公开(公告)号：EP3258749A1

公开(公告)日：2017-12-20

申请号：EP17165188.8

申请日：2017-04-06

Applicant: Miyoshi Electronics Corporation

Inventor： MORI, Kazuhito

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/18

CPC classification number: H01L23/5386 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/32 ,  H01L25/072 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/181 ,  H05K3/4053 ,  H05K2201/09554 ,  H05K2203/049

Abstract: There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus (1) includes a dielectric substrate (10), an electronic component (61, 62), a heat spreader (15), and a conductive via (50). The conductive via (50) electrically and thermally connects the electronic component (61, 62) and the heat spreader (15). The conductive via (50) extends from the first surface (11) to at least an interior of the heat spreader (15) and is in surface-contact with the heat spreader (15).

Abstract translation: 提供一种电子电路装置，其中电子部件产生的热量可以有效地传递到散热器。 电子电路装置（1）包括电介质基板（10），电子部件（61,62），散热器（15）以及导电孔（50）。 导电通孔（50）将电子部件（61,62）和散热器（15）电和热连接。 导电通孔（50）从第一表面（11）延伸到散热器（15）的至少内部并且与散热器（15）表面接触。

公开(公告)号：EP1671524B1

公开(公告)日：2015-11-04

申请号：EP04784579.7

申请日：2004-09-17

Applicant: Motorola Solutions, Inc.

Inventor： WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

公开(公告)号：EP1395100B1

公开(公告)日：2011-06-15

申请号：EP02405740.8

申请日：2002-08-29

Applicant: Asetronics AG

Inventor： Weber, Walter ,  Rappo, Paul

IPC: H05K3/44 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4084 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/44 ,  H05K3/4652 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/085 ,  H05K2203/1147 ,  H05K2203/1536

公开(公告)号：EP1675175B1

公开(公告)日：2010-05-19

申请号：EP05026073.6

申请日：2005-11-30

Applicant: NITTO DENKO CORPORATION

Inventor： Ohwaki, Yasuhito

IPC: H01L23/495

CPC classification number: H05K1/111 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09554 ,  H05K2201/09845 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wired circuit board that can produce excellent heat radiation characteristics even when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. The base opening portion 8 and the thin layer portion 9 to surround the base opening portion 8 are formed in a portion of the insulating base layer 3 corresponding to the mounting portion 7. Also, the inside terminal portions 15 of the terminal portions 13 are disposed on the thin layer portions 9 and the heat radiating portions 17 contacting with the stiffener sheet 2 are formed in the base opening portion 8. As a result of this, the surface of the inside terminal portion 15 is located lower in level than the surface of the heat radiating portion 17. This can allow the semiconductor device S mounted via the bumps 25 and the heat radiating portion 17 to be located close to each other. This can provide the result that the semiconductor device S can be reliably mounted on the wired circuit board 1 by the flip chip mounting method, while also the heat generated from the semiconductor device S can be transferred to the stiffener sheet 2 effectively via the heat radiating portion 17. This can provide improved heat radiating ability of the wired circuit board.

公开(公告)号：EP2184957A1

公开(公告)日：2010-05-12

申请号：EP09252576.5

申请日：2009-11-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Naitou, Toshiki ,  Honjo, Mitsuru

IPC: H05K1/02 ,  H05K3/46 ,  G11B5/48

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/06 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract translation: 第一写入布线图案的第一行的末端和第二行的末端布置在第二写入布线图案的第三行的两侧。 在第一行和第二行的末端提供圆形连接部分。 另外，在连接部分下方的基底绝缘层的各个部分中形成通孔。 每个连接部分与通孔内的悬挂体的连接区域接触。

公开(公告)号：EP1675175A3

公开(公告)日：2008-09-10

申请号：EP05026073.6

申请日：2005-11-30

Applicant: NITTO DENKO CORPORATION

Inventor： Ohwaki, Yasuhito

IPC: H01L23/495

CPC classification number: H05K1/111 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09554 ,  H05K2201/09845 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wired circuit board that can produce excellent heat radiation characteristics even when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. The base opening portion 8 and the thin layer portion 9 to surround the base opening portion 8 are formed in a portion of the insulating base layer 3 corresponding to the mounting portion 7. Also, the inside terminal portions 15 of the terminal portions 13 are disposed on the thin layer portions 9 and the heat radiating portions 17 contacting with the stiffener sheet 2 are formed in the base opening portion 8. As a result of this, the surface of the inside terminal portion 15 is located lower in level than the surface of the heat radiating portion 17. This can allow the semiconductor device S mounted via the bumps 25 and the heat radiating portion 17 to be located close to each other. This can provide the result that the semiconductor device S can be reliably mounted on the wired circuit board 1 by the flip chip mounting method, while also the heat generated from the semiconductor device S can be transferred to the stiffener sheet 2 effectively via the heat radiating portion 17. This can provide improved heat radiating ability of the wired circuit board.

