公开(公告)号：EP3278637A1

公开(公告)日：2018-02-07

申请号：EP15888003.9

申请日：2015-03-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： HUTCHINGS, Cameron ,  WYATT, Stewart R, ,  HAHN, Scott D,

IPC: H05K1/02 ,  G06F3/041

CPC classification number: G06F3/0412 ,  G06F3/041 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: According to an example, a device may comprise a touchscreen light guide assembly, a lens disposed on the touchscreen light guide assembly, and a printed circuit board including a relief cut on an edge of the printed circuit board. The relief cut may be to receive the touchscreen light guide assembly and to allow the lens to extend into the printed circuit board relief cut.

公开(公告)号：EP2921036A1

公开(公告)日：2015-09-23

申请号：EP13792039.3

申请日：2013-11-19

Applicant: Particle Physics Inside Products B.V.

Inventor： Spaanderdam, Dirk-Jan ,  Jungmann, Julia, Helga ,  Heeren, Ronald, Martinus, Alexander

IPC: H05K1/02 ,  H01J49/02

CPC classification number: H01J49/0004 ,  H01J49/022 ,  H01J49/025 ,  H01J49/24 ,  H05K1/02 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2203/1147

Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure is described. The feedthrough structure comprises: a printed circuit board (PCB) 206 for carrying one or more detectors 216, wherein said PCB comprises a top surface 214 and a back surface 212, wherein said top surface is covered with a first UHV sealing layer, preferably said first sealing layer comprising a liquid crystal polymer material; and, wherein said top surface comprises one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, wherein said back surface comprises one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, said PCB further comprising one or more conductive wires embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, said PCB further comprising one or more thermally conductive vias embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.

公开(公告)号：EP2804227A1

公开(公告)日：2014-11-19

申请号：EP14169182.4

申请日：2011-04-27

Applicant: Panasonic Corporation

Inventor： Motoya, Atsushi ,  Okano, Kazuyuki ,  Akai, Minako ,  Goto, Yurika ,  Tagami, Naoki ,  Horiuchi, Makoto ,  Mori, Toshio ,  Uemoto, Takaari ,  Miki, Masahiro

IPC: H01L33/60 ,  F21S2/00 ,  G02B5/08 ,  F21Y101/02 ,  H05K1/03 ,  H01L25/075 ,  H01L33/50

CPC classification number: H01L25/0753 ,  F21K9/23 ,  F21V3/00 ,  F21V7/22 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/017 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate (101) according to the present invention includes a substrate (108) and a reflective film (106) that is formed on a front surface of the substrate (108) and has a front surface on which LED chips (102) are to be mounted, and the reflective film (106) is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips (102).

公开(公告)号：EP2734018A1

公开(公告)日：2014-05-21

申请号：EP12007812.6

申请日：2012-11-19

Applicant: Particle Physics Inside Products B.V.

Inventor： Spaanderdam, Dirk-Jan ,  Jungmann, M Julla Helga ,  Heeren, Ronald Martinus Alexander

IPC: H05K1/02 ,  H01J49/02

CPC classification number: H01J49/0004 ,  H01J49/022 ,  H01J49/025 ,  H01J49/24 ,  H05K1/02 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2203/1147

Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure is described. The feedthrough structure comprises: a printed circuit board (PCB) 206 for carrying one or more detectors 216, wherein said PCB comprises a top surface 214 and a back surface 212, wherein said top surface is covered with a first UHV sealing layer, preferably said first sealing layer comprising a liquid crystal polymer material; and, wherein said top surface comprises one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, wherein said back surface comprises one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, said PCB further comprising one or more conductive wires embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, said PCB further comprising one or more thermally conductive vias embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.

Abstract translation: 描述了超高真空（UHV）兼容馈通结构和使用这种馈通结构的检测器组件。 馈通结构包括：用于承载一个或多个检测器216的印刷电路板（PCB）206，​​其中所述PCB包括顶表面214和后表面212，其中所述顶表面被第一UHV密封层覆盖，优选地所述 第一密封层，其包含液晶聚合物材料; 并且其中所述顶表面包括一个或多个第一电极和至少部分地在所述顶表面上延伸的至少第一导热层; 并且其中所述后表面包括一个或多个第二电极和至少部分地延伸在所述背表面上的至少第二导热层，所述PCB还包括嵌入所述PCB中的一个或多个导电线，用于电连接所述一个或多个第一 分别具有所述一个或多个第二电极的电极; 并且所述PCB还包括嵌入所述PCB中的一个或多个导热通孔，用于将所述至少第一导热层与所述第二导热层热连接。

公开(公告)号：EP2701469A1

公开(公告)日：2014-02-26

申请号：EP12773834.2

申请日：2012-02-01

Applicant: NGK Sparkplug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

Abstract: Provided are a ceramic wiring substrate having few burrs in the vicinity of a notch provided on a side surface of a substrate main body, in which a conductor layer provided on the inner wall of the notch exhibits excellent solderability; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array.
The ceramic wiring substrate 1a includes a substrate main body 2a which has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 8a located on a side toward the front surface 3 and a fracture surface 7 located on a side toward the back surface 4; and a notch 6 which has a concave shape in plan view, and which is provided on at least one of the side surfaces 5 so as to extend between the front surface 3 and the back surface 4, wherein, in the side surface 5 having the notch 6, the boundary 11 between the groove surface 8a and the fracture surface 7 has curved portions 11r on opposite sides of the notch 6, the curved portions 11r being convex toward the front surface 3 of the substrate main body 2a in side view.

