公开(公告)号：US5329696A

公开(公告)日：1994-07-19

申请号：US900121

申请日：1992-06-18

Applicant: Takeshi Morita ,  Osamu Hayashi

Inventor： Takeshi Morita ,  Osamu Hayashi

IPC: H05K1/18 ,  B29C33/14 ,  B29C45/14 ,  B29C70/68 ,  H05K3/00 ,  H05K3/28 ,  H05K7/14 ,  H05K3/30

CPC classification number: H05K3/284 ,  B29C33/14 ,  B29C45/14639 ,  B29C70/68 ,  H05K3/0014 ,  H05K3/0058 ,  B29C2045/14114 ,  B29C2045/14852 ,  B29K2069/00 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3481 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10689 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T29/49155

Abstract: An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.

Abstract translation: 电子设备包括由聚碳酸酯树脂制成的壳体和新颖的双面印刷电路板。 印刷电路板的一侧嵌入壳体中，另一侧暴露于壳体的内部。 多个难熔电子部件安装在印刷电路板的一侧，并且包括电阻器和电容器。 多个下部耐火电子部件安装在壳体的另一侧，并且包括半导体集成电路和变压器。 优选地，施加绝缘层以覆盖印刷电路板和难熔电子部件的一侧。 此外，施加金属层以覆盖绝缘层和壳体的内表面。

公开(公告)号：US5043221A

公开(公告)日：1991-08-27

申请号：US443447

申请日：1989-11-30

Applicant: Joseph V. Koleske

Inventor： Joseph V. Koleske

IPC: C08G59/18 ,  C08G59/00 ,  C08G59/20 ,  C08G59/24 ,  C08G59/30 ,  C08G59/62 ,  C08G59/68 ,  C08G63/00 ,  C08G65/06 ,  C08K5/00 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  H05K3/28

CPC classification number: H05K3/287 ,  C08G59/24 ,  C08G59/68 ,  C08G65/06 ,  C08L63/00 ,  C09D163/00 ,  H05K2201/09872 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/31511

Abstract: A curable composition based on a cycloaliphatic polyepoxide, a polytetramethylene oxide polyol and a photoinitiator; and a circuit board having as a conformal coating thereon, the cured product of the curable composition.

Abstract translation: 基于脂环族聚环氧化物的可固化组合物，聚四氢呋喃多元醇和光引发剂; 以及其上具有保形涂层的电路板，该可固化组合物的固化产物。

公开(公告)号：US5010212A

公开(公告)日：1991-04-23

申请号：US357929

申请日：1989-05-30

Applicant: Chiaki Sumi ,  Wataru Kuwayama

Inventor： Chiaki Sumi ,  Wataru Kuwayama

IPC: H05K3/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K3/0091 ,  Y10T29/49146

Abstract: A printed circuit board having electrical components connected thereto in spaced relation is coated with a resin material by immersion in a container of resin material. The flow of resin between the electrical devices and the circuit board is facilitated by the provision of holes through the circuit board in alignment with each electrical component so that the formation of blow-holes is prevented.

Abstract translation: 具有以间隔关系连接的电气部件的印刷电路板通过浸渍在树脂材料容器中而被树脂材料涂覆。 电气装置和电路板之间的树脂流动通过与每个电气部件对齐设置通过电路板的孔来促进，从而防止了气孔的形成。

公开(公告)号：US4668713A

公开(公告)日：1987-05-26

申请号：US809099

申请日：1985-12-16

Applicant: John Woods ,  John M. Rooney ,  Bernard J. Bolger

Inventor： John Woods ,  John M. Rooney ,  Bernard J. Bolger

IPC: C08G18/00 ,  C08F2/48 ,  C08F2/50 ,  C08F299/02 ,  C08G18/04 ,  C08G18/30 ,  C08G18/38 ,  C08G75/04 ,  C09D175/00 ,  C09D175/04 ,  C09D175/14 ,  C09D175/16 ,  H05K3/28

CPC classification number: C08G18/3876 ,  C08F299/022 ,  C08G18/04 ,  C08G75/045 ,  H05K3/287 ,  H05K2201/09872

Abstract: Compositions useful as UV curable conformal coatings are mixtures, substantially free of isocyanate condensation catalyst, of the following constituents:(i) a compound having two or more alkenyl or alkynyl groups;(ii) a compound having two or more mercapto groups;(iii) a compound having two or more isocyanate groups; and(iv) a free radical photoinitiator.The composition cures by a secondary mechanism in shadow areas and has a long pot life, for example 8-24 hours.

Abstract translation: 可用作UV固化保形涂层的组合物是以下组分基本上不含异氰酸酯缩合催化剂的混合物：（i）具有两个或多个烯基或炔基的化合物; （ii）具有两个以上巯基的化合物; （iii）具有两个以上异氰酸酯基的化合物; 和（iv）自由基光引发剂。 组合物通过次级机制在阴影区域中固化并且具有长的适用期，例如8-24小时。

公开(公告)号：US4415604A

公开(公告)日：1983-11-15

申请号：US441164

申请日：1982-11-12

Applicant: Larry A. Nativi

Inventor： Larry A. Nativi

IPC: C09D155/00 ,  C08F283/00 ,  C08G18/10 ,  C08G18/48 ,  C09D175/14 ,  B05D3/06

CPC classification number: C08G18/4812 ,  C08F283/006 ,  C08G18/10 ,  H05K2201/09872

Abstract: Ultraviolet curable polymerizable coating system having a built-in secondary curing mechanism is disclosed. The polymerizable coating system is a one component system comprising at least one isocyanate-capped polyether diol and triol, an acrylate or methacrylate reactive diluent, and a polymerization initiator of the photo-initiator type. The coating system is also moisture curable.

