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公开(公告)号：TWI409970B
公开(公告)日：2013-09-21
申请号：TW096105051
申请日：2007-02-12
Applicant: 渕上密克羅股份有限公司 , FUCHIGAMI MICRO CO., LTD.
Inventor： 上田享 , UEDA, SUSUMU , 大澤健治 , OHSAWA, KENJI , 鶴田克也 , TSURUTA, KATSUYA , 小谷俊明 , KOTANI, TOSHIAKI
IPC: H01L33/00
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
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公开(公告)号：TWI409425B
公开(公告)日：2013-09-21
申请号：TW095135116
申请日：2006-09-22
Applicant: 渕上密克羅股份有限公司 , FUCHIGAMI MICRO CO., LTD.
Inventor： 大沢健治 , OHSAWA, KENJI , 鶴田克也 , TSURUTA, KATSUYA
IPC: F28D15/04 , H01L23/427 , B23P15/26
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公开(公告)号：TW200817646A
公开(公告)日：2008-04-16
申请号：TW096123746
申请日：2007-06-29
Applicant: 上密克羅股份有限公司 FUCHIGAMI MICRO CO., LTD.
Inventor： 大澤健治 OHSAWA, KENJI , 鶴田克也 TSURUTA, KATSUYA , 有村秀一 ARIMURA, SHUICHI , 小谷俊明 KOTANI, TOSHIAKI
CPC classification number: F28D15/046 , F28D15/0233
Abstract: 本發明之目的係提供,即使在高溫下仍可繼續確實地發揮密封效果,可圖謀較先前更加長壽化之熱管及其製造方法。又,以提供可以提升生產性,以圖謀更加低價化、長壽化之熱管為目的。本發明之熱管1,係於與冷媒注入孔4及空氣排出孔5之週邊區域對向之蒸氣擴散流路44內,上板補强部50、中板補强部52、具有狹縫的補强部55及下板補强部60密著形成支柱構造。藉此於熱管1,將來自壓製機75之外力以上板補强部50、中板補强部52、具有狹縫的補强部55及下板補强部60所構成之支柱構造承受,可防止因該外力使上板2或下板3破損使內部空間10a壓潰。
Abstract in simplified Chinese: 本发明之目的系提供,即使在高温下仍可继续确实地发挥密封效果,可图谋较先前更加长寿化之热管及其制造方法。又,以提供可以提升生产性,以图谋更加低价化、长寿化之热管为目的。本发明之热管1,系于与冷媒注入孔4及空气排出孔5之周边区域对向之蒸气扩散流路44内,上板补强部50、中板补强部52、具有狭缝的补强部55及下板补强部60密着形成支柱构造。借此于热管1,将来自压制机75之外力以上板补强部50、中板补强部52、具有狭缝的补强部55及下板补强部60所构成之支柱构造承受,可防止因该外力使上板2或下板3破损使内部空间10a压溃。
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Patent Agency Ranking
公开(公告)号：TW200802970A
公开(公告)日：2008-01-01
申请号：TW096105051
申请日：2007-02-12
Applicant: 上密克羅股份有限公司 FUCHIGAMI MICRO CO., LTD.
Inventor： 上田享 UEDA, SUSUMU , 大澤健治 OHSAWA, KENJI , 鶴田克也 TSURUTA, KATSUYA , 小谷俊明 KOTANI, TOSHIAKI
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
Abstract: 目的在於提供小型、且可以將來自被冷卻裝置之熱更容易地傳至冷媒並確實地持續冷卻被冷卻裝置而可以安定地維持該被冷卻裝置之動作狀態的加熱管。另外,提供較習知技術更可以提升散熱效果之小型加熱管。在具備延伸至周邊部之蒸氣擴散流路42、與形成於該蒸氣擴散流路42間及凹部對向區域47之毛細管流路41的冷卻部本體25設置厚度薄之凹部6,並於該凹6搭載LED晶片2。藉此,在加熱管5中,由於凹部6僅為薄的部分而使來自LED晶片2之熱變得易於傳至冷媒,並因為該熱而冷媒W之連續的循環現象確實地重複進行的緣故,因此可以藉由冷媒W蒸發之際之潛熱而確實地從LED晶片2奪走熱量,並穩定維持LED晶片2之發光狀態與。
Abstract in simplified Chinese: 目的在于提供小型、且可以将来自被冷却设备之热更容易地传至冷媒并确实地持续冷却被冷却设备而可以安定地维持该被冷却设备之动作状态的加热管。另外,提供较习知技术更可以提升散热效果之小型加热管。在具备延伸至周边部之蒸气扩散流路42、与形成于该蒸气扩散流路42间及凹部对向区域47之毛细管流路41的冷却部本体25设置厚度薄之凹部6,并于该凹6搭载LED芯片2。借此,在加热管5中,由于凹部6仅为薄的部分而使来自LED芯片2之热变得易于传至冷媒,并因为该热而冷媒W之连续的循环现象确实地重复进行的缘故,因此可以借由冷媒W蒸发之际之潜热而确实地从LED芯片2夺走热量,并稳定维持LED芯片2之发光状态与。
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公开(公告)号：EP0989610A3
公开(公告)日：2003-11-12
申请号：EP99118900.2
申请日：1999-09-24
IPC: H01L23/538 , H01L21/48
CPC classification number: H01L23/5384 , H01L21/4857 , H01L23/49861 , H01L23/5383 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H05K1/056 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/44 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/09554 , H05K2201/09563 , H05K2201/0969 , H05K2201/10924 , H05K2203/0554 , H05K2203/0733 , H01L2924/00014 , H01L2924/00
Abstract: A multilayered wiring structure includes a lower wiring layer, an interlevel insulating layer, a filling layer, an upper wiring layer, and a plated layer. The lower wiring layer is formed on a lead frame through an insulating layer. The interlevel insulating layer is formed on the lower wiring layer to have a via hole at a predetermined region thereof to expose an upper portion of the lower wiring layer. The filling layer is made of a conductive material to fill the via hole. The upper wiring layer is formed on the interlevel insulating layer to have an opening above a portion where the via hole is formed. The plated layer is formed on the upper wiring layer to be connected to the filling layer. A method of manufacturing a multilayered wiring structure is also disclosed.