Abstract translation: 提供一种陶瓷布线基板，其在设置在基板主体的侧面上的凹口附近具有较少的毛刺，其中设置在凹口的内壁上的导体层具有优异的可焊性; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。 陶瓷布线基板1a包括在平面图中具有矩形形状的基板主体2a，其具有前表面3和后表面4，并且具有侧表面5，每个侧表面5位于前表面3和后表面之间 并且具有位于前表面3侧的槽表面8a和位于背面4侧的断面7; 以及在平面图中具有凹形形状的凹口6，并且设置在至少一个侧面5上，以便在前表面3和后表面4之间延伸，其中在具有 凹槽6，凹槽表面8a和断裂面7之间的边界11在凹口6的相对两侧具有弯曲部分11r，弯曲部分11r在侧视图中朝向基底主体2a的前表面3凸出。

公开(公告)号：EP2571068A4

公开(公告)日：2013-05-08

申请号：EP11780357

申请日：2011-04-27

Applicant: PANASONIC CORP

Inventor： HORIUCHI MAKOTO ,  TAGAMI NAOKI ,  MORI TOSHIO ,  UEMOTO TAKAARI ,  MIKI MASAHIRO ,  OKANO KAZUYUKI ,  AKAI MINAKO ,  GOTO YURIKA

IPC: H01L33/60 ,  F21S2/00 ,  F21Y101/02 ,  G02B5/08 ,  H05K1/03

CPC classification number: H01L25/0753 ,  F21K9/23 ,  F21V3/00 ,  F21V7/22 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/017 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate (101) according to the present invention includes a substrate (108) and a reflective film (106) that is formed on a front surface of the substrate (108) and has a front surface on which LED chips (102) are to be mounted, and the reflective film (106) is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips (102).

Abstract translation: 本发明的目的在于提供一种能够充分提高LED灯的发光效率的安装基板，制造方法，发光模块以及照明装置。 根据本发明的安装基板（101）包括基板（108）和形成在基板（108）的前表面上并且具有LED芯片（102）在其上的前表面的反射膜（106） 并且反射膜（106）由金属氧化物微粒和玻璃料制成，并且反射来自LED芯片（102）的光。

公开(公告)号：EP1472915B1

公开(公告)日：2006-03-08

申请号：EP03706279.1

申请日：2003-02-05

Applicant: Infineon Technologies AG

Inventor： MÜNCH, Thomas

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: The invention relates to a circuit carrier (1) and a method for the production thereof. The circuit carrier (1) is provided with a substrate (2) with two juxtaposed surfaces (3) and (4). The connecting contacts of a flat plug strip are arranged in the edge areas (5) of surfaces (3) and (4). A feedthrough (7) with a covered electrical connection to the rear side (8) of the connecting contact (6) is disposed underneath at least one of the connecting contacts (6) while the upper side of the connecting contact (6) has an undisturbed morphology and a flat surface.

公开(公告)号：EP1602265A2

公开(公告)日：2005-12-07

申请号：EP04717495.8

申请日：2004-03-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： VANDER PLAS, Hubert, A. ,  BERAUER, Frank

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L29/0657 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H05K3/3452 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/099 ,  H05K2203/0568 ,  H05K2203/1394 ,  H01L2224/0401

Abstract: A method for depositing a solder layer (280) or solder bump on a sloped surface (220). The method includes etching a sloped surface on a planar semiconductor substrate (200), depositing a solder-wettable layer (230) on the sloped surface, masking the wettabler layer with a coating layer (240) to control the position of the solder deposition, and using an organic film (250) to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Also, a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.

公开(公告)号：EP1460887A3

公开(公告)日：2005-07-27

申请号：EP04075869.0

申请日：2004-03-17

Applicant: The Boeing Company

Inventor： Anderson, David M. ,  Gladish, David R. ,  Johnson, Robert T. ,  Thomas, Terry L. ,  Senibi, Simon D. ,  Malkin, Matthew C.

IPC: H05K1/11 ,  H01R12/08

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A connector pad (12) is provided having a base (22), a top (24) opposite the base, and tapered sidewalls (26) therebetween. The tapering minimizes stress concentrations when the connector (36) is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies (28) suitable for sandwiching a flat structurally integrated wiring array (20) therebetween. A plurality of plated through holes (32) formed in the connector pad (12) enable access to the wiring array therein.

公开(公告)号：EP1472915A2

公开(公告)日：2004-11-03

申请号：EP03706279.1

申请日：2003-02-05

Applicant: Infineon Technologies AG

Inventor： MÜNCH, Thomas

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: The invention relates to a circuit carrier (1) and a method for the production thereof. The circuit carrier (1) is provided with a substrate (2) with two juxtaposed surfaces (3) and (4). The connecting contacts of a flat plug strip are arranged in the edge areas (5) of surfaces (3) and (4). A feedthrough (7) with a covered electrical connection to the rear side (8) of the connecting contact (6) is disposed underneath at least one of the connecting contacts (6) while the upper side of the connecting contact (6) has an undisturbed morphology and a flat surface.

Abstract translation: 电路载体包括具有两个相对布置的区域的衬底。 扁平连接器条的端子触点布置在区域的边缘区域中。 在至少一个端子触点之下布置有一个贯通触点，并且与端子触点的后侧具有隐蔽的电连接，并且端子触点的顶侧呈现出不受干扰的形态和平坦表面。