公开(公告)号：US5560537A

公开(公告)日：1996-10-01

申请号：US420553

申请日：1995-04-11

Applicant: Steven P. Sadler ,  Patrizio Vinciarelli

Inventor： Steven P. Sadler ,  Patrizio Vinciarelli

IPC: B23K3/00 ,  B23K1/00 ,  B23K1/20 ,  B23K37/00 ,  H05K3/34

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/203 ,  B23K2201/42

Abstract: The automatic soldering of printed circuit boards wherein different boards can be simultaneously processed at different stations, e.g. a fluxing station, a preheating station and a soldering station. An identification station in advance of the fluxing station controls various parameters at the processing stations in response to board type as the boards are indexed through the various stations. Parameters such as location of application, time of application, pump speed etc. may be controlled in response to board type.

Abstract translation: 印刷电路板的自动焊接，其中不同的电路板可以在不同的电台，例如， 熔化站，预热站和焊接站。 在焊接站之前的识别站响应于板类型控制处理站处的各种参数，因为板通过各个站索引。 可以根据电路板类型来控制诸如应用位置，应用时间，泵速等参数。

公开(公告)号：US5542595A

公开(公告)日：1996-08-06

申请号：US356810

申请日：1994-12-15

Applicant: David E. Gibson

Inventor： David E. Gibson

IPC: B23K3/00 ,  B23K1/08 ,  B23K3/06 ,  H05K3/22 ,  H05K3/34 ,  B23K1/20

CPC classification number: B23K3/0653 ,  H05K3/227 ,  B23K2201/42

Abstract: A hot air circulation apparatus and method for wave soldering machines which heats air from a high-pressure air source and directs it at the flux applied to a printed circuit board. The heated and pressurized air also circulates air within the wave soldering machine to force the moisture out. A plurality of hot air knives are mounted adjacent heaters within the wave soldering machine and are coupled to the pressurized air source. The hot air knives include a hollow metal cylindrical member which conducts heat from the heater, and contain a plurality of orifices which increase the pressure of the air and direct the air at the flux.

公开(公告)号：US5511719A

公开(公告)日：1996-04-30

申请号：US251921

申请日：1994-06-01

Applicant: Toshihiro Miyake ,  Katuya Bando ,  Toshiaki Yagura ,  Koji Kondo

Inventor： Toshihiro Miyake ,  Katuya Bando ,  Toshiaki Yagura ,  Koji Kondo

IPC: B23K1/06 ,  H05K3/34 ,  H05K3/36 ,  B23K1/20

CPC classification number: H05K3/363 ,  B23K1/06 ,  B23K2201/42 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K3/3473 ,  H05K3/3494

Abstract: A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.

Abstract translation: 一种连接金属构件的方法，包括以下步骤：提供多个金属构件的第一组，每个构件具有形成在其上的焊球; 提供第二组多个金属构件，每个构件具有形成在其上的焊球; 通过焊料珠之间的直接接触将第一组金属构件抵靠第二组金属构件; 将超声波振动通过金属构件接触到焊球; 随后加热珠子以使焊料珠结合在一起。

公开(公告)号：US5480483A

公开(公告)日：1996-01-02

申请号：US98847

申请日：1993-07-29

Applicant: Larry N. Velie

Inventor： Larry N. Velie

IPC: B23K1/00 ,  H05K3/34 ,  B05C5/04

CPC classification number: B23K1/001 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0126 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0746 ,  H05K2203/1518 ,  H05K3/3452

Abstract: An apparatus for depositing solder on the terminal pads of printed circuit boards in which a solder resist layer or layers having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir is directed by nozzles against the sides of the board to fill the cavities extending above the terminal pads while the board is moving via a conveyor mechanism relative to the reservoir. The cavities when filled with molten solder are covered by a suitable element such as a flexible belt or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer or layers may then be stripped from the board to leave solder pads extending above the surface of the board.

Abstract translation: 一种用于在印刷电路板的端子焊盘上沉积焊料的装置，其中具有对应于期望的焊料高度的厚度的阻焊层或与焊盘相邻的阻焊层。 来自贮存器的熔融焊料通过喷嘴抵靠板的侧面引导以填充在端子焊盘上方延伸的空腔，同时板通过相对于储存器的传送机构移动。 填充熔融焊料时的空腔被适当的元件（例如柔性带或辊）覆盖。 然后将被覆盖腔内的熔融焊料冷却到其凝固点以下，并且除去覆盖元件。 如果需要，则可以从板剥离部分或全部阻焊层或层，以使焊盘延伸到板的表面之上。

