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    CONNECTING STRUCTURE AND CONNECTING METHOD FOR FLEXIBLE FLAT CABLE
    163.
    发明申请
    CONNECTING STRUCTURE AND CONNECTING METHOD FOR FLEXIBLE FLAT CABLE 有权
    用于柔性平板电缆的连接结构和连接方法

    公开(公告)号：US20120100750A1

    公开(公告)日：2012-04-26

    申请号：US13381113

    申请日：2010-06-18

    Applicant: Shoichi Nomura ,  Goro Nakamura

    Inventor： Shoichi Nomura ,  Goro Nakamura

    IPC: H01R12/59 ,  H01R43/00

    CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

    Abstract: A flexible flat cable connecting structure for connecting a flexible flat cable in which a plurality of rectangular conductors are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member one end of which is coupled to the connector terminals and in which a plurality of branch conductors are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member is laid on the flexible flat cable so that the intermediate cable arranging member and the flexible flat cable are in the same plane and form an angle. The other ends of the branch conductors of the intermediate cable arranging member are connected to the respective rectangular conductors.

    Abstract translation: 一种柔性扁平电缆连接结构，用于连接其中平行设置多个矩形导体的柔性扁平电缆和以矩形导线不同的阵列间距排列的多个连接器端子，包括中间电缆排列构件 其连接到连接器端子，并且其中多个分支导体平行设置，根据阵列间距设置成具有相互不同的纵向尺寸。 中间电缆排列构件放置在柔性扁平电缆上，使得中间电缆排列构件和柔性扁平电缆处于同一平面并形成一个角度。 中间电缆排列构件的分支导体的另一端连接到相应的矩形导体。

    High Capacity Thin Module System
    167.
    发明申请
    High Capacity Thin Module System 有权
    大容量薄模块系统

    公开(公告)号：US20090046431A1

    公开(公告)日：2009-02-19

    申请号：US12258189

    申请日：2008-10-24

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Memory module system and method
    168.
    发明申请
    Memory module system and method 有权
    内存模块系统和方法

    公开(公告)号：US20080278901A9

    公开(公告)日：2008-11-13

    申请号：US11077952

    申请日：2005-03-11

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: G06F1/16

    CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

    Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

    Abstract translation: 存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。 本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。 许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。 设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。 描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

    High Capacity Thin Module System and Method
    169.
    发明申请
    High Capacity Thin Module System and Method 有权
    高容量薄模块系统和方法

    公开(公告)号：US20080094803A1

    公开(公告)日：2008-04-24

    申请号：US11961477

    申请日：2007-12-20

    Applicant: James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Wiring Board
    170.
    发明申请
    Wiring Board 审中-公开
    接线板

    公开(公告)号：US20070246250A1

    公开(公告)日：2007-10-25

    申请号：US11662269

    申请日：2005-09-06

    Applicant: Yoshihiro Tomita ,  Tadashi Nakamura

    Inventor： Yoshihiro Tomita ,  Tadashi Nakamura

    IPC: H05K3/00 ,  H05K1/00 ,  H05K3/46

    CPC classification number: H05K1/189 ,  H05K1/111 ,  H05K1/118 ,  H05K3/4602 ,  H05K2201/055 ,  H05K2201/09445 ,  Y10T29/49124 ,  Y10T29/49149

    Abstract: [PROBLEMS]To provide a multilayer wiring board wherein high density wiring exceeding the application limit of the conventional build up wiring boards is made possible. [MEANS FOR SOLVING PROBLEMS]A wiring board is provided with a board, which is formed by stacking along a board flat plane direction of a plurality of dielectric layers arranged along a facing direction of the both main surfaces of the board, and an inner conductor pattern arranged on the surface of the dielectric layer. The adjacent dielectric layers are formed so as to interconnect by being continuously and integrally coupled with each other through being connected at the layer edges on one of the board main planes. The connecting portions of the adjacent dielectric layers are alternately provided on one of the board main planes, and the dielectric layers are formed in a shape of one dielectric sheet that is arranged by being bent.

    Abstract translation: [问题]提供一种多层布线板，其中可以实现超过常规堆积布线板的施加极限的高密度布线。 解决问题的手段一种布线板设置有沿着沿着板的两个主表面的相对方向布置的多个电介质层的板平面方向堆叠而形成的板，以及内导体 图案布置在电介质层的表面上。 形成相邻的电介质层，以便通过连接在一个板主平面上的层边缘处，通过彼此连续地和一体地连接而相互连接。 相邻电介质层的连接部分交替地设置在一个板主平面上，并且电介质层形成为通过弯曲而布置的一个电介质片的形状。

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