公开(公告)号：US20110310605A1

公开(公告)日：2011-12-22

申请号：US13166626

申请日：2011-06-22

Applicant: John O. Renn ,  William G. Reed ,  Bradley B. Larsen

Inventor： John O. Renn ,  William G. Reed ,  Bradley B. Larsen

IPC: F21V29/00 ,  F21V11/00 ,  H05K3/00 ,  F21S4/00

CPC classification number: H05K1/0278 ,  F21S8/08 ,  F21V7/0058 ,  F21V7/041 ,  F21V13/02 ,  F21V19/0035 ,  F21V19/0055 ,  F21V29/777 ,  F21W2131/103 ,  F21Y2103/33 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10409 ,  Y10T29/49124

Abstract: An illumination device comprises a circuit board that carries solid-state light sources and a heat transfer structure to which the circuit board is intimately physically coupled such that the circuit board is curved along at least one of a longitudinal dimension or a lateral dimension thereof. Such may allow less fasteners to be used than would otherwise be possible, while maintaining close contact over a large portion of the surface area. Some embodiments may employ a clamp, for example a peripheral clamp such as a cover or bezel clamp.

Abstract translation: 照明装置包括承载固态光源的电路板和电路板紧密物理耦合的传热结构，使得电路板沿其纵向尺寸或横向尺寸中的至少一个弯曲。 这样可以允许比否则可能使用更少的紧固件，同时在表面区域的大部分上保持紧密接触。 一些实施例可以使用夹具，例如外围夹具，例如盖或挡板夹。

公开(公告)号：US08056474B2

公开(公告)日：2011-11-15

申请号：US12770514

申请日：2010-04-29

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: B41F17/28 ,  B41F15/30 ,  B41F15/38

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

Abstract translation: 电路被施加到具有曲面的物体上。 物体的曲面被分成几部分，电路一次应用一个部分。 该电路形成在介电材料层之间。 电介质通过计算机控制的装置施加，其控制喷头的位置和物体的旋转，使得喷头始终保持基本上垂直于物体的表面，并且使得受控的 介电材料的厚度可以沉积。 由本发明形成的精细电路是坚固的，并且可以用于旨在暴露于恶劣环境的物体上。

公开(公告)号：US20110220958A1

公开(公告)日：2011-09-15

申请号：US13130530

申请日：2009-11-26

Applicant: Kenji Yoneda

Inventor： Kenji Yoneda

IPC: H01L33/62

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21Y2115/10 ,  G01N21/8806 ,  G01N2201/0626 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present invention relates to a method for easily manufacturing an illumination device in which a surface mount chip-type LED is used, and a wiring board is formed into a truncated conical or another shape. The method includes, in a flexible strip-like wiring board having a partial ring or a linear shape, providing a through-hole T for filling with solder paste S at a wiring end portion L to be connected with a terminal of an LED, temporarily fixing the LED with bond B onto the wiring board held in a plate-like state, filling the through-hole T with the solder paste S from a back surface of the wiring board, rounding the wiring board mounted with the LED into a truncated conical or cylindrical shape, and reflowing the wiring board in the rounded state to solder the LED.

Abstract translation: 本发明涉及容易制造其中使用表面贴装芯片型LED的照明装置的方法，并且布线板形成为截头圆锥形或其它形状。 该方法包括在具有部分环或线性形状的柔性条状布线板中，提供用于在与LED的端子连接的布线端部L处填充焊膏S的通孔T临时 用键B将LED固定在板状状态的布线板上，从布线板的背面向焊盘S填充通孔T，将安装有LED的布线板四舍五入为截头圆锥形 或圆柱形，并且在圆形状态下回流布线板以焊接LED。

公开(公告)号：US07958627B2

公开(公告)日：2011-06-14

申请号：US12236126

申请日：2008-09-23

Applicant: Michael S. Randall ,  Chris Wayne ,  John McConnell

Inventor： Michael S. Randall ,  Chris Wayne ,  John McConnell

IPC: H05K3/30

CPC classification number: H05K1/141 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09018 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract translation: 提供一种形成电气部件的方法。 该方法包括通过将集成电路电连接到柔性电路来准备子组件; 以及将所述子组件附接到具有曲率偏差超过0.008英寸/英寸的安装表面的多层陶瓷电容器。

公开(公告)号：US20110024165A1

公开(公告)日：2011-02-03

申请号：US12606462

申请日：2009-10-27

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/09 ,  H05K3/00 ,  H05K1/16

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US07743702B2

公开(公告)日：2010-06-29

申请号：US11458307

申请日：2006-07-18

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: B41M1/12 ,  B41M1/40 ,  B41F15/30 ,  B41F15/32 ,  B41F17/28

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

Abstract translation: 电路被施加到具有曲面的物体上。 物体的曲面被分成几部分，电路一次应用一个部分。 该电路形成在介电材料层之间。 电介质通过计算机控制的装置施加，其控制喷头的位置和物体的旋转，使得喷头始终保持基本上垂直于物体的表面，并且使得受控的 介电材料的厚度可以沉积。 由本发明形成的精细电路是坚固的，并且可以用于旨在暴露于恶劣环境的物体上。

公开(公告)号：US20090077800A1

公开(公告)日：2009-03-26

申请号：US12236126

申请日：2008-09-23

Applicant: Michael S. Randall ,  Chris Wayne ,  John McConnell

Inventor： Michael S. Randall ,  Chris Wayne ,  John McConnell

IPC: H01R43/00

CPC classification number: H05K1/141 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09018 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract translation: 提供一种形成电气部件的方法。 该方法包括通过将集成电路电连接到柔性电路来准备子组件; 以及将所述子组件附接到具有曲率偏差超过0.008英寸/英寸的安装表面的多层陶瓷电容器。

公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

Applicant: Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

Inventor： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC: H01R12/00 ,  H01R43/00

CPC classification number: H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract translation: 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US07343675B2

公开(公告)日：2008-03-18

申请号：US10987285

申请日：2004-11-12

Applicant: C. W. Sinjin Smith ,  Paul B. Jaynes ,  Charles J. Newton ,  Travis L. Kerby

Inventor： C. W. Sinjin Smith ,  Paul B. Jaynes ,  Charles J. Newton ,  Travis L. Kerby

IPC: H01K3/22

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

Abstract: A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

Abstract translation: 公开了一种涉及称为结构电路的多功能结构电路的方法。 该方法可以包括用结构元件（215）热成型液晶聚合物（LCP）电路。 至少一个电路部件可以附接到LCP电路（220）的表面。

公开(公告)号：US20070248829A1

公开(公告)日：2007-10-25

申请号：US11575262

申请日：2005-09-07

Applicant: Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

Inventor： Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

IPC: B32B9/00

CPC classification number: H05K1/05 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/13 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/09018 ,  Y10T428/12007 ,  Y10T428/249957 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/26 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4521 ,  C04B41/4523 ,  H01L2924/00

Abstract: An aluminum/silicon carbide composite prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, including an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane. The silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form the bow shape. The aluminum/silicon carbide composite is suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required.

Abstract translation: 通过以包含铝作为主要成分的金属浸渍扁平碳化硅多孔体制备的铝/碳化硅复合体，包括由铝构成的金属作为主要成分在两个主平面上的铝合金层和一个主平面， 结合到电路板，另一个主平面用作辐射平面。 碳化硅多孔体形成或加工成凸形状，并且在以含有铝的金属为主要成分的渗透后，辐射面上的铝合金层进一步加工成弓形。 铝/碳化硅复合材料适合作为安装半导体元件的陶瓷电路板的基板，需要高可靠性。