公开(公告)号：US11784115B2

公开(公告)日：2023-10-10

申请号：US17444266

申请日：2021-08-02

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Roland Wilfing

IPC: H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H05K1/0271 ,  H05K1/11 ,  H05K1/0204 ,  H05K1/0206 ,  H05K2201/041 ,  H05K2201/06 ,  H05K2201/096 ,  H05K2201/09827

Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.

公开(公告)号：US09986631B2

公开(公告)日：2018-05-29

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L23/053 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H05K1/11 ,  H05K3/10 ,  H05K7/14 ,  H05K13/00 ,  H01L23/24 ,  H01L23/36 ,  H01L23/473 ,  H01L23/492

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

公开(公告)号：US09867292B2

公开(公告)日：2018-01-09

申请号：US15371212

申请日：2016-12-07

Applicant: HONDA MOTOR CO., LTD.

Inventor： Hironori Ujike ,  Atsushi Kurauchi

IPC: H05K7/00 ,  H05K1/18 ,  H05K5/03 ,  H05K7/20

CPC classification number: H05K1/181 ,  H05K1/0287 ,  H05K1/029 ,  H05K5/03 ,  H05K7/20409 ,  H05K7/20854 ,  H05K2201/06

Abstract: A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

公开(公告)号：US09705059B2

公开(公告)日：2017-07-11

申请号：US15156030

申请日：2016-05-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok Park

IPC: H01L23/053 ,  H01L29/267 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H01L33/40 ,  H01L33/56 ,  H01L33/58 ,  H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  F21K9/00 ,  H01L33/52 ,  H05K1/05 ,  H05K1/18 ,  H05K3/24

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

公开(公告)号：US20170181335A1

公开(公告)日：2017-06-22

申请号：US15327107

申请日：2015-09-18

Applicant: Panasomic Intellectual Property Management Co., Ltd.

Inventor： TOMOHIKO ITOU

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0203 ,  H05K1/181 ,  H05K9/0026 ,  H05K9/0028 ,  H05K2201/06 ,  H05K2201/10371

Abstract: A shield cover includes a cover body that is formed of a metal plate and for covering an electronic component, a leaf spring formed by cutting a part of the cover body, and a projection that is disposed on the leaf spring and projects in the thickness direction of the leaf spring.

公开(公告)号：US20170164465A1

公开(公告)日：2017-06-08

申请号：US15325550

申请日：2015-06-17

Applicant: Siemens Aktiengesellschaft

Inventor： Ruediger Knofe ,  Bernd Mueller ,  Andrey Prihodovsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/0212 ,  H05K1/095 ,  H05K1/11 ,  H05K1/167 ,  H05K3/30 ,  H05K3/321 ,  H05K3/325 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/06 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1115 ,  H05K2203/165

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

公开(公告)号：US20170094771A1

公开(公告)日：2017-03-30

申请号：US15272201

申请日：2016-09-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koji Noguchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10545

Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

公开(公告)号：US20170064808A1

公开(公告)日：2017-03-02

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K1/02 ,  H05K13/00 ,  H05K3/10 ,  H05K1/11 ,  H01L23/00 ,  H01L25/18 ,  H01L23/367 ,  H01L23/492 ,  H01L23/34 ,  H01L25/00 ,  H01L23/08 ,  H01L23/053 ,  H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Abstract translation: 一种电子电源模块，包括容纳堆叠的壳体，其包括：DBC型等的第一衬底; 集成了具有一个或多个导电端子的电子部件，机电和热耦合到第一基板; 以及DBC型等的第二基板，其在第一基板上延伸并且在模具上方并且呈现面向模具的导电路径。 模具通过烧结的导热浆的第一耦合区域机械地和热耦合到第一衬底，并且电子部件的一个或多个导电端子通过机械，电和热耦合到第二衬底的导电路径，由 烧结导热浆的第二耦合区域。

公开(公告)号：US09402301B2

公开(公告)日：2016-07-26

申请号：US14565744

申请日：2014-12-10

Applicant: Raytheon Company

Inventor： Waid Paine ,  James S. Wilson ,  Cary C. Kyhl ,  Robert S. Isom

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01R12/72

CPC classification number: H05K1/0204 ,  H01Q21/0025 ,  H01R12/72 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/183 ,  H05K7/20509 ,  H05K2201/06 ,  H05K2201/09036 ,  H05K2201/10098

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 衬底，其布置在所述散热器的表面上，使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面，并为设置在基板中的发热电路提供热路径。

公开(公告)号：US09362469B2

公开(公告)日：2016-06-07

申请号：US14975030

申请日：2015-12-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok Park

IPC: H01L23/053 ,  H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/40

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.