公开(公告)号：US20160100494A1

公开(公告)日：2016-04-07

申请号：US14504948

申请日：2014-10-02

Applicant: Honeywell International Inc.

Inventor： Peter Novysedlak ,  Ondrej Hajek ,  Martin Konecny ,  Milan Vasicek

IPC: H05K5/02 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K5/0239 ,  B81B7/0032 ,  G01D3/028 ,  G01D11/245 ,  G01P1/023 ,  H05K1/0212 ,  H05K5/0013 ,  H05K5/0213 ,  H05K2201/06

Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

Abstract translation: 提供了用于热稳定电路板上的温度敏感元件的外壳。 外壳包括构造成安装在电路板的第一侧的至少一个温度敏感元件的一部分上的第一盖部分。 第一盖部分包括第一盖和从第一盖的周边延伸的至少一个侧壁。 外壳还包括第二盖部分，其构造成安装在与第一盖部分相对的电路板的第二侧的一部分上。 第二盖部分包括第二盖，以及从第二盖的周边延伸的至少一个侧壁。 第一和第二盖部被构造成可释放地与电路板连接。

公开(公告)号：US20160021787A1

公开(公告)日：2016-01-21

申请号：US14387451

申请日：2013-09-23

Applicant: TELLABS OPERATIONS, INC.

Inventor： Zhen Lei ,  Qinzhen Ba ,  Zongxian Duan ,  Huihui Yu

IPC: H05K7/20 ,  B23P15/26 ,  H05K1/02

CPC classification number: H05K7/20409 ,  B23P15/26 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/06 ,  H01L2924/00

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

Abstract translation: 一种用于散热器组件的装置和系统，以及用于形成散热器组件的步骤。 散热器组件包括散热器，散热器具有从基座延伸的基部和翅片，以及布置在散热片之间的散热片上的弹簧夹。 弹簧夹包括相对于散热器的底部形成第一角度并且包括相对于散热器的底部形成第二角度的第二突出部的第一突出部。 第一和第二突片连接到电路板。 因此，提供了与传统布置相比节省空间并且允许电路板上的更高密度的笼子的保持架的散热器附件。

公开(公告)号：US09240534B2

公开(公告)日：2016-01-19

申请号：US14507560

申请日：2014-10-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok Park

IPC: H01L23/053 ,  H01L33/60 ,  H01L33/62 ,  F21K99/00 ,  H01L33/52 ,  H01L33/64 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/24

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.

Abstract translation: 发光封装，包括基底; 基底上的发光器件; 电连接到所述发光装置的电路层; 由透光材料形成的光学构件; 以及引导构件，所述引导构件引导所述光学构件，所述引导构件包括开口，设置在所述基座的最上表面上的第一部分和连接到所述光学构件的边缘部分的第二部分。 引导构件的第一部分定位成高于光学构件的底表面，基座的最上表面比引导构件的第二部分更靠近引导构件的第一部分，并且引导构件的边缘部分 光学构件比引导构件的第一部分更靠近引导构件的第二部分。

公开(公告)号：US20150107882A1

公开(公告)日：2015-04-23

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20150047882A1

公开(公告)日：2015-02-19

申请号：US14380981

申请日：2013-02-26

Applicant: APPLIED NANOTECH HOLDINGS, INC.

Inventor： Nan Jiang ,  Zvi Yaniv

IPC: H05K1/05 ,  H05K1/02 ,  H05K3/12 ,  H05K1/09

CPC classification number: H05K1/053 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/181 ,  H05K3/12 ,  H05K2201/0104 ,  H05K2201/0137 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/10106 ,  H01L2924/00 ,  C04B35/522 ,  C04B41/4539 ,  C04B41/5001 ,  C04B41/5031 ,  C04B41/5089 ,  C04B41/5059 ,  C04B41/5092 ,  C04B41/522 ,  C04B41/5063 ,  C04B41/5064 ,  C04B41/4535 ,  C04B41/4572 ,  C04B41/5127

Abstract: Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.

Abstract translation: 不同种类的印刷浆料或油墨被用于各种组合以在石墨基材上形成多个陶瓷电介质层，以便产生有效的介电陶瓷层，其与石墨基材和印刷的铜迹线具有良好的粘合性，并具有很强的绝缘性能。 糊剂或油墨可以包含高导热性粉末。

公开(公告)号：US20150021645A1

公开(公告)日：2015-01-22

申请号：US14507560

申请日：2014-10-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok PARK

IPC: H01L33/60 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.