公开(公告)号：EP1570496B1

公开(公告)日：2008-05-14

申请号：EP03721372.5

申请日：2003-03-14

Applicant: Bourns, Inc.

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

IPC: H01C1/14 ,  H01C7/02

CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

公开(公告)号：EP1718785A2

公开(公告)日：2006-11-08

申请号：EP05723158.1

申请日：2005-02-16

Applicant: Tyco Printed Circuit Group LP

Inventor： STRUBBE, John, L.

IPC: C23C18/18 ,  C23C18/31

CPC classification number: C23C18/31 ,  C23C18/1653 ,  C23C18/1844 ,  C23C22/66 ,  C23F1/20 ,  C23G1/125 ,  C25D5/44 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/09554

Abstract: This invention is a zincating process of aluminum surfaces for subsequent plating in which the aluminum surfaces are cleaned, contacted with an acidic etching solution comprising a peroxygen compound, the acidic etching solution being substantially free of corrosive nitrate compounds, and contacting the aluminum surfaces with a zincate solution containing 6-60 g/1 zinc and 100-500 g/1 hydroxide ion. The acidic etching solution is substantially free of toxic inorganic fluoride compounds in order to simplify waste treatment. This invention may be understood with reference to Figure 2, in particular Step 6.

公开(公告)号：EP1675175A2

公开(公告)日：2006-06-28

申请号：EP05026073.6

申请日：2005-11-30

Applicant: NITTO DENKO CORPORATION

Inventor： Ohwaki, Yasuhito

IPC: H01L23/495

CPC classification number: H05K1/111 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/13 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09554 ,  H05K2201/09845 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wired circuit board that can produce excellent heat radiation characteristics even when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. The base opening portion 8 and the thin layer portion 9 to surround the base opening portion 8 are formed in a portion of the insulating base layer 3 corresponding to the mounting portion 7. Also, the inside terminal portions 15 of the terminal portions 13 are disposed on the thin layer portions 9 and the heat radiating portions 17 contacting with the stiffener sheet 2 are formed in the base opening portion 8. As a result of this, the surface of the inside terminal portion 15 is located lower in level than the surface of the heat radiating portion 17. This can allow the semiconductor device S mounted via the bumps 25 and the heat radiating portion 17 to be located close to each other. This can provide the result that the semiconductor device S can be reliably mounted on the wired circuit board 1 by the flip chip mounting method, while also the heat generated from the semiconductor device S can be transferred to the stiffener sheet 2 effectively via the heat radiating portion 17. This can provide improved heat radiating ability of the wired circuit board.

Abstract translation: 即使当通过倒装芯片安装方法将半导体器件安装在布线电路板上时，也能够产生优良的散热特性的布线电路板。 围绕基部开口部分8的基部开口部分8和薄层部分9形成在基底绝缘层3的与安装部分7相对应的部分中。而且，端子部分13的内部端子部分15被布置 在基底开口部分8上形成薄层部分9和与加强板2接触的散热部分17.结果，内侧端子部分15的表面位于比表面低的位置 这可以允许经由凸块25和散热部17安装的半导体器件S彼此靠近。 由此，能够通过倒装芯片安装方法将半导体装置S可靠地安装在布线电路基板1上，并且能够将从半导体装置S产生的热量有效地经由散热而传递到加强片2 这可以提供改进的布线电路板的散热能力。

公开(公告)号：EP1671524A2

公开(公告)日：2006-06-21

申请号：EP04784579.7

申请日：2004-09-17

Applicant: MOTOROLA, INC.

Inventor： WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

IPC: H05K7/20

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 一种电路装置（300），包括：具有接地层（336），至少一个器件孔（332）和至少一个焊料孔（334）的衬底（330）; 散热器（310）; 和粘合剂层（320），用于将所述散热器机械地耦合到所述衬底的所述接地层，使得所述衬底器件孔的至少一部分覆盖所述散热器，所述粘合剂层具有至少一个器件孔和至少一种焊料 其中将所述至少一个基板焊料孔与所述至少一个粘合剂层焊料孔对齐并且将所述至少一个基板器件孔与所述至少一个粘合剂层器件孔对准使得焊料在所述散热器和所述散热器之间的预定区域中变湿 衬底的底层。