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16.发明公开Multilayered wiring structure and method of manufacturing the same 审中-公开Mehrlagenverdrahtungsstruktur und ihre Herstellung
公开(公告)号：EP0989610A2
公开(公告)日：2000-03-29
申请号：EP99118900.2
申请日：1999-09-24
Applicant: NEC CORPORATION , Fuchigami Micro Co.,Ltd.
IPC: H01L23/538 , H01L21/48
CPC classification number: H01L23/5384 , H01L21/4857 , H01L23/49861 , H01L23/5383 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H05K1/056 , H05K3/423 , H05K3/427 , H05K3/428 , H05K3/44 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/09554 , H05K2201/09563 , H05K2201/0969 , H05K2201/10924 , H05K2203/0554 , H05K2203/0733 , H01L2924/00014 , H01L2924/00
Abstract: A multilayered wiring structure includes a lower wiring layer, an interlevel insulating layer, a filling layer, an upper wiring layer, and a plated layer. The lower wiring layer is formed on a lead frame through an insulating layer. The interlevel insulating layer is formed on the lower wiring layer to have a via hole at a predetermined region thereof to expose an upper portion of the lower wiring layer. The filling layer is made of a conductive material to fill the via hole. The upper wiring layer is formed on the interlevel insulating layer to have an opening above a portion where the via hole is formed. The plated layer is formed on the upper wiring layer to be connected to the filling layer. A method of manufacturing a multilayered wiring structure is also disclosed.
Abstract translation: 多层布线结构包括下布线层，层间绝缘层，填充层，上布线层和镀层。 下布线层通过绝缘层形成在引线框架上。 层间绝缘层形成在下布线层上，以在其预定区域具有通孔以暴露下布线层的上部。 填充层由导电材料制成以填充通孔。 上部布线层形成在层间绝缘层上，在形成通孔的部分上方具有开口。 电镀层形成在上部布线层上，以连接到填充层。 还公开了一种制造多层布线结构的方法。
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公开(公告)号：EP2003703A9
公开(公告)日：2009-04-15
申请号：EP07708068.7
申请日：2007-02-05
Applicant: Fuchigami Micro Co.,Ltd.
Inventor： UEDA, Susumu , OHSAWA, Kenji , TSURUTA, Katsuya , KOTANI, Toshiaki
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.
Abstract translation: 具有延伸到周边部分的蒸气扩散流路42和形成在蒸气扩散流路42之间的凹部与相对的区域47的毛细流路41的冷却单元主体25设置有薄的凹部6， 安装LED芯片2。 因此，来自LED芯片2的热量能够容易地通过与凹部6的变薄相对应的传递，并且由热量重复由制冷剂W引起的连续的循环现象，并且从LED芯片2可靠地抽出热量 通过在制冷剂W蒸发时的潜热，使得热管5能够稳定地保持LED芯片2的发光状态。
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公开(公告)号：EP2003703A2
公开(公告)日：2008-12-17
申请号：EP07708068.7
申请日：2007-02-05
Applicant: Fuchigami Micro Co.,Ltd.
Inventor： UEDA, Susumu , OHSAWA, Kenji , TSURUTA, Katsuya , KOTANI, Toshiaki
CPC classification number: H01L33/64 , F28D15/0233 , F28D15/04 , F28D15/046 , F28F3/086 , H01L24/73 , H01L33/648 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01047 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2924/01005 , H01L2924/01031 , H01L2924/01004 , H01L2924/01033
Abstract: A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.
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