Abstract translation: 公开了具有内置二次固化机理的紫外线固化可聚合涂覆体系。 可聚合涂覆体系是包含至少一种异氰酸酯封端的聚醚二醇和三醇，丙烯酸酯或甲基丙烯酸酯反应性稀释剂和光引发剂类型的聚合引发剂的单组分体系。 涂层系统也可湿固化。

公开(公告)号：US3652333A

公开(公告)日：1972-03-28

申请号：US3652333D

申请日：1970-02-02

Applicant: GEN DYNAMICS CORP

Inventor： WARREN JOHN M

IPC: C09D175/06 ,  H01B3/30 ,  H01B3/44 ,  H05K3/28 ,  H05K3/34 ,  B44D1/42

CPC classification number: H05K3/284 ,  C09D175/06 ,  H01B3/302 ,  H01B3/447 ,  H05K3/3447 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y10S428/901 ,  Y10T428/31576 ,  Y10T428/31909 ,  C08L2666/34

Abstract: A process for applying a polyurethane gel composition for coating and encapsulating the electronic circuitry on a circuit board wherein the said composition consists essentially of an admixture of an elastomeric linear polyesterurethane of high molecular weight; a tetrahydrofuran intermediate monomer solvent and ethylene glycol monoethylether acetate, which composition is preferably sprayed over the object circuitry and onto the related electronic circuit board or other substrate as a vaporized gel of minute viscous globules which simultaneously forms a substantially uniform protective film over the substrate and encapsulates the circuit''s conduit and conduit terminals as well as other protrusions, including elements having sharp points, knife edges and the like. This prime coat is then dried and may be subsequently followed by one or more dip coatings which are formed by immersion of the dried workpiece into a mixture of polymethyl methacrylate with a copolymer of ethyl acrylate/methyl methylacrylate.

Abstract translation: 一种用于将电子电路涂覆和封装在电路板上的聚氨酯凝胶组合物的方法，其中所述组合物基本上由高分子量的弹性线性聚酯聚氨酯的混合物组成; 四氢呋喃中间体单体溶剂和乙二醇单乙醚乙酸酯，该组合物优选在物体电路上喷射到相关电子电路板或其它基底上，作为微小粘性球的蒸发凝胶，其同时在基底上形成基本均匀的保护膜， 封装电路的管道和导管端子以及其他突起，包括具有尖锐点，刀刃等的元件。 然后将该底涂层干燥，随后可以通过将干燥的工件浸入聚甲基丙烯酸甲酯与丙烯酸乙酯/甲基丙烯酸甲酯的共聚物的混合物中而形成的一个或多个浸渍涂层。

公开(公告)号：US3625763A

公开(公告)日：1971-12-07

申请号：US3625763D

申请日：1968-12-04

Applicant: BUNKER RAMO

Inventor： MELILLO MANLIO B

IPC: H05K3/28 ,  B08B7/00 ,  C09D9/00 ,  C23G5/02

CPC classification number: H05K3/288 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/0257 ,  H05K2203/0769 ,  H05K2203/0783

Abstract: A liquid composition for stripping resin coatings such as epoxy embedment or conformal coatings from substrates such as printed circuit boards. The composition is a substantially anhydrous combination of organic liquids comprising on a volume basis above about 60 percent of a halogenated hydrocarbon liquid, a minor amount below 12 percent but above 4 percent of an alcohol and below 5 percent but at least 1 percent of a ketone. The resin coating is contacted with the composition for a period sufficient to loosen and solvate said resin. The removal of the softened resin may be facilitated by brushing.

公开(公告)号：US3515585A

公开(公告)日：1970-06-02

申请号：US3515585D

申请日：1968-04-24

Applicant: IBM

Inventor： CHAMBERLIN JOHN B ,  NOTH RICHARD W

IPC: B05D7/24 ,  C08J3/09 ,  C08L79/08 ,  C09D179/08 ,  H01B3/30 ,  H05K3/28

CPC classification number: C08J3/096 ,  C08J2379/02 ,  C08L79/08 ,  H01B3/306 ,  H01B3/307 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/09872 ,  H05K2203/0759 ,  H05K2203/1105

公开(公告)号：US3179854A

公开(公告)日：1965-04-20

申请号：US10486861

申请日：1961-04-24

Applicant: RCA CORP

Inventor： EDUARD LUEDICKE ,  HARRY REINIG

IPC: H05K1/02 ,  H05K1/05 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/0221 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/09809 ,  H05K2201/09872 ,  H05K2201/09981

公开(公告)号：EP3300469A1

公开(公告)日：2018-03-28

申请号：EP17176262.8

申请日：2017-06-15

Applicant: Nano Shield Technology Co., Ltd.

Inventor： Cheng Lee, James

IPC: H05K3/28

CPC classification number: H05K3/285 ,  C23C14/08 ,  C23C18/1212 ,  C23C18/1216 ,  C23C18/1254 ,  C23C18/1266 ,  H05K1/0306 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09872 ,  H05K2203/0759 ,  H05K2203/0783

Abstract: A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating.

Abstract translation: 一种方法包括以下步骤：在物体上形成内涂层并形成与内涂层接触的外涂层。 将包含金属氧化物纳米粒子和第一溶剂的第一溶液施加到物体上。 除去第一溶剂以形成具有金属氧化物纳米颗粒的内涂层。 将具有二氧化硅纳米粒子和第二溶剂的第二溶液施加到物体上。 除去第二溶剂以形成具有二氧化硅纳米颗粒的外涂层。 然后例如通过向内涂层和外涂层施加诸如水，乙醇或其混合物的第三溶液来增强金属氧化物纳米粒子与二氧化硅纳米粒子之间的界面结合力。