公开(公告)号：US5479694A

公开(公告)日：1996-01-02

申请号：US48129

申请日：1993-04-13

Applicant: Donald D. Baldwin

Inventor： Donald D. Baldwin

IPC: B23K1/00 ,  B23K3/08 ,  B23K31/12 ,  B23Q3/154 ,  G01R1/04 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  B23K31/02 ,  B23P19/00 ,  G01R31/00

CPC classification number: B23K31/12 ,  B23K1/0016 ,  B23K3/087 ,  B23Q3/1546 ,  G01R1/04 ,  H05K3/303 ,  H05K3/325 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1394 ,  H05K2203/162 ,  H05K3/3421 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53083 ,  Y10T29/53183 ,  Y10T29/53196

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract translation: 通过在PCB的表面处引入选定强度的磁场将IC器件临时保持在PCB上，将集成电路（IC）器件安装到印刷电路板（PCB）上。 IC器件具有被磁场吸引的磁性材料。 当IC器件和PCB被测试时，然后在IC器件永久地接合到PCB时在焊接期间保持磁场。

公开(公告)号：US5476207A

公开(公告)日：1995-12-19

申请号：US345681

申请日：1994-11-21

Applicant: John P. Peterson ,  Paul Brinkley

Inventor： John P. Peterson ,  Paul Brinkley

IPC: B23K1/20 ,  G01N21/35 ,  H05K3/34 ,  B23K31/02 ,  B23K31/12

CPC classification number: B23K1/203 ,  B23K2201/42 ,  G01N21/3563 ,  H05K3/3489 ,  H05K3/3494

Abstract: Fluxing and soldering terminals on a printed circuit board by an in-line process in which flux concentration is determined at specific locations laterally of the passline. At each of the positions infrared light is passed through a wall of flux which is being directed at the board. The infrared light becomes partly absorbed by materials in the flux and the unabsorbed light which passes through the wall of flux is used to generate signals corresponding to the different wavelengths of unabsorbed light at each of the locations. This enables a determination to be made of the flux concentration at each location. The signals are preferably used to effect a change in the flow rate of flux at any specific location so as to control the amount of flux deposited upon the board. Particularly useful for "no-clean" flux applications.

Abstract translation: 通过在线工艺在印刷电路板上焊接和焊接端子，其中在通行线的横向的特定位置处确定焊剂浓度。 在每个位置，红外光通过导向于板的焊剂壁。 红外光部分地被助焊剂中的材料吸收，并且通过通量壁的未吸收的光被用于产生对应于每个位置处的不吸收光的不同波长的信号。 这使得能够确定每个位置处的通量浓度。 这些信号优选用于实现任何特定位置处的通量流量的变化，以便控制沉积在电路板上的焊剂的量。 特别适用于“无清洁”助焊剂应用。

公开(公告)号：US5472135A

公开(公告)日：1995-12-05

申请号：US152143

申请日：1993-11-16

Applicant: Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

Inventor： Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

IPC: B23K1/008 ,  B23K1/012 ,  H02K3/34 ,  B23K35/38 ,  B23K31/02

CPC classification number: H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

Abstract: The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Abstract translation: 本发明提供一种有效地使回流炉内的加热部内部的气体流动方向恒定的回流装置和方法。 在加热单元中形成循环气体路径，该加热单元收集并使得气体从加热单元的后侧上的西洛克风扇流出，然后向下朝着在加热前侧沿着传送路径移动的电路板 单元。 此外，多个矫直板布置在加热单元的传送路径的上方，以引导沿着传送路径移动的电路板向下流动的热气体。 设置吹扫喷嘴，并且在电路板的传送方向上包括排成行的多个板。 板具有相反的U形横截面。 吹出喷嘴布置在矫直板的下方，使垂直热气流均匀地流过电路板的整个表面。

公开(公告)号：US5411645A

公开(公告)日：1995-05-02

申请号：US109136

申请日：1993-08-19

Applicant: D. Morgan Tench

Inventor： D. Morgan Tench

IPC: C25C3/24 ,  B23K1/20 ,  B23K35/38 ,  C23C18/16 ,  C23G1/36 ,  C25C1/00 ,  C25C1/14 ,  C25C3/36 ,  C25D21/18 ,  C25F7/00

CPC classification number: B23K1/206 ,  B23K35/38 ,  C23C18/1617 ,  C23G1/36 ,  C25D21/18 ,  B23K2201/42

Abstract: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components to be soldered in a fluxless soldering process. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode, which may evolve hydrogen gas. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte. Ideally, the anodic reaction is breakdown of water to form oxygen, which is vented, and protons that migrate across the ionic barrier to the catholyte replacing protons consumed in the ancillary process. The overall reaction in a fluxless soldering system is reduction of metallic oxides to metal, electrochemical regeneration of reducing agents, release of oxygen, and evolution of hydrogen to produce a reducing atmosphere in an enclosed chamber containing the fluxless soldering system.

