公开(公告)号：US20060226115A1

公开(公告)日：2006-10-12

申请号：US11449349

申请日：2006-06-08

Applicant: Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

Inventor： Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

IPC: C09K13/00 ,  C09K13/06 ,  C23F1/00

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

公开(公告)号：US06946027B2

公开(公告)日：2005-09-20

申请号：US10782177

申请日：2004-02-17

Applicant: Roger F. Bernards ,  Joseph Stanton Bowers, Jr. ,  Benjamin T. Carroll ,  Alvin A. Kucera

Inventor： Roger F. Bernards ,  Joseph Stanton Bowers, Jr. ,  Benjamin T. Carroll ,  Alvin A. Kucera

IPC: B05D1/18 ,  B05D3/00 ,  B32B38/00 ,  C23C22/52 ,  C23F1/18 ,  H05K3/28 ,  H05K3/38 ,  C09K13/00 ,  B05D3/10 ,  C09K13/06

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract translation: 本发明涉及一种用于提供适于随后的多层层压的耐化学腐蚀的粗糙铜表面的方法和组合物。 在一个实施方案中，光滑的铜表面在有效提供粗糙的铜表面的条件下与促粘合组合物接触，该粘合促进组合物包含氧化剂，pH调节剂，形貌改性剂和含硫涂料稳定剂。 在另一个实施方案中，在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，所述粘合促进组合物包含氧化剂，pH调节剂和形貌改性剂。 然后，在随后的步骤中，将粗糙化的铜表面与耐酸性促进组合物接触。

公开(公告)号：US20050064159A1

公开(公告)日：2005-03-24

申请号：US10935266

申请日：2004-09-08

Applicant: Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

Inventor： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

IPC: C08J5/24 ,  B32B7/02 ,  C08K3/00 ,  C08K5/01 ,  C08K5/02 ,  C08K5/03 ,  C08K5/521 ,  C08L101/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  B32B15/08

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract translation: 提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1各自为氢 原子或烃基，R 2，R 3和R 4各自为氢原子或烷基，m为1〜4的整数，n为2以上的整数， 至少一种高分子量化合物，无机填料和至少一种用于所述无机填料的处理剂; 其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

公开(公告)号：US06841189B2

公开(公告)日：2005-01-11

申请号：US10113040

申请日：2002-04-01

Applicant: Eric Alexander Meulenkamp ,  Maria Jeanne Schroevers

Inventor： Eric Alexander Meulenkamp ,  Maria Jeanne Schroevers

IPC: C25D3/38 ,  C25D5/10 ,  C25D5/34 ,  C25D7/04 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12 ,  B05D3/00 ,  C25D5/02

CPC classification number: H01L21/76868 ,  C25D3/38 ,  C25D5/34 ,  C25D7/123 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76877 ,  H05K3/388 ,  H05K3/389 ,  H05K3/423 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09563

Abstract: The invention provides for a back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent galvanic deposition of the said copper, and wherein subsequent to the formation of the plating base, but prior to the galvanic deposition of the copper, a modifying agent is introduced to the recess and which serves to absorb in the surface regions not covered by the plating base and to thereby modify the surface to promote copper growth thereon so as to effectively repair the initial plating base before the copper plating fill commences.

Abstract translation: 本发明提供了一种后端金属化工艺，其中凹部填充有铜，并且其包括在凹部的表面上形成电镀基底以用于随后的所述铜的电沉积的步骤，并且其中在形成之后 的电镀基底，但是在电镀铜之前，将改性剂引入到凹部中，用于在未被电镀基底覆盖的表面区域中吸收，从而改变表面以促进其上的铜生长 以便在镀铜开始之前有效地修复初始镀层。

公开(公告)号：US20040256731A1

公开(公告)日：2004-12-23

申请号：US10465155

申请日：2003-06-19

Inventor： Guoping Mao ,  Shichun Qu ,  Fuming B. Li ,  Robert S. Clough ,  Nelson B. O'Bryan

IPC: H01L023/48

CPC classification number: C08L65/00 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  H01L2924/00

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract translation: 含有增韧的苯并环丁烯树脂和至少约50重量％的无机填料的介电复合材料。 还有具有至少一个导电层和至少一层介电复合材料的电子封装。 介电复合材料的介电常数可以小于约3.5，介电损耗小于约0.004。

公开(公告)号：US20040228778A1

公开(公告)日：2004-11-18

申请号：US10625261

申请日：2003-07-23

Inventor： Shobha Murari ,  Richard G. Adams ,  H. Landis Carter

IPC: B32B017/10

CPC classification number: C08J5/08 ,  C03C25/40 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2201/0239 ,  Y10T428/249948 ,  Y10T428/249969 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T442/2992

Abstract: A composition and method for selectively increasing the resin flow and gel time of an epoxy resin that fills the capillary region between filaments in fiberglass yarns making up a woven fabric. The composition and method are used in the lamination of fiberglass reinforced composites such as copper clad laminates for circuit boards and reduces the occurrence of voids in the capillary region.

