二金属覆盖的地方被除去，但第二金属是 基本上不受影响。

公开(公告)号：US3745095A

公开(公告)日：1973-07-10

申请号：US3745095D

申请日：1971-01-26

Applicant: INT ELECTRONIC RES CORP

Inventor： CHADWICK D ,  MUELLER W ,  APODACA R

IPC: H05K1/05 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  C23B5/48

CPC classification number: H05K3/24 ,  H05K1/056 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/0209 ,  H05K2201/0344 ,  H05K2203/025 ,  H05K2203/1105

Abstract: The invention is a method for making a metal core printed circuit board which includes applying multiple layers of synthetic plastic resin material to a sheet of metal, then treating the surface of the plastic material in such a way as to provide an acceptable bond, followed by applying sundry layers of different metals, first to the plastic surface and then one upon another followed by the imposition of a circuit pattern, the removal of materials from areas intermediate the circuit pattern, and the application of an appropriate overlay of unlike metal to the circuit pattern, thereby to provide a finished circuit board.

Abstract translation: 本发明是一种用于制造金属芯印刷电路板的方法，其包括将多层合成塑料树脂材料施加到金属片上，然后以提供可接受的粘合剂的方式处理塑料材料的表面，接着是 应用各种不同金属层，首先到塑料表面，然后一个接一个地接着施加电路图案，从电路图案之间的区域去除材料，以及将不同于金属的合适覆盖层施加到电路 图案，从而提供成品电路板。