Abstract translation: 提供了用于再生用于辅助化学或电化学过程中的还原剂的系统，例如在无焊剂焊接工艺中恢复要焊接的电子部件的可焊性。 该系统包括阴极，阳极和电解质系统，其由半透性离子屏障分离成阴极电解液和阳极电解液。 阴极电解质包括氧化还原对的还原成员，其可以电化学地再生。 电解液系统的氧化还原电极像电池一样充电并在辅助过程中放电。 在阴极处实现氧化还原对的还原成员的再生，这可能产生氢气。 化学平衡通过半透性离子屏障保持，这允许质子从阳极电解液迁移到阴极电解液，但是作为阻止阳离子从阴极电解液到阳极电解液的扩散和迁移的屏障。 理想地，阳极反应是水的分解以形成被排出的氧，以及迁移穿过离子屏障到阴极电解液的质子代替在辅助过程中消耗的质子。 无助焊剂系统中的总体反应是将金属氧化物还原为金属，还原剂的电化学再生，氧的释放和氢的释放，以在包含无助焊剂系统的封闭室中产生还原气氛。

公开(公告)号：US5409155A

公开(公告)日：1995-04-25

申请号：US52479

申请日：1993-04-23

Applicant: Wun-Shyong Chen

Inventor： Wun-Shyong Chen

IPC: B23K1/008 ,  B23K1/06 ,  H05K3/34

CPC classification number: B23K1/008 ,  B23K1/06 ,  H05K3/341 ,  B23K2201/42 ,  H05K2203/0292 ,  H05K2203/048 ,  H05K2203/1509 ,  H05K3/3421 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than the melting temperature of the solder and while at the elevated temperature, vibrating the parts to align (center) the areas with respect to one another. Accordingly a reflow oven designed to practice this invention includes a conveyor system with three continuous belts leading in series from the entrance to the exit of the oven. The first belt carries the parts through a temperature zone where melting of the binder occurs; the second belt carries the parts through a hotter zone where melting of the solder and vibration to effect centering occurs; the third belt carries the part through the cooling zone. Separation of the belt into three isolated sections prevents disturbance of the parts when they are located in areas where the solder is not molten.

Abstract translation: 一种用于将两部分的区域焊接在一起的方法和装置，例如电子部件的焊接引线到印刷电路板上的焊盘，其包括将邻接区域的温度升高到大于 焊料，而在升高的温度下，振动部件使其相对于彼此对准（居中）。 因此，设计用于实施本发明的回流炉包括具有三个连续带的输送机系统，其从入口到炉的出口串联。 第一带携带部件通过粘合剂熔化的温度区域; 第二带通过较热的区域运送部件，其中发生焊料的熔化和振动以实现定心; 第三皮带将部件穿过冷却区域。 将带分离成三个隔离部分，当它们位于焊料不熔化的区域时，可以防止部件的干扰。

公开(公告)号：US5388327A

公开(公告)日：1995-02-14

申请号：US122027

申请日：1993-09-15

Applicant: Robert T. Trabucco

Inventor： Robert T. Trabucco

IPC: B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K3/0638 ,  H01L21/4853 ,  H05K3/3436 ,  H05K3/3468 ,  B23K2201/42 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0769 ,  H05K2203/128 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A dissolvable film carrier is provided with holes arranged in a shape to correspond to an array of contact pads on a substrate. The holes are filled with solder. The film carrier retains the solder. The carrier is placed over the surface of the substrate and is heated, causing the solder to re-flow and to wet and to adhere to the contact pads. The carrier, which resists the re-flow temperature, maintains the shape of the solder contacts while cooling. After cooling, the film carrier can be removed from around the solder contacts with a suitable solvent.

Abstract translation: 描述了在基板的表面上同时形成大量焊球（或凸块）接触的技术。 一个可溶解的薄膜载体上设置有孔，它们以与衬底上的接触垫阵列相对应的形状排列。 这些孔填充有焊料。 胶片载体保留焊料。 将载体放置在基底的表面上并被加热，使得焊料重新流动并湿润并粘附到接触垫上。 抵抗再流动温度的载体在冷却时保持焊料接触的形状。 冷却后，可以用合适的溶剂将胶片载体从焊料触点周围除去。