公开(公告)号：US08420946B2

公开(公告)日：2013-04-16

申请号：US13238745

申请日：2011-09-21

Applicant: Fa-Ping Fan

Inventor： Fa-Ping Fan

IPC: H05K1/03

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

公开(公告)号：US08242373B2

公开(公告)日：2012-08-14

申请号：US12227365

申请日：2007-06-06

Applicant: Seiichiro Miyahara

Inventor： Seiichiro Miyahara

IPC: H05K1/00

CPC classification number: H05K1/025 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract translation: 提供了具有布线结构的柔性布线板，即使以三维方式折叠，也可以通过降低阻抗失配来降低传输损耗。 在具有特性阻抗控制电路20的柔性布线板10中，柔性布线板在沿着切线折叠成弧状态之后，在特性阻抗控制电路中具有折叠点20A的平面投影形状。

公开(公告)号：US20120012377A1

公开(公告)日：2012-01-19

申请号：US13238761

申请日：2011-09-21

Applicant: FA-PING FAN

Inventor： FA-PING FAN

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

Abstract translation: 示例性印刷电路板包括基板，差分传输线和至少两个焊盘对。 差分传输线和至少两个焊盘对设置在基板上。 差分传输线包括设置在基板上的两个并行信号导体。 两个信号导体中的每一个电连接到相应的一对至少两个焊盘对的焊接焊盘之一的边缘。 因此，差分传输线的两个信号导体可以在任何地方延伸相同的距离，特别是在两个信号导体通过两个焊盘对的位置。 结果，提高了耦合性能和差动传输线抵抗电磁干扰的能力。

公开(公告)号：US07477118B2

公开(公告)日：2009-01-13

申请号：US11335195

申请日：2006-01-19

Applicant: Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

Inventor： Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

IPC: H01P3/08 ,  H03H9/00 ,  H01R12/14 ,  H01R12/30

CPC classification number: H05K1/0243 ,  H01L21/4853 ,  H01L2224/16225 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09418 ,  H05K2201/09572 ,  H05K2201/09618 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10189 ,  Y02P70/611

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract translation: 用于承载高频器件3的端子电极9形成在电路板的表面，其表面覆盖有反面导体层6，并且多个信号线2用于在高频器件3和 在其上形成外部电路。 端子电极9布置在电路板的中心，并且信号线2从端子电极9径向延伸。可以减小信号线2之间的电磁干扰，使得带外衰减特性和隔离特性 可以在高频装置3为双工器的情况下令人满意地展现。

公开(公告)号：US07449978B2

公开(公告)日：2008-11-11

申请号：US11845990

申请日：2007-08-28

Applicant: Kunio Yamaguchi ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

Inventor： Kunio Yamaguchi ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

IPC: H03H9/64 ,  H05K5/04 ,  H05K9/00

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded. Furthermore, there is provided a protective member which has a conductive surface and which is in contact with the surface of said filter, and said conductive surface of said protective member which is in contact with the surface of said filter is set so as to be of the same size as the surface of said filter, or so as to be smaller than it.

Abstract translation: 在包括硅灰石作为其压电元件的SAW滤波器的嵌合区域中，包括连接到SAW滤波器的输入端子和输出端子的输入侧端子电极和输出侧端子电极。 对于每个端子电极，在与SAW滤波器的嵌合区域分开只有预定距离的位置处连接有沿着与传输方向平行的方向在相互相反的方向上延伸的微带线 的SAW滤波器内的频率信号。 在SAW滤波器的装配区域中设置有狭缝，并且在与SAW滤波器内的频率信号的传输方向相交的方向上延伸。 多个通孔设置在印刷基板中，并将其表面及其背面接地电连接在一起。 此外，提供了具有导电表面并与所述过滤器的表面接触的保护构件，并且与所述过滤器的表面接触的所述保护构件的所述导电表面被设定为 与所述过滤器的表面相同的尺寸，或者比其小。

