公开(公告)号：US08673050B2

公开(公告)日：2014-03-18

申请号：US12850950

申请日：2010-08-05

Applicant: Seiki Sakuyama ,  Taiji Sakai

Inventor： Seiki Sakuyama ,  Taiji Sakai

IPC: B22F1/02 ,  H01B1/02 ,  H01B1/22

CPC classification number: H05K1/115 ,  H01B1/026 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/462 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2224/0401

Abstract: A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

Abstract translation: 导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

公开(公告)号：US08506850B2

公开(公告)日：2013-08-13

申请号：US13262326

申请日：2010-03-17

Applicant: Taku Sasaki ,  Hiroshi Natsui

Inventor： Taku Sasaki ,  Hiroshi Natsui

IPC: H01B1/02 ,  H01B1/22 ,  B32B5/16 ,  B05D7/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure.The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

Abstract translation: 本发明提供能够抑制保存期间的黑化现象的导电性微粒，从而提供高连接可靠性; 含有导电性细颗粒的各向异性导电材料; 和连接结构。 具有基础细颗粒的导电颗粒以及在基体细颗粒的表面上按顺序形成的导电层和低熔点金属层，其中低熔点金属层具有算术平均值 表面粗糙度为50nm以下。

公开(公告)号：US08395052B2

公开(公告)日：2013-03-12

申请号：US12975421

申请日：2010-12-22

Applicant: Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

Inventor： Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC: H05K1/09

CPC classification number: H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract translation: 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。

公开(公告)号：US20120100374A1

公开(公告)日：2012-04-26

申请号：US13335846

申请日：2011-12-22

Applicant: Alfred A. ZINN

Inventor： Alfred A. ZINN

IPC: B32B5/16 ,  B23K1/20 ,  B23K26/22 ,  B22F9/16 ,  B05D5/12 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并且具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US08153030B2

公开(公告)日：2012-04-10

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

Inventor： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

IPC: H01B1/22

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US08119206B2

公开(公告)日：2012-02-21

申请号：US12437263

申请日：2009-05-07

Applicant: Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundolf ,  Jon Alfred Casey

Inventor： Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundolf ,  Jon Alfred Casey

IPC: B05D1/36

CPC classification number: H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

Abstract: A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.

Abstract translation: 形成负系数的热膨胀粒子的方法包括使由第一材料制成的中空球平坦化，在高于预定最大使用温度的基准温度下退火扁平空心球以设定扁平中空球的应力最小值，以及形成 在参考温度下在平坦的中空球体上由第二材料制成的涂层，第二材料具有比第一材料的热膨胀系数低的热膨胀系数，其特征在于加热时的体积收缩。

公开(公告)号：US20110183128A1

公开(公告)日：2011-07-28

申请号：US13000415

申请日：2009-06-23

Applicant: Shlomo Magdassi ,  Michael Grouchko ,  Alexander Kamyshny

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Alexander Kamyshny

IPC: C09D11/02 ,  B32B3/10 ,  B05D5/00 ,  B05D3/02 ,  B05D3/10 ,  B82Y30/00

CPC classification number: B22F1/0022 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/02 ,  B22F1/025 ,  B22F9/18 ,  B22F9/24 ,  B22F2001/0092 ,  B22F2301/10 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/322 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0218 ,  Y10T428/24901

Abstract: Provided is a composition including a plurality of multi-metallic nanoparticles each consisting essentially of a core including at least one first metal (Me1) and a continuous shell including atoms of at least one second metal (Me2). Optionally, the continuous shell of Me2 atoms protects the Me1 atoms from oxidation at all temperatures less than 150° C.

Abstract translation: 提供了包含多个多金属纳米颗粒的组合物，其各自主要由包含至少一种第一金属（Me1）的核和包含至少一种第二金属（Me 2）的原子的连续壳组成。 任选地，Me2原子的连续壳保护Me1原子在小于150℃的所有温度下的氧化。

公开(公告)号：US20110120759A1

公开(公告)日：2011-05-26

申请号：US13017544

申请日：2011-01-31

Applicant: Shigenobu SEKINE ,  Yurina SEKINE ,  Yoshiharu KUWANA

Inventor： Shigenobu SEKINE ,  Yurina SEKINE ,  Yoshiharu KUWANA

IPC: H05K1/09

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/4038 ,  H05K3/4061 ,  H05K3/4614 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/083 ,  H05K2203/0285 ,  H05K2203/104 ,  H05K2203/128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.

Abstract translation: 电路板包括基板，电路图案和通孔电极。 电路图案沿其厚度方向设置在基板的一侧。 通孔电极填充在形成在基板中的通孔中，其一端连接到电路图案。 电路图案和贯通电极各自具有含有贵金属成分（例如Au成分）的区域，并且通过其彼此连接。

公开(公告)号：US20110031449A1

公开(公告)日：2011-02-10

申请号：US12851829

申请日：2010-08-06

Applicant: Nana Enomoto ,  Kunihiko Akai

Inventor： Nana Enomoto ,  Kunihiko Akai

IPC: H01B1/22 ,  B32B5/16

CPC classification number: H01B1/02 ,  H05K3/321 ,  H05K2201/0218 ,  Y10T428/2991

Abstract: The invention provides conductive fine particles with a satisfactory monodisperse property, low cost, resistance to migration and excellent conductivity. Conductive fine particles having core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface, wherein the phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A, the phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.

Abstract translation: 本发明提供具有满意的单分散性，低成本，耐迁移性和优异的导电性的导电性细颗粒。 具有涂覆有含有镍和磷的金属镀覆膜层的核心颗粒表面的导电性微粒和包含钯层作为外表面的多层导电层，其中金属镀膜层的区域A中的磷含量， 与核心颗粒表面的整个金属镀覆膜层的厚度不超过20％的距离为整个区域A的7-15重量％，金属的区域B中的磷含量 在钯层侧的镀金属镀膜层的表面的整个金属镀膜层的厚度不大于10％的距离为0.1-3重量％ 的整个区域B，并且整个金属镀膜层的磷含量为7重量％以上。

公开(公告)号：US07785500B2

公开(公告)日：2010-08-31

申请号：US12092453

申请日：2006-10-31

Applicant: Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

Inventor： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC: H01B1/22 ,  C09J9/02

CPC classification number: C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

Abstract translation: 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。