Abstract translation: 发光封装，包括基底; 基底上的发光器件; 电连接到所述发光装置的电路层; 由透光材料形成的光学构件; 以及引导构件，所述引导构件引导所述光学构件，所述引导构件包括开口，设置在所述基座的最上表面上的第一部分和连接到所述光学构件的边缘部分的第二部分。 引导构件的第一部分定位成高于光学构件的底表面，基座的最上表面比引导构件的第二部分更靠近引导构件的第一部分，并且引导构件的边缘部分 光学构件比引导构件的第一部分更靠近引导构件的第二部分。

公开(公告)号：US20110266582A1

公开(公告)日：2011-11-03

申请号：US13182389

申请日：2011-07-13

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L33/58

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.

Abstract translation: 一种半导体发光封装，包括具有平坦部分的顶表面的基座，该基部成形为大致圆形; 基底上的多个半导体发光器件; 电连接到所述多个半导体发光器件的电路层; 在基座上的多个屏幕构件; 以及多个由透光材料形成的光学部件，使得从至少一个半导体发光器件发射的光通过其中，其中每个屏蔽部件具有围绕至少一个半导体发光器件的开口，每个 筛部件的开口成形为大致圆形，基部的直径大于筛部件的开口直径，并且光学部件的边缘部分与一个筛网部件接触。

公开(公告)号：US07821020B2

公开(公告)日：2010-10-26

申请号：US10578150

申请日：2005-07-21

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: H01L29/227

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a metal base, an electrical circuit layer provided at an upper side of the metal base for providing a conductive path, a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base, an insulating layer sandwiched between the metal base and the electrical circuit layer, an electrode layer provided at an upper side of the electrical circuit layer, and a wire for electrically connecting the electrode layer and the light emitting device. The light emitting device package has improved light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract translation: 发光器件包括金属基底，设置在金属基底的上侧的用于提供导电路径的电路层，安装在具有比金属基底上的第一区域更小的厚度的第二区域中的发光器件， 夹在金属基底和电路层之间的绝缘层，设置在电路层上侧的电极层和用于电连接电极层和发光器件的导线。 发光器件封装具有改善的发光效率，因为发光器件被放置在金属基底的小厚度部分上。

公开(公告)号：US20230141729A1

公开(公告)日：2023-05-11

申请号：US17906890

申请日：2021-03-30

Applicant: Denka Company Limited

Inventor： Yoshitaka MINAKATA ,  Yusuke WAKUDA ,  Shinya SAKAGUCHI ,  Tomoya YAMAGUCHI ,  Koji NISHIMURA

IPC: C04B41/48 ,  C04B35/583 ,  C04B35/64 ,  C04B35/63 ,  C04B41/00 ,  C04B41/83 ,  H05K1/03

CPC classification number: C04B41/4853 ,  C04B35/583 ,  C04B35/64 ,  C04B35/6303 ,  C04B41/0072 ,  C04B41/83 ,  H05K1/0353 ,  C04B2235/386 ,  C04B2235/3856 ,  C04B2235/3409 ,  C04B2235/442 ,  C04B2235/612 ,  C04B2235/652 ,  H05K2201/06

Abstract: Provided is a method for manufacturing a composite body, the method including: a nitriding step of firing a boron carbide powder in a nitrogen atmosphere to obtain a fired product containing boron carbonitride; a sintering step of molding and heating a blend containing the fired product and a sintering aid to obtain a boron nitride sintered body including boron nitride particles and pores; and an impregnating step of impregnating the boron nitride sintered body with a resin composition, the composite body having the boron nitride sintered body and a resin filled in at least some of the pores of the boron nitride sintered body.

公开(公告)号：US20180235074A1

公开(公告)日：2018-08-16

申请号：US15861676

申请日：2018-01-04

Applicant: Amazing Cool Technology Corp

Inventor： Yang-Ming SHIH ,  Hung-Yun Hsu

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/09781

Abstract: A radiative cooling structure for a printed circuit includes a circuit board and a cooling structure. A printed circuit is disposed on the circuit board. The printed circuit includes a plurality of printed leads and a thermal conductive area. The printed leads are connected to the thermal conductive area. A cooling structure covers the thermal conductive area. The cooling structure covers the thermal conductive area, and the cooling structure incudes a thermal radiation layer. Heat generated by heat sources on the circuit board is transferred to the thermal conductive area via the printed circuit. The cooling structure radiates the heat into surrounding space by radiation.