Abstract:
Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.
Abstract:
A flexible flat cable connecting structure and a flexible flat cable connecting method are provided so that a connector can be connected by pitch conversion without complicating the structure of the connector and metal molds for forming mold parts become unnecessary. A flexible flat cable connecting structure for connecting a flexible flat cable (13) in which a plurality of rectangular conductors (11) are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member (17) one end of which is coupled to the connector terminals and in which a plurality of branch conductors (19) are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member (17) is laid on the flexible flat cable (13) so that the intermediate cable arranging member (17) and the flexible flat cable (13) are in the same plane and form an angle. The other ends (21) of the branch conductors (19) of the intermediate cable arranging member (17) are connected to the respective rectangular conductors (11).
Abstract:
A method for reducing the fitting thrust of golden finger (101,103) and a PCB (100). The method and the PCB (100) solve the problem of excessive inserting force of the golden finger (101,103) of the prior art, through modifying the shape of the edge of the PCB (100), the edge of the PCB open reeds of a connector (201, 203) at different time. The PCB (100) has at least one concave edge section or at least one convex edge section or at least one tilt edge section, and the edge can further be beveled. The bonding pads of the golden finger can be assorted, pin ends of a part of golden fingers (101, 103) can be partially removed or these golden fingers can be completely removed, the pin ends of a part of golden fingers (101,103) can be preserved. Through the method, the purpose of reducing the fitting thrust upon inserting the PCB (100) into the connector can be achieved.
Abstract:
Die Erfindung bezieht sich auf eine Vorrichtung zum Trennen und Besäumen von Leiterplatten, insbes. mehrlagigen Leiterplatten (Multilayers), unterschiedlichen Formats mit hoher Maßgenauigkeit und Geschwindigkeit bei geringer Belastung der Leiterplatte, wobei das Trennen bzw. Besäumen in einem Arbeitsgang mit der Profilierung der Kanten erfolgt. Dies geschieht durch zwei in einer Ebene einander gegenüberliegend angeordnete Kreissägeblätter, vorzugsweise mit Diamantschneiden, deren Sägezähne ineinander kämmend beidseits in die Leiterplatte eintauchen - ohne, daß eines der Kreissägeblätter allein die Leiterplatte durchtrennt - zum gratfreien Trennen bzw. Besäumen der Leiterplatten bei gleichzeitiger Profilierung entsprechend den Sägezahn-Randprofilen.
Abstract:
A credit card type small thin rectangular IC card (10) includes a battery (14) and an IC comprising a CPU (15), a ROM (15ʺ) and a RAM (15ʹ) mounted on a flexible printed circuit (11) and bonded within an insulative plastic material (12). The printed circuit of the card includes a plurality of electrode terminals (13) exposed in a parallel array along at least one edge of the card which are adapted to engage electrodes of a mating contact. The printed circuit terminals are manufactured by coating copper, nickel and gold over polyamide resin and squeeze finishing the leading edge. The mating socket comprises a generally U-shaped frame having a U-shaped channel adapted to receive the IC card and having internal recessed contacts adapted to engage the terminals of the IC card. The contacts extend from an exterior surface of the frame for interconnection with the circuits of the mating device. Downwardly projecting portions thereof are bent at least twice in the portion penetrating the bottom of the frame.
Abstract:
A bevelling machine for printed circuit boards having a board transport assembly (45) for passing a board between two grinding wheels (11) each mounted independently on a slide (7, 8) moved by an actuator (13) so that the wheels (11) overlap along the path of travel of a board to bevel two edges thereof at the same time. The position of at least one side of a board relative to the centre line of travel is sensed and the slide (7,8) mounting the grinding wheel which produces a bevel on the sensed side is moved to a position determined by the position of the sensing means so that the depth of cut on each side of the board is substantially the same for different thicknesses of board.