公开(公告)号：US20080261415A1

公开(公告)日：2008-10-23

申请号：US12062580

申请日：2008-04-04

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09281 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Abstract translation: 电连接板包括在一个面上的电连接端子，其具有与半导体部件连接的视图和分别连接到这些端子的电连接轨道。 端子布置成具有两个正交方向的正方形矩阵。 在其表面上，板包括多个相同的相邻连接组，每个组具有N个相邻的端子和沿着该方向放置的N个磁道，同时向矩阵的边缘延伸。 组的端子相对于相邻组的端子偏移一个间距。 板和半导体部件通过电连接球连接在一起。

公开(公告)号：US07379307B2

公开(公告)日：2008-05-27

申请号：US11466843

申请日：2006-08-24

Applicant: Hiroyuki Imamura ,  Nozomi Shimoishizaka

Inventor： Hiroyuki Imamura ,  Nozomi Shimoishizaka

IPC: H05K7/00

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/005 ,  H05K3/242 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/175 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.

Abstract translation: 布线板包括：绝缘基底; 多个导电布线; 和形成在导电配线上的凸块。 导电布线可以通过凸块与半导体元件的电极焊盘连接。 导电布线包括在与形成凸块的另一端部相对的端部处的连接端子部分，并且在连接端子部分处，导电布线可以与外部部件连接。 导电布线包括第一导电布线和第二导电布线，凸块分别形成在半导体元件安装区域上。 第一导电布线从凸块延伸到连接端子部分。 第二导电布线从凸块延伸超出半导体元件安装区域，但不到达连接端子部分。 延伸超过半导体元件安装区域的第二导电配线的端部通过与第一导电布线形成在边界区域处的切割部分与第一导电布线电隔离。 不管要安装的半导体元件的操作电极焊盘的状态如何，可以以恒定的间隔布置凸点。

公开(公告)号：US07326859B2

公开(公告)日：2008-02-05

申请号：US10735638

申请日：2003-12-16

Applicant: Cheng Siew Tay ,  Wendy Chet Ming Ngoh ,  Choi Keng Chan

Inventor： Cheng Siew Tay ,  Wendy Chet Ming Ngoh ,  Choi Keng Chan

IPC: H05K1/16

CPC classification number: H05K1/111 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/09481 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/5313

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。

公开(公告)号：US20070015378A1

公开(公告)日：2007-01-18

申请号：US11358057

申请日：2006-02-22

Applicant: Chin-Mei Huang

Inventor： Chin-Mei Huang

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K3/28 ,  H05K3/4015 ,  H05K2201/09281 ,  H05K2201/0979

Abstract: A flexible printed circuit board includes a flexible substrate, which has a bonding zone, a folding zone, and a folding line between the bonding zone and the folding zone, two electrically conductive contacts respectively located at the bonding zone, two lead wires each having an extension portion respectively electrically connected to the electrically conductive contacts and arranged in parallel to the folding line and a connecting portion extending integrally from the extension portion toward the folding zone, and a protective layer covered on the flexible substrate over the lead wires. The protective layer has openings corresponding to the electrically conductive contacts.

Abstract translation: 柔性印刷电路板包括柔性基板，其具有接合区域，折叠区域和接合区域和折叠区域之间的折叠线，分别位于接合区域处的两个导电触点，每个具有一个 延伸部分分别电连接到导电触头并且平行于折叠线布置，并且从延伸部分朝向折叠区域整体延伸的连接部分以及覆盖在引线上的柔性基板上的保护层。 保护层具有对应于导电触点的开口。

公开(公告)号：US07056571B2

公开(公告)日：2006-06-06

申请号：US10739156

申请日：2003-12-19

Applicant: Satoru Tomekawa ,  Tetsuyoshi Ogura ,  Hiroyoshi Tagi

Inventor： Satoru Tomekawa ,  Tetsuyoshi Ogura ,  Hiroyoshi Tagi

IPC: B32B3/00

CPC classification number: B32B17/04 ,  B32B15/04 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09281 ,  Y10S428/901 ,  Y10T428/24917

Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.

Abstract translation: 提供一种布线板，其包括绝缘基板和位于绝缘基板的至少一个主表面上的布线层，其中绝缘基板包括由纱线制成的机织织物和机织织物 并且形成布线层的布线的至少一个布线在除了纱线的顶部之外的机织织物上延伸。