Abstract translation: 用于选择性地增加填充构成机织织物的玻璃纤维纱中长丝之间的毛细管区域的环氧树脂的树脂流动和凝胶时间的组合物和方法。 组合物和方法用于层压玻璃纤维增​​强复合材料，例如用于电路板的铜包覆层压板，并减少毛细管区域中空隙的发生。

公开(公告)号：US06623844B2

公开(公告)日：2003-09-23

申请号：US10083691

申请日：2002-02-25

Applicant: Akihiko Nishimoto

Inventor： Akihiko Nishimoto

IPC: B32B700

CPC classification number: H05K3/4617 ,  H05K3/20 ,  H05K3/389 ,  H05K3/4069 ,  H05K2201/0239 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/31663 ,  Y10T428/31692

Abstract: Disclosed is a multi-layer wiring board comprising insulating layers of a thermosetting resin having through-holes formed therein, conductor wiring layers buried in the surfaces of said insulating layers, and via-conductors formed by filling said through-holes with an electrically conducting paste, the via-conductors being electrically connected to said conductor wiring layers, wherein coupling layers comprising a silane coupling agent are formed in the interfaces between said conductor wiring layers and said via-conductors or said insulating layers. The multi-layer wiring board features an increased chemical affinity between the conductor wiring layer and the insulating layer, effectively suppressing the infiltration of water through the interface between the conductor wiring layer and the insulating layer or through the insulating resin, and effectively preventing deterioration in the properties under a high-temperature and high-humidity environment of an extended period of time.

公开(公告)号：US20030144381A1

公开(公告)日：2003-07-31

申请号：US10307282

申请日：2002-12-02

Applicant: Mitsui Chemicals, Inc.

Inventor： Yasushi Mizuta ,  Tatsuji Murata ,  Makoto Nakahara ,  Takatoshi Kira ,  Daisuke Ikesugi

IPC: C08K003/00

CPC classification number: H01L24/83 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L23/49883 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2203/122 ,  Y02P20/582 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract translation: 用于电路连接和各向异性导电浆料的浆料具有优异的储存稳定性和分配器应用性能，可以在热压接上没有空隙，气泡和渗色，并且可以在高温和高湿度下产生具有高粘结和连接可靠性的固化产物，以及 修复能力。 电路连接用糊剂包含环氧树脂，酸酐固化剂或酚类固化剂，高软化点微粒。 各向异性导电膏还含有导电颗粒。 使用糊料进行电路连接或各向异性导电膏的方法包括将形成在基板上的电路布线与形成在另一基板上的电路布线用电路连接用糊剂或各向异性导电浆料进行连接。

公开(公告)号：US06403201B1

公开(公告)日：2002-06-11

申请号：US09626729

申请日：2000-07-27

Applicant: Tadashi Otagiri ,  Hisayoshi Nonaka ,  Yoshitaka Tabuchi ,  Tomio Suzuki

Inventor： Tadashi Otagiri ,  Hisayoshi Nonaka ,  Yoshitaka Tabuchi ,  Tomio Suzuki

IPC: B32B300

CPC classification number: H05K3/4046 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0235 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: There is provided a substrate material for wiring having an excellent thermal resistance, and durability and reliability under severe conditions, characterized in that said substrate material comprises an insulator whose major component is composed of epoxy resin and ceramics having a thermal expansion coefficient of 2 ppm/° C. or less, and that the thermal expansion coefficient is isotropic.

Abstract translation: 本发明提供一种具有良好耐热性，耐苛性条件下的耐久性和可靠性的布线用基板材料，其特征在于，所述基板材料包括主要成分由环氧树脂和热膨胀系数为2ppm / ℃以下，热膨胀系数为各向同性。

公开(公告)号：US06238597B1

公开(公告)日：2001-05-29

申请号：US09506708

申请日：2000-02-18

Applicant: Myung Jin Yim ,  Kyung Wook Paik

Inventor： Myung Jin Yim ,  Kyung Wook Paik

IPC: H01B122

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01L24/27 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/07811 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/10674 ,  H01L2924/00

Abstract: Disclosed is a method of preparing anisotropic conductive adhesives for flip chip interconnection on organic substrates, in which an epoxy resin as a binder is mixed with a conductive material and a non-conductive material at room temperature for 3 hours and then, with a coupling agent and a curing agent at room temperature for 1 hour. The anisotropic conductive adhesives are endowed with the electrical conductivity of conventional anisotropic conductive films and the mechanical reliability of an underfill used in a solder flip chip, simultaneously. The ACA shows fast hardenability and excellent coating and screening properties. The adhesive is spread over a plastic printed circuit board into which a flip chip is then brought. The flip chip and the plastic substrate can be bonded to each other using heat and pressure. Also, it is applicable for low-price flip chips and chip size packaging as well as for relevant-assembly packaging.

Abstract translation: 公开了一种制备用于有机衬底上的倒装芯片互连的各向异性导电粘合剂的方法，其中作为粘合剂的环氧树脂在室温下与导电材料和非导电材料混合3小时，然后用偶联剂 和固化剂在室温下1小时。 各向异性导电粘合剂同时具有常规各向异性导电膜的导电性和焊料倒装芯片中使用的底部填充材料的机械可靠性。 ACA显示出快速淬透性和优异的涂层和筛选性能。 粘合剂分布在塑料印刷电路板上，然后将倒装芯片带入其中。 倒装芯片和塑料基板可以使用热和压力彼此接合。 此外，它适用于低价格倒装芯片和芯片尺寸封装以及相关组装封装。